Abstract: A computer system determines an allocation of resources in a task formed of processes. The task includes a transition between processes corresponding to rework. The computer system comprises: at least one predictor configured to calculate predicted values of an inflow amount and an outflow amount of the items of each of the processes forming the task; and a resource allocation determining unit configured to determine an allocation of the resources to each of the processes. The resource allocation determining unit uses the at least one predictor to form a simulator configured to calculate the predicted values of the inflow amount and the outflow amount of the items of each of the processes in any allocation of the resources, in a case of receiving a request including a constraint condition of the resources and an optimization condition; and determines the allocation of the resources to each of the processes.

Abstract: A system calculates for each frontage space which is held by a plurality of shelves and in which commodities are placed, a recommended capacity value of the commodity based on a predicted shipment volume from demand prediction of the commodity placed in the frontage space. The system determines exchange pairs (frontage space pairs) in each of which exchange of the commodities are performed based on a current capacity value and the recommended capacity value of each frontage space. Each exchange pair satisfies the following: The current capacity of a first frontage space is smaller than the recommended capacity, or the current capacity of a second frontage space is larger than the recommended capacity. The recommended capacity of the second frontage space satisfies the current capacity of the first frontage space. The recommended capacity of the first frontage space satisfies the current capacity of the second frontage space.

Abstract: A computer system determines an allocation of resources in a task formed of processes. The task includes a transition between processes corresponding to rework. The computer system comprises: at least one predictor configured to calculate predicted values of an inflow amount and an outflow amount of the items of each of the processes forming the task; and a resource allocation determining unit configured to determine an allocation of the resources to each of the processes. The resource allocation determining unit uses the at least one predictor to form a simulator configured to calculate the predicted values of the inflow amount and the outflow amount of the items of each of the processes in any allocation of the resources, in a case of receiving a request including a constraint condition of the resources and an optimization condition; and determines the allocation of the resources to each of the processes.

Abstract: A shipping operation assisting system generates feature amount data representing a relationship between a feature amount of a shipping operation and a working hour on the basis of operation record data representing a record of a plurality of shipping operations each of which is constituted by one or more of picking operations. The system refers to the feature amount data and generates a prediction model for predicting a working hour of a shipping operation corresponding to the operation instruction from the feature amount of the operation instruction on the basis of the generated feature amount corresponding to a sample point and the working hour corresponding to the feature amount. The system generates a sample point based on a distance with respect to an insufficient area where sample points in a feature amount space are insufficient when the prediction model is generated.

Abstract: A system calculates for each frontage space which is held by a plurality of shelves and in which commodities are placed, a recommended capacity value of the commodity based on a predicted shipment volume from demand prediction of the commodity placed in the frontage space. The system determines exchange pairs (frontage space pairs) in each of which exchange of the commodities are performed based on a current capacity value and the recommended capacity value of each frontage space. Each exchange pair satisfies the following: The current capacity of a first frontage space is smaller than the recommended capacity, or the current capacity of a second frontage space is larger than the recommended capacity. The recommended capacity of the second frontage space satisfies the current capacity of the first frontage space. The recommended capacity of the first frontage space satisfies the current capacity of the second frontage space.

Abstract: A lens retaining method for retaining a lens in a lens retaining frame includes: arranging the lens in the lens retaining frame such that a lens surface of the lens is brought into contact with a protrusion of the lens retaining frame that protrudes in a radial direction; filling, after the lens has been arranged, an adhesive into a space formed between the lens surface and the protrusion, the space being partitioned in an axial direction by the lens surface and the protrusion; and curing the adhesive after the adhesive has been filled into the space.

Abstract: A lens retaining method for retaining a lens in a lens retaining frame includes: arranging the lens in the lens retaining frame such that a lens surface of the lens is brought into contact with a protrusion of the lens retaining frame that protrudes in a radial direction; filling, after the lens has been arranged, an adhesive into a space formed between the lens surface and the protrusion, the space being partitioned in an axial direction by the lens surface and the protrusion; and curing the adhesive after the adhesive has been filled into the space.

Abstract: In a substrate treatment method for supplying a coating solution to a substrate with projections and depressions on a front surface thereof to form a coating film on the front surface of the substrate, the coating solution is supplied to the rotating substrate to form a coating film on the front surface of the substrate, and the substrate having the coating film formed thereon is heated to adjust an etching condition of the coating film. Next, the etching solution is supplied to the rotating substrate to etch the coating film, and thereafter the coating solution is supplied to the substrate to form a flat coating film on the front surface of the substrate. Thereafter, the substrate is heated to cure the coating film. This flattens the coating film with uniformity and high accuracy without undergoing a high-load process such as chemical mechanical polishing.

Abstract: A method for producing a battery comprises a deformation step for moving a first metal foil forming a pair of perpendicularly intersecting portions of a first metal, respectively, toward the outside in a second radial direction while enlarging the inside diameter, in the second radial direction, of a first metal winding part by making a force act on the pair of perpendicularly intersecting portions of a first metal toward the outside in the second radial direction, and a resistance welding step for pressing a pair of first metal welding portions toward the inside in a first radical direction under a state where the first terminal welding part of a first current collecting terminal member is arranged on the radial by inside of the first metal winding part after the first metal winding part is deformed.

Abstract: A substrate treatment apparatus of the present invention includes: a holding means for rotatably holding a substrate to be treated; a coating solution supply nozzle for supplying a coating solution onto the front surface of the substrate to be treated held on the holding means; a treatment container with an upper surface open for housing them; an exhaust means for exhausting an atmosphere in the treatment container from the bottom; a multiblade centrifugal fan provided on the inner periphery of the treatment container for flowing airflow on a front surface side of the substrate to the exhaust means; and a controller for controlling the number of rotations of the multiblade centrifugal fan corresponding to the number of rotations of the substrate, wherein the number of rotations of the multiblade centrifugal fan is controlled so that turbulent airflow flowing in a circumferential direction on the front surface of the substrate generated due to the rotation of the substrate is corrected to laminar airflow flowi

Abstract: In a substrate treatment method for supplying a coating solution to a substrate with projections and depressions on a front surface thereof to form a coating film on the front surface of the substrate, the coating solution is supplied to the rotating substrate to form a coating film on the front surface of the substrate, and the substrate having the coating film formed thereon is heated to adjust an etching condition of the coating film. Next, the etching solution is supplied to the rotating substrate to etch the coating film, and thereafter the coating solution is supplied to the substrate to form a flat coating film on the front surface of the substrate. Thereafter, the substrate is heated to cure the coating film. This flattens the coating film with uniformity and high accuracy without undergoing a high-load process such as chemical mechanical polishing.

Abstract: It is an object to provide a method for forming a thin film having a uniform thickness so as to follow asperities of a surface of a wafer to be processed and to provide a film-forming device used for the method. The film-forming device includes a treatment chamber for receiving a wafer and isolating the wafer from the air; a solvent-gas-supplying portion for supplying a solvent gas into the treatment chamber; a chuck for rotatably holding the wafer so that the downward-facing surface of the substrate is the surface on which a thin film is formed; a coating-solution-supplying portion for supplying a coating solution as a mist of charged particles toward the surface of the wafer; and a charging portion for charging the wafer with an electrical potential opposite to the charge of the particles.

Abstract: In the present invention, an insulating material is applied onto a substrate in a coating treatment unit to form a coating insulating film. The substrate is heated in the heating processing unit, whereby the coating insulating film is hardened partway. A brush is then pressed against the front surface of the coating insulating film in a planarization unit and moved along the front surface of the coating insulating film, thereby planarizing the coating insulating film. The substrate is then heated to completely harden the coating insulating film. According to the present invention, the coating film can be planarized without using the CMP technology.

Abstract: A method for producing a battery comprises a deformation step for moving a first metal foil (11) forming a pair of perpendicularly intersecting portions (44d, 44e) of a first metal, respectively, toward the outside in a second radial direction while enlarging the inside diameter, in the second radial direction (Y), of a first metal winding part (44) by making a force act on the pair of perpendicularly intersecting portions (44d, 44e) of a first metal toward the outside in the second radial direction, and a resistance welding step for pressing a pair of first metal welding portions (44b, 44c) toward the inside in a first radical direction under a state where the first terminal welding part (53) of a first current collecting terminal member (50) is arranged on the radial by inside of the first metal winding part (44) after the first metal winding part (44) is deformed, and then resistance welding the first metal welding portions (44b, 44c) to the first terminal welding part (53) under a state where the pair of

Abstract: It is an object to provide a method for forming a thin film which can be uniformly and precisely planarized without a high-loaded process as in a chemical mechanical polishing method and to provide a device used for the method. In a method for forming a thin film on a surface of a-semiconductor wafer as a substrate to be processed by supplying a coating solution to the wafer having asperities on the surface thereof, a thin film of a coating solution is planarized by placing the wafer having the thin film formed on the surface thereof in a solvent gas atmosphere generated in a treatment chamber, then spraying a solvent gas toward the surface of the wafer from a solvent-gas-supplying nozzle and, simultaneously, relatively moving the wafer and/or the solvent-gas-supplying nozzle in directions parallel to each other.

Abstract: A substrate treatment apparatus of the present invention includes: a holding means for rotatably holding a substrate to be treated; a coating solution supply nozzle for supplying a coating solution onto the front surface of the substrate to be treated held on the holding means; a treatment container with an upper surface open for housing them; an exhaust means for exhausting an atmosphere in the treatment container from the bottom; a multiblade centrifugal fan provided on the inner periphery of the treatment container for flowing airflow on a front surface side of the substrate to the exhaust means; and a controller for controlling the number of rotations of the multiblade centrifugal fan corresponding to the number of rotations of the substrate, wherein the number of rotations of the multiblade centrifugal fan is controlled so that turbulent airflow flowing in a circumferential direction on the front surface of the substrate generated due to the rotation of the substrate is corrected to laminar airflow flowi

Abstract: The present invention is a planarization apparatus for planarizing a coating film applied on a substrate before the coating film is hardened, including a contact body such as a brush or sponge brought into contact with a front surface of the coating film on the substrate; and a contact body drive mechanism for pressing the contact body against the front surface of the coating film and moving the contact body along the front surface of the coating film. The contact body is pressed against the coating film before it is hardened, and moved along the front surface of the coating film, whereby the coating film can be planarized to a predetermined film thickness. According to the present invention, the coating film can be planarized without using the CMP apparatus.

Abstract: An exchange is provided, the exchange receiving a number of a telephone terminal of a called party, selecting a network from a plurality of connectable networks including the Internet with the number and connecting to the network. In addition, the exchange calls the telephone terminal via a network other than the Internet and connects to the telephone terminal in response to a predetermined operation by a caller during a call via the Internet.

Abstract: In a substrate treatment method for supplying a coating solution to a substrate with projections and depressions on a front surface thereof to form a coating film on the front surface of the substrate, the coating solution is supplied to the rotating substrate to form a coating film on the front surface of the substrate, and the substrate having the coating film formed thereon is heated to adjust an etching condition of the coating film. Next, the etching solution is supplied to the rotating substrate to etch the coating film, and thereafter the coating solution is supplied to the substrate to form a flat coating film on the front surface of the substrate. Thereafter, the substrate is heated to cure the coating film. This flattens the coating film with uniformity and high accuracy without undergoing a high-load process such as chemical mechanical polishing.

Abstract: The present invention is a planarization apparatus for planarizing a coating film applied on a substrate before the coating film is hardened, including a contact body such as a brush or sponge brought into contact with a front surface of the coating film on the substrate; and a contact body drive mechanism for pressing the contact body against the front surface of the coating film and moving the contact body along the front surface of the coating film. The contact body is pressed against the coating film before it is hardened, and moved along the front surface of the coating film, whereby the coating film can be planarized to a predetermined film thickness. According to the present invention, the coating film can be planarized without using the CMP apparatus.