Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.

Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.

Abstract: A sensor module includes a first sensor device that outputs first measurement data from a first measurement circuit receiving a signal from a first sensor element and performing a measurement process, a second sensor device that outputs a second measurement circuit receiving a signal from a second sensor element and performing a measurement process, and a microcontroller that receives the first measurement data and the second measurement data, in which the first sensor device includes a first terminal that is used for input of an external synchronization signal or a synchronization signal which is a signal based on the external synchronization signal, and input or output of a communication signal, and the second sensor device includes a second terminal that is used for input of the synchronization signal, and input or output of the communication signal.

Abstract: A sensor unit includes a circuit board including, on a first surface, a plurality of electrode pads to which a plurality of mounting terminals of an inertial sensor are respectively attached via connecting members. The first surface of the circuit board includes an insulating layer provided on the outer side of the plurality of electrode pads in a plan view, includes, in a portion overlapping a center region further on the inner side than the mounting terminals of the inertial sensor in the plan view, a first region where the insulating layer is not provided, and includes, from the first region to the outer side of the inertial sensor in the plan view, a second region where the insulating layer is not provided.

Abstract: A sensor module includes a first sensor device, a second sensor device, and a microcontroller. The first sensor device includes a first synchronization terminal to which an external synchronization signal or a synchronization signal which is a signal based on the external synchronization signal is input, a first interface outputs first measurement data to the microcontroller on the basis of the synchronization signal which is input to the first synchronization terminal, the second sensor device includes a second synchronization terminal to which the synchronization signal is input, and a second interface outputs second measurement data to the microcontroller on the basis of the synchronization signal which is input to the second synchronization terminal.

Abstract: A sensor module includes an X-axis angular velocity sensor device that outputs digital X-axis angular velocity data, a Y-axis angular velocity sensor device that outputs digital Y-axis angular velocity data, a Z-axis angular velocity sensor device that outputs digital Z-axis angular velocity data, an acceleration sensor device that outputs digital X-axis, Y-axis, and Z-axis acceleration data, a microcontroller, a first digital interface bus that electrically connects the X-axis angular velocity sensor device, the Y-axis angular velocity sensor device, and the Z-axis angular velocity sensor device to a first digital interface, and a second digital interface bus that electrically connects the acceleration sensor device to a second digital interface.

Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.

Abstract: A module includes a first rigid substrate including an analog circuit; a second rigid substrate including a digital circuit; a third rigid substrate including an angular velocity sensor; a first connecting portion that connects the first rigid substrate and the second rigid substrate so as to electrically connect the analog circuit and the digital circuit, and that has flexibility; and a second connecting portion that connects the first rigid substrate and the third rigid substrate so as to electrically connect the analog circuit and the angular velocity sensor, and that has flexibility.

Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.

Abstract: A module includes a sensor device, a mounting substrate that has a plurality of mounting faces, a portion between the mounting faces adjacent to each other being foldable, a supporting member having fixing faces, wherein the sensor device is mounted on at least one of the mounting faces, each of the mounting faces is disposed along each of the fixing faces, and the sensor device is disposed on the supporting member side.

Abstract: A sensor unit includes a sensor and a mount board on which the sensor is mounted. The mount board includes a mount terminal connected to a terminal provided in the sensor and a wiring extending from the mount terminal. The wiring is not provided in a region where the sensor and the mount board overlap each other when viewed in plan.

Abstract: A sensor device includes a mounting board having a first rigid board on which an angular velocity sensor is mounted and a third rigid board on which an angular velocity sensor is mounted, and a pedestal for fixing the mounting board. Further, the pedestal includes a base section having a first fixation surface along an x axis and a y axis, and projecting sections disposed on the base section, and having a second fixation surface along the x axis and a z axis, and a third fixation surface along the y axis and the z axis, each of the rigid boards is supported by at least two of the first fixation surface, the second fixation surface, and the third fixation surface, and the angular velocity sensors have respective detection axes intersecting with each other.

Abstract: A module includes a first rigid substrate including an analog circuit; a second rigid substrate including a digital circuit; a third rigid substrate including an angular velocity sensor; a first connecting portion that connects the first rigid substrate and the second rigid substrate so as to electrically connect the analog circuit and the digital circuit, and that has flexibility; and a second connecting portion that connects the first rigid substrate and the third rigid substrate so as to electrically connect the analog circuit and the angular velocity sensor, and that has flexibility.

Abstract: A sensor device includes a mounting board having a first rigid board on which an angular velocity sensor is mounted and a third rigid board on which an angular velocity sensor is mounted, and a pedestal for fixing the mounting board. Further, the pedestal includes a base section having a first fixation surface along an x axis and a y axis, and projecting sections disposed on the base section, and having a second fixation surface along the x axis and a z axis, and a third fixation surface along the y axis and the z axis, each of the rigid boards is supported by at least two of the first fixation surface, the second fixation surface, and the third fixation surface, and the angular velocity sensors have respective detection axes intersecting with each other.

Abstract: A module includes a first rigid substrate including an analog circuit; a second rigid substrate including a digital circuit; a third rigid substrate including an angular velocity sensor; a first connecting portion that connects the first rigid substrate and the second rigid substrate so as to electrically connect the analog circuit and the digital circuit, and that has flexibility; and a second connecting portion that connects the first rigid substrate and the third rigid substrate so as to electrically connect the analog circuit and the angular velocity sensor, and that has flexibility.

Abstract: A module includes a sensor device, a mounting substrate that has a plurality of mounting faces, a portion between the mounting faces adjacent to each other being foldable, a supporting member having fixing faces, wherein the sensor device is mounted on at least one of the mounting faces, each of the mounting faces is disposed along each of the fixing faces, and the sensor device is disposed on the supporting member side.

Abstract: A sensor device includes a mounting board having a first rigid board on which an angular velocity sensor is mounted and a third rigid board on which an angular velocity sensor is mounted, and a pedestal for fixing the mounting board. Further, the pedestal includes a base section having a first fixation surface along an x axis and a y axis, and projecting sections disposed on the base section, and having a second fixation surface along the x axis and a z axis, and a third fixation surface along the y axis and the z axis, each of the rigid boards is supported by at least two of the first fixation surface, the second fixation surface, and the third fixation surface, and the angular velocity sensors have respective detection axes intersecting with each other.

Abstract: A module includes a sensor device, a mounting substrate that has a plurality of mounting faces, a portion between the mounting faces adjacent to each other being foldable, a supporting member having fixing faces, wherein the sensor device is mounted on at least one of the mounting faces, each of the mounting faces is disposed along each of the fixing faces, and the sensor device is disposed on the supporting member side.

Abstract: A sensing device includes: a sensor module that includes a group of sensors, at least one of which is set as a motion sensor, and can switch an operation mode to an overall operation mode in which all of the group of sensors operate and a partial operation mode in which a part of the sensors including the at least one sensor set as the motion sensor operate; and a control unit that controls the switching of the operation mode of the sensor module on the basis of an output from the motion sensor.

Abstract: A maintaining member includes alignment portions that determine a maintaining position of a module, in which each of the alignment portions has a mounting face to fix the module. When the maintaining member is partitioned into a first region to a fourth region by a first axis and a second axis that are orthogonal to each other in plan view with respect to the center of the maintaining member, the alignment portions are provided at the regions one by one.