Abstract: An inspection apparatus in which the environment for inspecting a semiconductor wafer or the like at a high degree of cleanness to enable a fine pattern to be inspected properly. A main body portion 10 for inspecting the semiconductor wafer or the like is housed in the inside of a clean box 3 and clean air is supplied from the clean air unit 4 into the inside of the clean box 3 in which the main body portion 10 is accommodated. There are provided opening areas 80 in lateral sides of the clean box 3 lying laterally of the inspection stage 14 for the main body portion 10 and the vessel mounting space 8. The clean air supplied from the clean air unit 4 into the inside of the clean box is passed over the inspection stage carrying the semiconductor wafer and through the cassette 7b mounted in the vessel mounting space 8 so as to be discharged from the opening areas 80 to outside of the clean box 3.

Abstract: The object of the present invention is to provide a solid-state imaging device making it possible to downsize an imaging unit and further decrease the diameter of the front end of an electronic endoscope.

Abstract: The present invention is to obtain a solid state image pick-up device capable of downsizing an image pick-up unit and further decreasing the rigid end portion of an endoscope or the like in diameter and length.

Abstract: Any shape lead formed on various types of drum may be measured without employing an exclusively-used profiling plane by a lead shape measuring apparatus. The lead shape measuring apparatus includes a shape measuring unit for measuring the shape of a lead formed on a drum used in a VTR while a theoretical value suitable for this lead shape is selected based on the type of drum.