Abstract: This invention relates to an apparatus for coating solder on the outer leads of TAB-type semiconductor devices. The solder coating apparatus comprises a solder tank accommodating a heater, a discharge tank having an open top and a solder inlet opening at a lower part thereof, a square pillar having a top of substantially the same or slightly greater size than a semiconductor element and arranged inside the discharge tank and projecting beyond the open top thereof, and a solder pressure feed screw near the inlet opening of the discharge tank. A film carrying semiconductor elements is intermittently stopped when one of the semiconductor elements arrives above the square pillar. Molten solder is discharged from gaps between the inner walls of the discharge tank and the square pillar onto the outer leads of the semiconductor element positioned over the pillar.