Patents by Inventor Taku Hitomi

Taku Hitomi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of mounting substrate support in chamber, method of dismounting substrate support and auxiliary transport tool
    Patent number: 10010987
    Abstract: A method of mounting a substrate support in a chamber includes placing an auxiliary transfer tool having a first portion and a second portion in a chamber which provides a processing space and an additional space, and which has an opening for communication between the additional space and the outside, the first portion in an expanded state being positioned in the processing space and the second portion being positioned in the additional space, inserting a substrate support having a contact portion for supporting the substrate, a rod portion, and a threaded portion connecting to the rod portion, the rod portion being slid on a side surface of the second portion, shrinking the first portion so that the rod portion is moved downward in the additional space and the threaded portion projects out of the chamber through the opening.
    Type: Grant
    Filed: October 31, 2014
    Date of Patent: July 3, 2018
    Assignee: ASM IP Holding B.V.
    Inventors: Taku Hitomi, Miho Majima
  • METHOD OF MOUNTING SUBSTRATE SUPPORT IN CHAMBER, METHOD OF DISMOUNTING SUBSTRATE SUPPORT AND AUXILIARY TRANSPORT TOOL
    Publication number: 20160121462
    Abstract: A method of mounting a substrate support in a chamber includes placing an auxiliary transfer tool having a first portion and a second portion in a chamber which provides a processing space and an additional space, and which has an opening for communication between the additional space and the outside, the first portion in an expanded state being positioned in the processing space and the second portion being positioned in the additional space, inserting a substrate support having a contact portion for supporting the substrate, a rod portion, and a threaded portion connecting to the rod portion, the rod portion being slid on a side surface of the second portion, shrinking the first portion so that the rod portion is moved downward in the additional space and the threaded portion projects out of the chamber through the opening.
    Type: Application
    Filed: October 31, 2014
    Publication date: May 5, 2016
    Applicant: ASM IP HOLDING B.V.
    Inventors: Taku HITOMI, Miho MAJIMA
  • Method of forming ultra-thin SiN film by plasma CVD
    Patent number: 7638443
    Abstract: A method of forming an ultra-thin SiN film includes: supplying a Si source gas into a reactor in which a substrate is placed on a susceptor; supplying an N source gas into the reactor at a flow rate which is at least 300 times that of the Si source gas; applying an RF power between an upper electrode and the susceptor in the reactor; and depositing an ultra-thin SiN film on the substrate.
    Type: Grant
    Filed: November 14, 2007
    Date of Patent: December 29, 2009
    Assignee: ASM Japan K.K.
    Inventors: Rei Tanaka, Taku Hitomi
  • METHOD OF FORMING ULTRA-THIN SiN FILM BY PLASMA CVD
    Publication number: 20080113521
    Abstract: A method of forming an ultra-thin SiN film includes: supplying a Si source gas into a reactor in which a substrate is placed on a susceptor; supplying an N source gas into the reactor at a flow rate which is at least 300 times that of the Si source gas; applying an RF power between an upper electrode and the susceptor in the reactor; and depositing an ultra-thin SiN film on the substrate.
    Type: Application
    Filed: November 14, 2007
    Publication date: May 15, 2008
    Applicant: ASM JAPAN K.K.
    Inventors: Rei Tanaka, Taku Hitomi