Patents by Inventor Takuma Makino

Takuma Makino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240162474
    Abstract: Two cylindrical secondary cells (1) and methods for assembling them, comprising a cylindrical can (2), a terminal (3), and a first conductive sheet (4), with first electrode coating, wound to form a jelly roll (5). The first conductive sheet (4) comprises a portion (4a) free of first electrode coating. An electrically conductive electrode lead plate (6) is arranged in direct contact with at least part of the portion (4a) free of first electrode coating. The electrode lead plate (6) comprises a protrusion (6a) extending through an opening (2c) in the can (2), and the protrusion (6a) comprises a rivet head (6b) on an outside of the can (2). The rivet head (6b) forms at least part of the terminal (3). Alternatively, the electrode lead plate (6) comprises a hollow protrusion (6a) which protrudes through an opening (2c) in the can (2), and the part of the protrusion (6a) which is exposed to the outside of the can (2) comprises a vent arrangement (11).
    Type: Application
    Filed: February 4, 2022
    Publication date: May 16, 2024
    Inventors: Tetsuya MAKINO, Koki INOUE, Takuma SAKAMOTO
  • Patent number: 7682072
    Abstract: The method for measurement of thermal conductivity of a honeycomb structure according to the present invention comprises the steps keeping the whole honeycomb structure in a steady temperature state with keeping two ends of the honeycomb structure at given different temperatures; and measuring a thermal conductivity of the honeycomb structure in the steady state. According to the present invention there is provided a method for measurement of thermal conductivity of a honeycomb structure, which can measure the thermal conductivity of a honeycomb structure in the shape of the honeycomb structure per se or in a predetermined block shape without preparing, for example, a test specimen of particular shape.
    Type: Grant
    Filed: March 14, 2003
    Date of Patent: March 23, 2010
    Assignee: NGK Insulators, Ltd.
    Inventors: Shuichi Ichikawa, Aiko Otsuka, Motomichi Itou, Takuma Makino
  • Patent number: 7170186
    Abstract: A laminated radiation member includes a radiation plate, an insulation substrate bonded to the upper surface of the radiation plate and an electrode provided on the upper surface of the insulation substrate. The laminated radiation member is made by a method including the steps of surface treating a bonding surface of the radiation plate and/or the insulation substrate, interposing ceramic particles surface treated to assure wettability with a hard solder or a metal between the radiation plate and the insulation substrate, disposing a hard solder above and/or below the ceramic particles, heating the hard solder to a temperature higher than the melting point of the solder, penetrating the molten hard solder into spaces between the ceramic particles to react the ceramic particles with the solder to produce a metal base composite material, and bonding the radiation plate and the insulation substrate with the metal base composite material.
    Type: Grant
    Filed: July 12, 2005
    Date of Patent: January 30, 2007
    Assignee: NGK Insulators, Ltd.
    Inventors: Kiyoshi Araki, Masahiro Kida, Takahiro Ishikawa, Yuki Bessyo, Takuma Makino
  • Publication number: 20050263877
    Abstract: A laminated radiation member includes a radiation plate, an insulation substrate bonded to the upper surface of the radiation plate and an electrode provided on the upper surface of the insulation substrate. The laminated radiation member is made by a method including the steps of surface treating a bonding surface of the radiation plate and/or the insulation substrate, interposing ceramic particles surface treated to assure wettability with a hard solder or a metal between the radiation plate and the insulation substrate, disposing a hard solder above and/or below the ceramic particles, heating the hard solder to a temperature higher than the melting point of the solder, penetrating the molten hard solder into spaces between the ceramic particles to react the ceramic particles with the solder to produce a metal base composite material, and bonding the radiation plate and the insulation substrate with the metal base composite material.
    Type: Application
    Filed: July 12, 2005
    Publication date: December 1, 2005
    Applicant: NGK Insulators, Ltd.
    Inventors: Kiyoshi Araki, Masahiro Kida, Takahiro Ishikawa, Yuki Bessyo, Takuma Makino
  • Publication number: 20050105584
    Abstract: The method for measurement of thermal conductivity of a honeycomb structure according to the present invention comprises the steps keeping the whole honeycomb structure in a steady temperature state with keeping two ends of the honeycomb structure at given different temperatures; and measuring a thermal conductivity of the honeycomb structure in the steady state. According to the present invention there is provided a method for measurement of thermal conductivity of a honeycomb structure, which can measure the thermal conductivity of a honeycomb structure in the shape of the honeycomb structure per se or in a predetermined block shape without preparing, for example, a test specimen of particular shape.
    Type: Application
    Filed: March 14, 2003
    Publication date: May 19, 2005
    Applicant: NGK Insulators Ltd
    Inventors: Shuichi Ichikawa, Aiko Otsuka, Motomichi Itou, Takuma Makino
  • Patent number: 6742700
    Abstract: A composite material is produced by a method where an adhesive composition which comprises a particulate material that reduces thermal stress and a brazing material containing a noble metal element as a base, wherein the adhesive composition can bond two or more kinds of different members to form a composite member with sufficient bond strength to avoid causing damages, such as cracks that occur on the side of the member that is weak against thermal stress, and also by a method to produce a composite member comprised of two or more kinds of different members, in which either the adhesive composition is used or the bonding portion of the different members is filled with the particulate material that reduces thermal stress, and then a molten brazing material is poured there into, and cooled to bond the members.
    Type: Grant
    Filed: February 27, 2002
    Date of Patent: June 1, 2004
    Assignee: NGK Insulators, Ltd.
    Inventors: Takuma Makino, Masayuki Shinkai
  • Publication number: 20030030141
    Abstract: A laminated radiation member includes a radiation plate, an insulation substrate bonded to the upper surface of the radiation plate and an electrode provided on the upper surface of the insulation substrate. The laminated radiation member is made by a method including the steps of surface treating a bonding surface of the radiation plate and/or the insulation substrate, interposing ceramic particles surface treated to assure wettability with a hard solder or a metal between the radiation plate and the insulation substrate, disposing a hard solder above and/or below the ceramic particles, heating the hard solder to a temperature higher than the melting point of the solder, penetrating the molten hard solder into spaces between the ceramic particles to react the ceramic particles with the solder to produce a metal base composite material, and bonding the radiation plate and the insulation substrate with the metal base composite material.
    Type: Application
    Filed: September 13, 2002
    Publication date: February 13, 2003
    Applicant: NGK Insulators, Ltd.
    Inventors: Kiyoshi Araki, Masahiro Kida, Takahiro Ishikawa, Yuki Bessyo, Takuma Makino
  • Patent number: 6485816
    Abstract: A laminated radiation member includes a radiation plate, an insulation substrate bonded to the upper surface of the radiation plate and an electrode provided on the upper surface of the insulation substrate. The laminated radiation member is made by a method including the steps of surface treating a bonding surface of the radiation plate and/or the insulation substrate, interposing ceramic particles surface treated to assure wettability with a hard solder or a metal between the radiation plate and the insulation substrate, disposing a hard solder above and/or below the ceramic particles, heating the hard solder to a temperature higher than the melting point of the solder, penetrating the molten hard solder into spaces between the ceramic particles to react the ceramic particles with the solder to produce a metal base composite material, and bonding the radiation plate and the insulation substrate with the metal base composite material.
    Type: Grant
    Filed: January 30, 2001
    Date of Patent: November 26, 2002
    Assignee: NGK Insulators, Ltd.
    Inventors: Kiyoshi Araki, Masahiro Kida, Takahiro Ishikawa, Yuki Bessyo, Takuma Makino
  • Publication number: 20020092896
    Abstract: A composite material is produced by a method where an adhesive composition which comprises a particulate material that reduces thermal stress and a brazing material containing a noble metal element as a base, wherein the adhesive composition can bond two or more kinds of different members to form a composite member with sufficient bond strength to avoid causing damages, such as cracks that occur on the side of the member that is weak against thermal stress, and also by a method to produce a composite member comprised of two or more kinds of different members, in which either the adhesive composition is used or the bonding portion of the different members is filled with the particulate material that reduces thermal stress, and then a molten brazing material is poured there into, and cooled to bond the members.
    Type: Application
    Filed: February 27, 2002
    Publication date: July 18, 2002
    Applicant: NGK Insulators, Ltd.
    Inventors: Takuma Makino, Masayuki Shinkai
  • Patent number: 6390354
    Abstract: A composite material is produced by a method where an adhesive composition which comprises a particulate material that reduces thermal stress and a brazing material containing a noble metal element as a base, wherein the adhesive composition can bond two or more kinds of different members to form a composite member with sufficient bond strength to avoid causing damages, such as cracks that occur on the side of the member that is weak against thermal stress, and also by a method to produce a composite member comprised of two or more kinds of different members, in which either the adhesive composition is used or the bonding portion of the different members is filled with the particulate material that reduces thermal stress, and then a molten brazing material is poured there into, and cooled to bond the members.
    Type: Grant
    Filed: January 28, 1999
    Date of Patent: May 21, 2002
    Assignee: NGK Insulators, Ltd.
    Inventors: Takuma Makino, Masayuki Shinkai
  • Publication number: 20010031345
    Abstract: The object is to provide a laminated radiation member and a power semiconductor apparatus in which no cracks occur due to thermal stress caused by cooling and thermal cycle and which are low in thermal resistance.
    Type: Application
    Filed: January 30, 2001
    Publication date: October 18, 2001
    Applicant: NKG Insulators, Ltd.
    Inventors: Kiyoshi Araki, Masahiro Kida, Takahiro Ishikawa, Yuki Bessyo, Takuma Makino
  • Patent number: 5998041
    Abstract: A joined article includes a ceramic member, another member, and a joining layer which is formed between the ceramic member and another member and joins both the members together, wherein the joining layer is composed mainly of nickel, and the joining layer contains beryllium as an activating component.
    Type: Grant
    Filed: March 12, 1997
    Date of Patent: December 7, 1999
    Assignee: NGK Insulators, Ltd.
    Inventors: Takuma Makino, Masayuki Shinkai