Patents by Inventor Takuma Makino
Takuma Makino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240162474Abstract: Two cylindrical secondary cells (1) and methods for assembling them, comprising a cylindrical can (2), a terminal (3), and a first conductive sheet (4), with first electrode coating, wound to form a jelly roll (5). The first conductive sheet (4) comprises a portion (4a) free of first electrode coating. An electrically conductive electrode lead plate (6) is arranged in direct contact with at least part of the portion (4a) free of first electrode coating. The electrode lead plate (6) comprises a protrusion (6a) extending through an opening (2c) in the can (2), and the protrusion (6a) comprises a rivet head (6b) on an outside of the can (2). The rivet head (6b) forms at least part of the terminal (3). Alternatively, the electrode lead plate (6) comprises a hollow protrusion (6a) which protrudes through an opening (2c) in the can (2), and the part of the protrusion (6a) which is exposed to the outside of the can (2) comprises a vent arrangement (11).Type: ApplicationFiled: February 4, 2022Publication date: May 16, 2024Inventors: Tetsuya MAKINO, Koki INOUE, Takuma SAKAMOTO
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Patent number: 7682072Abstract: The method for measurement of thermal conductivity of a honeycomb structure according to the present invention comprises the steps keeping the whole honeycomb structure in a steady temperature state with keeping two ends of the honeycomb structure at given different temperatures; and measuring a thermal conductivity of the honeycomb structure in the steady state. According to the present invention there is provided a method for measurement of thermal conductivity of a honeycomb structure, which can measure the thermal conductivity of a honeycomb structure in the shape of the honeycomb structure per se or in a predetermined block shape without preparing, for example, a test specimen of particular shape.Type: GrantFiled: March 14, 2003Date of Patent: March 23, 2010Assignee: NGK Insulators, Ltd.Inventors: Shuichi Ichikawa, Aiko Otsuka, Motomichi Itou, Takuma Makino
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Patent number: 7170186Abstract: A laminated radiation member includes a radiation plate, an insulation substrate bonded to the upper surface of the radiation plate and an electrode provided on the upper surface of the insulation substrate. The laminated radiation member is made by a method including the steps of surface treating a bonding surface of the radiation plate and/or the insulation substrate, interposing ceramic particles surface treated to assure wettability with a hard solder or a metal between the radiation plate and the insulation substrate, disposing a hard solder above and/or below the ceramic particles, heating the hard solder to a temperature higher than the melting point of the solder, penetrating the molten hard solder into spaces between the ceramic particles to react the ceramic particles with the solder to produce a metal base composite material, and bonding the radiation plate and the insulation substrate with the metal base composite material.Type: GrantFiled: July 12, 2005Date of Patent: January 30, 2007Assignee: NGK Insulators, Ltd.Inventors: Kiyoshi Araki, Masahiro Kida, Takahiro Ishikawa, Yuki Bessyo, Takuma Makino
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Publication number: 20050263877Abstract: A laminated radiation member includes a radiation plate, an insulation substrate bonded to the upper surface of the radiation plate and an electrode provided on the upper surface of the insulation substrate. The laminated radiation member is made by a method including the steps of surface treating a bonding surface of the radiation plate and/or the insulation substrate, interposing ceramic particles surface treated to assure wettability with a hard solder or a metal between the radiation plate and the insulation substrate, disposing a hard solder above and/or below the ceramic particles, heating the hard solder to a temperature higher than the melting point of the solder, penetrating the molten hard solder into spaces between the ceramic particles to react the ceramic particles with the solder to produce a metal base composite material, and bonding the radiation plate and the insulation substrate with the metal base composite material.Type: ApplicationFiled: July 12, 2005Publication date: December 1, 2005Applicant: NGK Insulators, Ltd.Inventors: Kiyoshi Araki, Masahiro Kida, Takahiro Ishikawa, Yuki Bessyo, Takuma Makino
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Publication number: 20050105584Abstract: The method for measurement of thermal conductivity of a honeycomb structure according to the present invention comprises the steps keeping the whole honeycomb structure in a steady temperature state with keeping two ends of the honeycomb structure at given different temperatures; and measuring a thermal conductivity of the honeycomb structure in the steady state. According to the present invention there is provided a method for measurement of thermal conductivity of a honeycomb structure, which can measure the thermal conductivity of a honeycomb structure in the shape of the honeycomb structure per se or in a predetermined block shape without preparing, for example, a test specimen of particular shape.Type: ApplicationFiled: March 14, 2003Publication date: May 19, 2005Applicant: NGK Insulators LtdInventors: Shuichi Ichikawa, Aiko Otsuka, Motomichi Itou, Takuma Makino
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Patent number: 6742700Abstract: A composite material is produced by a method where an adhesive composition which comprises a particulate material that reduces thermal stress and a brazing material containing a noble metal element as a base, wherein the adhesive composition can bond two or more kinds of different members to form a composite member with sufficient bond strength to avoid causing damages, such as cracks that occur on the side of the member that is weak against thermal stress, and also by a method to produce a composite member comprised of two or more kinds of different members, in which either the adhesive composition is used or the bonding portion of the different members is filled with the particulate material that reduces thermal stress, and then a molten brazing material is poured there into, and cooled to bond the members.Type: GrantFiled: February 27, 2002Date of Patent: June 1, 2004Assignee: NGK Insulators, Ltd.Inventors: Takuma Makino, Masayuki Shinkai
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Publication number: 20030030141Abstract: A laminated radiation member includes a radiation plate, an insulation substrate bonded to the upper surface of the radiation plate and an electrode provided on the upper surface of the insulation substrate. The laminated radiation member is made by a method including the steps of surface treating a bonding surface of the radiation plate and/or the insulation substrate, interposing ceramic particles surface treated to assure wettability with a hard solder or a metal between the radiation plate and the insulation substrate, disposing a hard solder above and/or below the ceramic particles, heating the hard solder to a temperature higher than the melting point of the solder, penetrating the molten hard solder into spaces between the ceramic particles to react the ceramic particles with the solder to produce a metal base composite material, and bonding the radiation plate and the insulation substrate with the metal base composite material.Type: ApplicationFiled: September 13, 2002Publication date: February 13, 2003Applicant: NGK Insulators, Ltd.Inventors: Kiyoshi Araki, Masahiro Kida, Takahiro Ishikawa, Yuki Bessyo, Takuma Makino
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Patent number: 6485816Abstract: A laminated radiation member includes a radiation plate, an insulation substrate bonded to the upper surface of the radiation plate and an electrode provided on the upper surface of the insulation substrate. The laminated radiation member is made by a method including the steps of surface treating a bonding surface of the radiation plate and/or the insulation substrate, interposing ceramic particles surface treated to assure wettability with a hard solder or a metal between the radiation plate and the insulation substrate, disposing a hard solder above and/or below the ceramic particles, heating the hard solder to a temperature higher than the melting point of the solder, penetrating the molten hard solder into spaces between the ceramic particles to react the ceramic particles with the solder to produce a metal base composite material, and bonding the radiation plate and the insulation substrate with the metal base composite material.Type: GrantFiled: January 30, 2001Date of Patent: November 26, 2002Assignee: NGK Insulators, Ltd.Inventors: Kiyoshi Araki, Masahiro Kida, Takahiro Ishikawa, Yuki Bessyo, Takuma Makino
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Publication number: 20020092896Abstract: A composite material is produced by a method where an adhesive composition which comprises a particulate material that reduces thermal stress and a brazing material containing a noble metal element as a base, wherein the adhesive composition can bond two or more kinds of different members to form a composite member with sufficient bond strength to avoid causing damages, such as cracks that occur on the side of the member that is weak against thermal stress, and also by a method to produce a composite member comprised of two or more kinds of different members, in which either the adhesive composition is used or the bonding portion of the different members is filled with the particulate material that reduces thermal stress, and then a molten brazing material is poured there into, and cooled to bond the members.Type: ApplicationFiled: February 27, 2002Publication date: July 18, 2002Applicant: NGK Insulators, Ltd.Inventors: Takuma Makino, Masayuki Shinkai
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Patent number: 6390354Abstract: A composite material is produced by a method where an adhesive composition which comprises a particulate material that reduces thermal stress and a brazing material containing a noble metal element as a base, wherein the adhesive composition can bond two or more kinds of different members to form a composite member with sufficient bond strength to avoid causing damages, such as cracks that occur on the side of the member that is weak against thermal stress, and also by a method to produce a composite member comprised of two or more kinds of different members, in which either the adhesive composition is used or the bonding portion of the different members is filled with the particulate material that reduces thermal stress, and then a molten brazing material is poured there into, and cooled to bond the members.Type: GrantFiled: January 28, 1999Date of Patent: May 21, 2002Assignee: NGK Insulators, Ltd.Inventors: Takuma Makino, Masayuki Shinkai
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Publication number: 20010031345Abstract: The object is to provide a laminated radiation member and a power semiconductor apparatus in which no cracks occur due to thermal stress caused by cooling and thermal cycle and which are low in thermal resistance.Type: ApplicationFiled: January 30, 2001Publication date: October 18, 2001Applicant: NKG Insulators, Ltd.Inventors: Kiyoshi Araki, Masahiro Kida, Takahiro Ishikawa, Yuki Bessyo, Takuma Makino
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Patent number: 5998041Abstract: A joined article includes a ceramic member, another member, and a joining layer which is formed between the ceramic member and another member and joins both the members together, wherein the joining layer is composed mainly of nickel, and the joining layer contains beryllium as an activating component.Type: GrantFiled: March 12, 1997Date of Patent: December 7, 1999Assignee: NGK Insulators, Ltd.Inventors: Takuma Makino, Masayuki Shinkai