Patents by Inventor Takumi HIRAIWA

Takumi HIRAIWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145307
    Abstract: A method of manufacturing a plurality of chips by dividing a workpiece having a substrate harder than a monocrystalline Si substrate includes a cut groove forming step of, while holding the workpiece on a holding table with a surface of the workpiece being exposed, cutting the workpiece along each of projected dicing lines with a first cutting blade as it is vibrating at a frequency in the ultrasonic band, to form a cut groove in the workpiece such that the cut groove extends from the surface of the workpiece and terminates short of another surface of the workpiece, and a dividing step of, while holding the workpiece on the holding table with the other surface of the workpiece being exposed, cutting off an uncut residual portion from the workpiece along each of the lines with a second cutting blade to divide the workpiece into a plurality of chips.
    Type: Application
    Filed: October 3, 2023
    Publication date: May 2, 2024
    Inventors: Takumi KOHEI, Suguru HIRAIWA
  • Patent number: 11461548
    Abstract: An information processing device is configured to identify language of character strings in a text. The information processing device includes a processor and a memory storing a program. The processor is configured to or the program, when executed by the processor, causes the processor to: identify a first character, which is used commonly in a plurality of languages, in an input text; infer to which one of the plurality of languages the first character belongs based on a second character used only in one of the plurality of languages in the input text; and infer that the first character belongs to a language that is the one of the plurality of languages to which the second character belongs, based on whether a string of characters immediately preceding or following the first character in the input text contains the second character.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: October 4, 2022
    Assignee: FRONTEO, INC.
    Inventors: Ryota Tamura, Takumi Hiraiwa
  • Publication number: 20210027017
    Abstract: The information processing device includes: an acquisition unit configured to acquire a first character used commonly in a plurality of languages; and an inferring unit configured to infer to which one of the plurality of languages the first character belongs based on a second character used only in one of the plurality of languages. If a string of characters immediately preceding or following the first character contains the second character, the inferring circuitry infers that the first character belongs to a language that is the one of the plurality of languages to which the second character belongs.
    Type: Application
    Filed: July 21, 2020
    Publication date: January 28, 2021
    Inventors: Ryota TAMURA, Takumi HIRAIWA