Abstract: There is provided a measuring device that is inexpensive and easy to use, yet provides sufficient accuracy and resolution in continuous scanning measurement to measure workpiece surfaces. A dial gauge includes a spindle provided to be movable reciprocatively in an axial direction through a main body case. The main body case includes a stem provided to protrude from a side face of the main body case. A ball bearing that bears the spindle is provided inside the stem. A workpiece and the dial gage are relatively moved while a contact point at the tip of the spindle is in contact with the surface of the workpiece, and continuous scanning measurement is performed to measure irregularities of the surface of the workpiece or the amount of runout of the rotating workpiece.

Abstract: Provided an electrophotographic electro-conductive member that can stably suppress an occurrence of fogging in an electrophotographic image. The member comprises a support having an electro-conductive outer surface, and an electro-conductive layer on the outer surface of the support, the electro-conductive layer having a matrix including a cross-linked product of a first rubber, and domains dispersed in the matrix, the domains each includes a cross-linked product of a second rubber and an electro-conductive particle, at least some of the domains is exposed to the outer surface of the electro-conductive member to constitute protrusions on an outer surface of the member, the outer surface of the electro-conductive member is constituted by the matrix and the domains exposed to the outer surface of the electrophotographic electro-conductive member, the electrophotographic electro-conductive member has an impedance of 1.0×103? or more and 1.0×108? or less, and some of the domains satisfy two specific requirements.

Abstract: An insulating sheet includes an adhesive component of a thermosetting resin and containing a filler member. Heat conductivity of an adhesive face region of the insulating sheet is smaller than heat conductivity of an inner region of the insulating sheet.

Abstract: An insulating sheet includes an adhesive component of a thermosetting resin and containing a filler member. Heat conductivity of an adhesive face region of the insulating sheet is smaller than heat conductivity of an inner region of the insulating sheet.

Abstract: An insulating sheet includes an adhesive component of essentially a thermosetting resin and a filler member infiltrated into the component. Heat conductivity of an adhesive face region of the insulating sheet is smaller than heat conductivity of an inner region, other than the adhesive face region of the insulating sheet.

Abstract: This invention relates to a quake-absorbing device and installation method therefor.

Abstract: In an IGBT module which contains an IGBT device and a diode device connected to each other and accommodated in a case and which radiates heat generated in operation through a radiation board, an object is to reduce the area of the module in the lateral direction to achieve size reduction. The collector electrode surface of an IGBT device is provided on a radiation board, and an element connecting conductor is bonded with conductive resin on the emitter electrode surface. The anode electrode surface of a diode device is bonded on it with the conductive resin. The IGBT device and the diode device are thus stacked and connected in the vertical direction.

Abstract: A neutral glucose-containing preparation with excellent stability and a near physiological pH, as a transfusion preparation with minimal glucose degradation by-products and a greatly reduced formic acid content; specifically, a glucose-containing preparation comprising separately housed first and second solutions, the first and second solutions satisfying the following conditions: (a) the first solution contains 2-50% glucose, and its pH is adjusted to 3-5 with an organic acid buffer solution; (b) the second solution contains an alkalizing agent, and has a pH value of 8-13 as a pH adjustor for the first solution; and (c) the glucose concentration is 1-15% in the preparation solution obtained by mixing the first solution and second solution, and the pH of the solution is in a range of 6-8. It is used particularly as a peritoneal perfusate, such as a perfusate for Continuous Ambulatory Peritoneal Dialysis (CAPD).

Abstract: In an IGBT module which contains an IGBT device and a diode device connected to each other and accommodated in a case and which radiates heat generated in operation through a radiation board, an object is to reduce the area of the module in the lateral direction to achieve size reduction. The collector electrode (32) surface of an IGBT device (28) is provided on a radiation board (26), and an element connecting conductor (35) is bonded with conductive resin (36) on the emitter electrode (30) surface. The anode electrode (33) surface of a diode device (29) is bonded on it with the conductive resin (36). The IGBT device (28) and the diode device (29) are thus stacked and connected in the vertical direction.

Abstract: An object is to obtain long-term reliability of an electric connection in a power semiconductor module. In a power semiconductor module, the main circuit interconnection directly connected to a power semiconductor chip (3) is formed of a busbar (6) and the power semiconductor chip (3) and the busbar electrode (6a) of the busbar (6) are electrically connected through a conductive resin (12). A member (13) having lower thermal expansion than the busbar electrode (6a) is joined to the busbar electrode (6a) in the part adjacent to said power semiconductor chip (3).

Abstract: Epoxy resin composition for molding comprising epoxy resin (A), acid anhydride (B), curing accelerator (C), coupling agent (D) and filler (E), process for preparing molded product used for apparatus for high voltage made of the epoxy resin composition for molding and molded product produced by the process for preparing the molded product. The epoxy resin composition has excellent mechanical properties such as high mechanical strength and high toughness and excellent thermal resistance, the process for preparing the molded product can provide molded product made of the epoxy resin composition, and the produced molded product has excellent crack resistance and high reliability.

Abstract: "Molded products for high voltage apparatus comprising an" epoxy resin composition for molding comprising an epoxy resin (A), an acid anhydride (B), a curing accelerator (C), at least one coupling agent (D) and a filler (E). The epoxy resin (A) is a bifunctional brominated bisphenol A or a brominated bisphenol F, "epoxy resin and at least one bisphenol A, bisphenol F or bisphenol epoxy resin". The coupling agent (D) is selected from the group consisting of epoxysilane type coupling agents, phenylaminosilane type coupling agents, mercaptosilane type coupling agents and titanate type coupling agents, which has an average particle diameter of not more than 60 .mu.m and in which the content of particles having a diameter of not more than 5 .mu.m is not less than 5% by weight. The filler (E) comprises at least one of silica fillers or alumina fillers. The ratio of the number of acid anhydride groups of the acid anhydride (B) to the number of epoxy groups of the epoxy resin (A) is 0.5 to 1.

Abstract: A resin composition for a laminate comprises 100 parts by weight of a polyfunctional epoxy resin (I) obtained by (i)(1) glycidylizing a polycomposite formed from a blend of brominated bisphenol A and bisphenol A, or brominated bisphenol A and formaldehyde; or (2) a mixture of a polyfunctional epoxy resin and a bisphenol A-advanced epoxy resin reacted with brominated bisphenol A in a hydroxyl:epoxy equivalent ratio of from 0.05-0.5:1 and (ii) a bisphenol A-formaldehyde phenolic resin having a weight average molecular weight of from 1,000-10,000 in a hydroxyl:epoxy equivalent ratio with respect to epoxy resin (i) of from 0.7-1.2:1; and (II) from 1-60 parts by weight of a straight chain polymer (c) such as a poly(ether)sulfone, aromatic polyester, phenoxy resin, polyparabanic acid, polyetherimide or polyphenylene sulfide.