Patents by Inventor Takumi Yagi

Takumi Yagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240154446
    Abstract: In an electric power device and a method for controlling the same, a first circuit is electrically connected to a first battery tray and a second battery tray, a second circuit is electrically connected to the first battery tray, and a third circuit is electrically connected to the second battery tray. Between the first circuit and the second circuit, a first resistor unit is connected in series with the first battery tray, and a first interrupting unit is connected in parallel with the first resistor unit. Between the first circuit and the third circuit, a second resistor unit is connected in series with the second battery tray, and a second interrupting unit is connected in parallel with the second resistor unit.
    Type: Application
    Filed: March 9, 2022
    Publication date: May 9, 2024
    Inventors: Atsushi Nakajima, Satoshi Odakura, Keita Yagi, Takumi Shiiyama, Tatsuya Uchimoto, Makoto Ogawa, Koichiro Takemasa, Hiroshi Miyazaki
  • Patent number: 7211333
    Abstract: The present invention is to provide a resin-forming mold having high releasability and permitting a production without increasing production costs. The resin-forming mold can be used to produce a resin-molded product having minute uneven portions on a front face thereof, such as a surface light source device-use light guide for a liquid crystal display, an aspherical micro-lens, micro-Fresnel lens and an optical disk. In the stamper (resin-forming mold) 10 provided with an electroformed layer 11 and a conductive film 12 formed on the electroformed layer 11, the front face layer 12c of the conductive film 12 is formed of aluminum and a back face 12d is formed of nickel as an electroconductive metal. In addition, the constituent composition of the aluminum and the nickel continuously changes from the front face 12c toward the back face 12d. The front face 12c may be formed of aluminum and oxygen. The aluminum may combine with the oxygen to form an oxide of aluminum.
    Type: Grant
    Filed: May 13, 2004
    Date of Patent: May 1, 2007
    Assignee: Kuraray Co., Ltd.
    Inventors: Yukihiro Yanagawa, Takumi Yagi, Masaru Karai
  • Publication number: 20060057847
    Abstract: The present invention is to provide a resin-forming mold having high releasability and permitting a production without increasing production costs. The resin-forming mold can be used to produce a resin-molded product having minute uneven portions on a front face thereof, such as a surface light source device-use light guide for a liquid crystal display, an aspherical micro-lens, micro-Fresnel lens and an optical disk. In the stamper (resin-forming mold) 10 provided with an electroformed layer 11 and a conductive film 12 formed on the electroformed layer 11, the front face layer 12c of the conductive film 12 is formed of aluminum and a back face 12d is formed of nickel as an electroconductive metal. In addition, the constituent composition of the aluminum and the nickel continuously changes from the front face 12c toward the back face 12d. The front face 12c may be formed of aluminum and oxygen. The aluminum may combine with the oxygen to form an oxide of aluminum.
    Type: Application
    Filed: May 13, 2004
    Publication date: March 16, 2006
    Applicant: Kuraray Co., Ltd.
    Inventors: Yukihiro Yanagawa, Takumi Yagi, Masaru Karai