Patents by Inventor Takuo Ozawa

Takuo Ozawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7078330
    Abstract: A metal electrode is formed on a substrate. The metal electrode includes a first layer, a second layer, and a third layer lying, from an outermost surface of the metal electrode toward the substrate, in this order. The first layer contains tin as a principal constituent and the second layer contains a metallic element which produces an eutectic reaction with tin, wherein the melting point of the first layer is higher than the melting point of the second layer. The third layer is an underlying metallic layer for the first and second layers.
    Type: Grant
    Filed: March 3, 2004
    Date of Patent: July 18, 2006
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Akira Maeda, Takeyuki Maegawa, Shigeru Matsuno, Takuo Ozawa, Takanori Sone, Shoji Miyashita, Yasumichi Hatanaka, Masato Koyama, Takahiro Nagamine, Susumu Arai
  • Publication number: 20040175917
    Abstract: A metal electrode of the invention is formed on a substrate. The metal electrode includes a first layer, a second layer and a third layer lying from an outermost surface of the metal electrode toward the substrate in this order. The first layer contains tin as a principal constituent and the second layer contains a metallic element which produces an eutectic reaction with tin, wherein the melting point of the first layer is higher than that of the second layer. The third layer is formed as an underlying metallic layer for the first and second layers.
    Type: Application
    Filed: March 3, 2004
    Publication date: September 9, 2004
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Akira Maeda, Takeyuki Maegawa, Shigeru Matsuno, Takuo Ozawa, Takanori Sone, Shoji Miyashita, Yasumichi Hatanaka, Masato Koyama, Takahiro Nagamine, Susumu Arai
  • Patent number: 6722614
    Abstract: In a solar array paddle having panels which are connected to a main body of a satellite and rotatably connected to one another, elastic insertion members for prevention of vibration are disposed in a clearance between each of the panels and between the main body and the panel adjacent to the main body when the panels are housed, folded, and layered. Each of the insertion members for prevention of vibration is inserted into the clearances and between the main body of the satellite and the panels adjacent to the main body such that one surface contacts a first panel and the other surface is adhered to a second panel.
    Type: Grant
    Filed: August 15, 2002
    Date of Patent: April 20, 2004
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Takuo Ozawa, Tsuyoshi Ozaki
  • Publication number: 20030173467
    Abstract: In a solar array paddle having a plurality of panels which are connected to a main body of a satellite and rotatably connected to one another, a plurality of elastic insertion member for prevention of vibration is disposed in a clearance between each of the panels and in that between the main body and the panel adjacent to the main body when the panels are housed with them folded and layered. Each of the insertion member for prevention of vibration is inserted into the above-described clearances and those between the main body of the satellite and the panels adjacent to the main body such that one surface thereof is contacted with a relevant surface and the other surface thereof is adhered to another relevant surface.
    Type: Application
    Filed: August 15, 2002
    Publication date: September 18, 2003
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Takuo Ozawa, Tsuyoshi Ozaki
  • Patent number: 6241145
    Abstract: A joining method using lead-free solder which can produce a good joint through a heating process. A first lead-free alloy layer is formed on surfaces of all parts to be mounted on a board at a temperature equal to or lower than the melting point of the first alloy layer. A second lead-free alloy layer having a melting point lower than the first alloy layer is formed on surface of the board. The first and second alloy layers are placed in contact with each other and heated to a predetermined temperature.
    Type: Grant
    Filed: April 21, 2000
    Date of Patent: June 5, 2001
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Akira Maeda, Takuo Ozawa, Toshio Umemura