Patents by Inventor Takuro HORIBE
Takuro HORIBE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11957313Abstract: An endoscope includes an imager unit loading region provided at a distal end portion of an insertion portion, a cable connection surface, a wall provided to connect an opening of the imager unit loading region and an opening of the cable connection surface to each other, a contact pattern formed on a wall surface of the imager unit loading region, a wiring pattern formed on a front surface of the cable connection surface from the wall, a connection pattern formed on the cable connection surface, and a through-electrode formed in the wall so that the imager unit loading region and the cable connection surface communicate with each other, configured to cause the contact pattern and the wiring pattern to electrically continue to each other, and formed at a predetermined angle with respect to a center axis of the distal end barrel member.Type: GrantFiled: September 8, 2022Date of Patent: April 16, 2024Assignee: OLYMPUS CORPORATIONInventors: Kenjiro Kanno, Shigeru Hosokai, Takuro Horibe, Daichi Kodama, Hiroyuki Motohara
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Patent number: 11957306Abstract: A distal end frame includes: a first distal end frame member that includes a resin molded product which constitutes a molded interconnect device; a housing chamber that is provided on a distal end side of the first distal end frame member, and is formed of a recessed portion a distal end and one side of which are opened; a second distal end frame member that is composed of the resin molded product constituting the molded interconnect device, and is configured to close the one side of the housing chamber; a signal pattern that is the metal pattern formed in a region including a first joining surface which is a joining surface with the second distal end frame member, on a surface of the first distal end frame member; and a solder material which is configured to join the first distal end frame member and the second distal end frame member.Type: GrantFiled: September 15, 2021Date of Patent: April 16, 2024Assignee: OLYMPUS CORPORATIONInventors: Daichi Kodama, Tomokazu Yamashita, Takuro Horibe, Hiroyuki Motohara
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Publication number: 20240032781Abstract: An image pickup unit includes a three-dimensional substrate which includes a recess portion and an image pickup module which is installed in the recess portion, and the recess portion includes a first recess portion, a second recess portion which communicates with the first recess portion and which has a wider opening and a shallower depth than the first recess portion, and a third recess portion which is formed by providing a notch from a bottom surface of the second recess portion in a depth direction of the first recess portion.Type: ApplicationFiled: October 11, 2023Publication date: February 1, 2024Applicant: OLYMPUS MEDICAL SYSTEMS CORP.Inventors: Yo ASAKURA, Takuro HORIBE
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Publication number: 20240008718Abstract: An image pickup unit includes: an image pickup device; a flat circuit board; a three-dimensional circuit board; plural electronic components; and plural cables, in which the three-dimensional circuit board includes: a first surface; a second surface; a third surface; a fourth surface; a fifth surface; and a sixth surface, in which on one of the first surface to the sixth surface, a recessed portion is formed and a connection terminal portion is formed in an inner surface of the recessed portion, one of the plural electronic components or the plural cables is mounted on or connected to the connection terminal portion, the recessed portion is formed, in a site where the first surface and the sixth surface cross each other, from the second surface toward the third surface, the recessed portion having a wall surface parallel to the second surface, and one of the electronic components is mounted.Type: ApplicationFiled: September 22, 2023Publication date: January 11, 2024Applicant: OLYMPUS MEDICAL SYSTEMS CORP.Inventors: Shuichi TAKIE, Takuro HORIBE
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Publication number: 20230111466Abstract: An image pickup unit includes a distal end member including a recess portion, an image pickup device unit, and an objective lens unit. The recess portion is formed such that a spatial cross-sectional area of the recess portion increases continuously or stepwise from a bottom surface toward an opening. The objective lens unit is fixed to the recess portion by a sealing material injected in a gap.Type: ApplicationFiled: December 9, 2022Publication date: April 13, 2023Applicant: OLYMPUS CORPORATIONInventor: Takuro HORIBE
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Publication number: 20230000316Abstract: An endoscope includes an imager unit loading region provided at a distal end portion of an insertion portion, a cable connection surface, a wall provided to connect an opening of the imager unit loading region and an opening of the cable connection surface to each other, a contact pattern formed on a wall surface of the imager unit loading region, a wiring pattern formed on a front surface of the cable connection surface from the wall, a connection pattern formed on the cable connection surface, and a through-electrode formed in the wall so that the imager unit loading region and the cable connection surface communicate with each other, configured to cause the contact pattern and the wiring pattern to electrically continue to each other, and formed at a predetermined angle with respect to a center axis of the distal end barrel member.Type: ApplicationFiled: September 8, 2022Publication date: January 5, 2023Applicant: OLYMPUS CORPORATIONInventors: Kenjiro KANNO, Shigeru HOSOKAI, Takuro HORIBE, Daichi KODAMA, Hiroyuki MOTOHARA
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Publication number: 20220022733Abstract: A distal end unit for endoscope is provided in a distal end portion of an insertion portion and includes: an electronic module including an optical system and an electrode; a substrate including a connection portion electrically connected to the electrode of the electronic module, and including a connection land on which an electronic component is mounted; a holding member holding the electronic module and the substrate connected to the electrode; and a distal end frame body made of resin, on which the electronic module, the substrate and the holding member are integrally mounted via insert molding by loading the holding member holding the electronic module and the substrate in a mold such that an entrance surface of the optical system is exposed at an outer surface of the distal end frame body and the connection portion extends to a proximal end side.Type: ApplicationFiled: October 6, 2021Publication date: January 27, 2022Applicant: OLYMPUS CORPORATIONInventors: Takuro HORIBE, Hiroyuki MOTOHARA, Kenjiro KANNO
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Publication number: 20210401267Abstract: A distal end frame includes: a first distal end frame member that includes a resin molded product which constitutes a molded interconnect device; a housing chamber that is provided on a distal end side of the first distal end frame member, and is formed of a recessed portion a distal end and one side of which are opened; a second distal end frame member that is composed of the resin molded product constituting the molded interconnect device, and is configured to close the one side of the housing chamber; a signal pattern that is the metal pattern formed in a region including a first joining surface which is a joining surface with the second distal end frame member, on a surface of the first distal end frame member; and a solder material which is configured to join the first distal end frame member and the second distal end frame member.Type: ApplicationFiled: September 15, 2021Publication date: December 30, 2021Applicant: OLYMPUS CORPORATIONInventors: Daichi KODAMA, Tomokazu YAMASHITA, Takuro HORIBE, Hiroyuki MOTOHARA