Patents by Inventor Takuto Kazama
Takuto Kazama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240087798Abstract: A coil component includes a coil configured of a winding, an exterior body provided to cover the coil, and a terminal part configured to be continuous with the winding. A proximal end portion of the terminal part is buried in the exterior body. A distal end portion ahead of the proximal end portion is bent from the proximal end portion and located outside a mounting surface of the exterior body along the mounting surface.Type: ApplicationFiled: April 20, 2023Publication date: March 14, 2024Applicant: TDK CORPORATIONInventors: Junichiro URABE, Toshinori MATSUURA, Hajime KATO, Shintarou KOIKE, Kazushige TOHTA, Takuto KAZAMA, Masashi GOTOH
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Publication number: 20230411069Abstract: An electronic component includes an element body, an electric element embedded inside the element body, and an electrode terminal connected to the electric element so as to be exposed to an outer surface of the element body. The electrode terminal includes a terminal body continuously and integrally formed with a wire of the electric element embedded inside the element body and extending in a planar shape along a main surface of the element body. The wire is drawn out to an outside of the element body from the main surface of the element body to form the electrode terminal.Type: ApplicationFiled: May 19, 2023Publication date: December 21, 2023Applicant: TDK CORPORATIONInventors: Shintarou KOIKE, Kazushige TOHTA, Takuto KAZAMA, Masashi GOTOH
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Publication number: 20230377794Abstract: An electronic component includes an element body and an electrode terminal. The electrode terminal includes a terminal body extending in a planar shape along a main surface of the element body, and at least one of an outward protrusion continuously and integrally formed with the terminal body and protruding outside the main surface and an inward protrusion continuously and integrally formed with the terminal body and extending inside of the element body from the main surface.Type: ApplicationFiled: May 19, 2023Publication date: November 23, 2023Applicant: TDK CORPORATIONInventors: Kazushige TOHTA, Shintarou KOIKE, Masashi GOTOH, Takuto KAZAMA
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Patent number: 8267745Abstract: Methods for holding a workpiece with a hydrostatic pad are disclosed herein. The pad includes hydrostatic pockets formed in a face of the body directly opposed to the wafer. The pockets are adapted for receiving fluid through the body and into the pockets to provide a barrier between the body face and the workpiece while still applying pressure to hold the workpiece during grinding. The hydrostatic pads allow the wafer to rotate relative to the pads about their common axis. The pockets are oriented to reduce hydrostatic bending moments that are produced in the wafer when the grinding wheels shift or tilt relative to the hydrostatic pads, helping prevent nanotopology degradation of surfaces of the wafer commonly caused by shift and tilt of the grinding wheels.Type: GrantFiled: October 6, 2010Date of Patent: September 18, 2012Assignee: MEMC Electronic Materials, Inc.Inventors: Milind S. Bhagavat, Puneet Gupta, Roland R. Vandamme, Takuto Kazama, Noriyuki Tachi
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Patent number: 8145342Abstract: Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side grinder. The warp data is received and a nanotopography of the wafer is predicted based on the received warp data. A grinding parameter is determined based on the predicted nanotopography of the wafer. Operation of the double side grinder is adjusted based on the determined grinding parameter.Type: GrantFiled: September 27, 2010Date of Patent: March 27, 2012Assignee: MEMC Electronic Materials, Inc.Inventors: Sumeet S. Bhagavat, Roland R. Vandamme, Tomomi Komura, Tomhiko Kaneko, Takuto Kazama
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Patent number: 8066553Abstract: A hydrostatic pad for use in holding a semiconductor wafer during grinding of the wafer by grinding wheels. The pad includes hydrostatic pockets formed in a face of the body directly opposed to the wafer. The pockets are adapted for receiving fluid through the body and into the pockets to provide a barrier between the body face and the workpiece while still applying pressure to hold the workpiece during grinding. The hydrostatic pads allow the wafer to rotate relative to the pads about their common axis. The pockets are oriented to reduce hydrostatic bending moments that are produced in the wafer when the grinding wheels shift or tilt relative to the hydrostatic pads, helping prevent nanotopology degradation of surfaces of the wafer commonly caused by shift and tilt of the grinding wheels.Type: GrantFiled: January 20, 2005Date of Patent: November 29, 2011Assignee: MEMC Electronic Materials, Inc.Inventors: Milind S. Bhagavat, Puneet Gupta, Roland Vandamme, Takuto Kazama, Noriyuki Tachi
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Publication number: 20110101504Abstract: Methods for holding a workpiece with a hydrostatic pad are disclosed herein. The pad includes hydrostatic pockets formed in a face of the body directly opposed to the wafer. The pockets are adapted for receiving fluid through the body and into the pockets to provide a barrier between the body face and the workpiece while still applying pressure to hold the workpiece during grinding. The hydrostatic pads allow the wafer to rotate relative to the pads about their common axis. The pockets are oriented to reduce hydrostatic bending moments that are produced in the wafer when the grinding wheels shift or tilt relative to the hydrostatic pads, helping prevent nanotopology degradation of surfaces of the wafer commonly caused by shift and tilt of the grinding wheels.Type: ApplicationFiled: October 6, 2010Publication date: May 5, 2011Applicant: MEMC ELECTRONIC MATERIALS, INC.Inventors: Milind S. Bhagavat, Puneet Gupta, Roland R. Vandamme, Takuto Kazama, Noriyuki Tachi
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Patent number: 7930058Abstract: Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side grinder. The warp data is received and a nanotopography of the wafer is predicted based on the received warp data. A grinding parameter is determined based on the predicted nanotopography of the wafer. Operation of the double side grinder is adjusted based on the determined grinding parameter.Type: GrantFiled: December 31, 2007Date of Patent: April 19, 2011Assignee: MEMC Electronic Materials, Inc.Inventors: Sumeet S. Bhagavat, Roland R. Vandamme, Tomomi Komura, Tomohiko Kaneko, Takuto Kazama
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Publication number: 20110045740Abstract: Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side grinder. The warp data is received and a nanotopography of the wafer is predicted based on the received warp data. A grinding parameter is determined based on the predicted nanotopography of the wafer. Operation of the double side grinder is adjusted based on the determined grinding parameter.Type: ApplicationFiled: September 27, 2010Publication date: February 24, 2011Applicant: MEMC ELECTRONIC MATERIALS, INC.Inventors: Sumeet S. Bhagavat, Roland R. Vandamme, Tomomi Komura, Tomohiko Kaneko, Takuto Kazama
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Publication number: 20080166948Abstract: Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side grinder. The warp data is received and a nanotopography of the wafer is predicted based on the received warp data. A grinding parameter is determined based on the predicted nanotopography of the wafer. Operation of the double side grinder is adjusted based on the determined grinding parameter.Type: ApplicationFiled: December 31, 2007Publication date: July 10, 2008Applicant: MEMC ELECTRONIC MATERIALS, INC.Inventors: Sumeet S. Bhagavat, Roland R. Vandamme, Tomomi Komura, Tomohiko Kaneko, Takuto Kazama
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Publication number: 20080020684Abstract: A hydrostatic pad for use in holding a semiconductor wafer during grinding of the wafer by grinding wheels. The pad includes hydrostatic pockets formed in a face of the body directly opposed to the wafer The pockets are adapted for receiving fluid through the body and into the pockets to provide a barrier between the body face and the workpiece while still applying pressure to hold the workpiece during grinding. The hydrostatic pads allow the wafer to rotate relative to the pads about their common axis. The pockets are oriented to reduce hydrostatic bending moments that are produced in the wafer when the grinding wheels shift or tilt relative to the hydrostatic pads, helping prevent nanotopology degradation of surfaces of the wafer commonly caused by shift and tilt of the grinding wheels.Type: ApplicationFiled: January 20, 2005Publication date: January 24, 2008Applicant: MEMC ELECTRONIC MATERIALS, INCORPORATEDInventors: Milind Bhagavat, Puneet Gupta, Roland Vandamme, Takuto Kazama, Noriyuki Tachi