Patents by Inventor Takuya Kikawa

Takuya Kikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080108726
    Abstract: To provide a polycarboxylic acid resin which is obtained by reacting an epoxy resin (a) having two glycidyl groups with, e.g. itaconic acid (b) and ethylenic monocarboxylic acid (c) to obtain linear adduct polymer (A); and by reacting linear adduct polymer (A) with polybasic acid anhydride (d). According to the present invention, there are provided a polycarboxylic acid resin, its composition, and its cured product. The composition can facilely be dried upon preliminary heating and show an improved tack-free property, an excellent photo-curing property, an excellent development property in an aqueous alkali solution, and excellent physical properties such as electrical, mechanical, heat resistance, solvent resistance, adhesiveness, flexibility, etc.
    Type: Application
    Filed: October 22, 2007
    Publication date: May 8, 2008
    Inventors: Shu Guo, Takuya Kikawa, Mitsuhiro Yada, Yoshikazu Hosoda
  • Publication number: 20050261458
    Abstract: To provide a polycarboxylic acid resin which is obtained by reacting an epoxy resin (a) having two glycidyl groups with, e.g. itaconic acid (b) and ethylenic monocarboxylic acid (c) to obtain linear adduct polymer (A); and by reacting linear adduct polymer (A) with polybasic acid anhydride (d). According to the present invention, there are provided a polycarboxylic acid resin, its composition, and its cured product. The composition can facilely be dried upon preliminary heating and show an improved tack-free property, an excellent photo-curing property, an excellent development property in an aqueous alkali solution, and excellent physical properties such as electrical, mechanical, heat resistance, solvent resistance, adhesiveness, flexibility, etc.
    Type: Application
    Filed: June 13, 2003
    Publication date: November 24, 2005
    Inventors: Shu Guo, Takuya Kikawa, Mitsuhiro Yada, Yoshikazu Hosoda