Abstract: a composite material having (A) a base layer containing perfluoroalkoxy alkane and carbon fiber, (B) an intermediate layer and (C) a polytetrafluoroethylene cover layer, wherein the intermediate layer contains perfluoroalkoxy alkane is disclosed.

Abstract: A resin film according to one aspect of the present invention contains polyimide, and satisfies the condition “the electric charge change in film after irradiation with a light having a wavelength of 470 nm and an intensity of 4.0 ?W/cm2 for 30 minutes relative to before irradiation with the light is 1.0×1016 cm?3 or less.” Such a resin film can be used as a substrate for a semiconductor element to form an electronic device including the resin film, and a semiconductor element formed on the resin film.

Abstract: A composite material molded article includes a molded product of a molding material containing a resin and fibers, in which a fiber orientation degree f of the following region A of the molded product is 0.10 or more and 1 or less. Region A: in a case where a distance between one point at each of edges of a surface of a first end portion of the molded product and edges of the other end portion is measured along a vertical direction perpendicular to lateral faces of the first end portion within a surface of the molded product, and points separated from the one point by a distance equivalent to 3.0% of the distance measured from the one point are connected with a line along the edges of the first end portion, a region surrounded with the line and the edges of the molded product is regarded as a region A.