Patents by Inventor Takuya Murayama

Takuya Murayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090032232
    Abstract: A heat exchanger for exchanging heat through a heat transfer plate by flowing a primary air current and a secondary air current to a ventilation path is provided. An unit element including the heat transfer plate, and the ventilation path formed between the heat transfer plates by stacking the unit element in plural are arranged. The unit element is configured by integrally molding a spacing rib for holding a spacing of the heat transfer plate, and a shield rib for shielding leakage of the air current with resin. Furthermore, the unit element includes a stacking error detecting unit for determining a stacking error when they are stacked.
    Type: Application
    Filed: March 16, 2007
    Publication date: February 5, 2009
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventor: Takuya Murayama
  • Publication number: 20070221366
    Abstract: A heat exchanger with reduced pressure loss, and improved productivity and strength. The heat exchanger is made by laminating first heat conduction plates and second heat conduction plates alternately. A first heat conduction plate and a second heat conduction plate are integrally molded of one sheet. The sheet includes air duct ribs, heat conduction planes, air duct end faces, first protrusions, first outer peripheral ribs, second outer peripheral ribs, air duct end covers, and second protrusions.
    Type: Application
    Filed: July 16, 2004
    Publication date: September 27, 2007
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Takuya Murayama, Hiroshi Shibata
  • Patent number: 7258162
    Abstract: A heat exchanger having light weight and an excellent recycling property and capable of exhibiting high sealing property of an air flow passage without using an adhesive agent. This heat exchanger is configured by alternately laminating heat transfer plates A and heat transfer plates B which are respectively integrated by vacuum molding a polystyrene sheet into heat transfer surface, air flow passage rib, air flow passage end surface, groove A, protrusion, outer peripheral rib A, outer peripheral rib B, air flow passage end surface cover, and a groove B.
    Type: Grant
    Filed: June 5, 2003
    Date of Patent: August 21, 2007
    Assignee: Matsushita Ecology Systems Co., Ltd.
    Inventors: Hiroshi Shibata, Takuya Murayama
  • Patent number: 7166350
    Abstract: There is provided a resin molded component in which it is difficult for molding defects such as sink marks and welds and the like to occur in the design surface, and an apparatus for manufacturing the same.
    Type: Grant
    Filed: March 26, 2004
    Date of Patent: January 23, 2007
    Assignee: Altis Hashimoto Co., Ltd.
    Inventor: Takuya Murayama
  • Publication number: 20060196649
    Abstract: A heat exchanger having light weight and an excellent recycling property and capable of exhibiting high sealing property of an air flow passage without using an adhesive agent. This heat exchanger is configured by alternately laminating heat transfer plates A and heat transfer plates B which are respectively integrated by vacuum molding a polystyrene sheet into heat transfer surface, air flow passage rib, air flow passage end surface, groove A, protrusion, outer peripheral rib A, outer peripheral rib B, air flow passage end surface cover, and a groove B.
    Type: Application
    Filed: June 5, 2003
    Publication date: September 7, 2006
    Inventors: Hiroshi Shibata, Takuya Murayama
  • Publication number: 20040191475
    Abstract: There is provided a resin molded component in which it is difficult for molding defects such as sink marks and welds and the like to occur in the design surface, and an apparatus for manufacturing the same.
    Type: Application
    Filed: March 26, 2004
    Publication date: September 30, 2004
    Inventor: Takuya Murayama