Abstract: A laminated body contains a first metal layer containing copper and a second metal layer containing nickel and directly laminated on the first metal layer. A full width at half maximum of an X-ray diffraction peak having the maximum intensity among at least one X-ray diffraction peak derived from a nickel-containing crystal in the second metal layer is 0.3° or more and 1.2° or less.

Abstract: A bracket includes a base to be bonded to a surface of a side edge portion of a glass. The side edge portion and the base are joined with a combination of at least two types of adhesives. A first adhesive has a shorter curing time than a second adhesive. The second adhesive provides stronger joining after cured than the first adhesive. In the joining, the bracket is stabilized from the outside while the side edge portion and the base are in contact with each other with the first adhesive and the second adhesive interposed therebetween. The stabilization of the bracket from the outside is released upon the first adhesive being cured. Curing the second adhesive is allowed to proceed while the bracket continues to be stabilized with the first adhesive.

Abstract: Silver nanowires coated with, instead of a polymer protective agent such as PVP, an organic protective agent having a smaller molecular weight are provided. The silver nanowires have an average diameter of 100 nm or less and an average length of 5 ?m or more, and a thiol having a molecular weight of 75 to 300 is adhered on surfaces of the metal silver. The silver nanowires have a thiol containing one thiol group in the structure adhered thereon. A thiol having only one thiol group (—S—H) in a molecule is a suitable target. Examples thereof include 1-dodecanethiol, 1-decanethiol, 1-octanethiol, 3-mercapto-1,2-propanediol, monoethanolamine thioglycolate, ammonium thioglycolate, and thiomalic acid.

Abstract: Disclosed is a polymer compound for photoresist characterized in that the polymer compound is formed of a polymer compound having at least one skeleton represented by the following general formula (1), general formula (2A), general formula (2B) or general formula (2C):

Abstract: There is provided a method of forming a fine resist pattern in which a highly practicable photo-sensitive composition obtained from a material having a high transparency against an exposure light having a short wavelength such as F2 excimer laser beam is used as a resist, and the method of forming a fine resist pattern comprises a step for forming a photo-sensitive layer on a substrate or on a given layer on a substrate using a photo-sensitive composition comprising at least a compound generating an acid by irradiation of light and a compound having fluorine atom in its molecular structure, a step for exposing by selectively irradiating a given area of said photo-sensitive layer with energy ray, a step for heat-treating the exposed photo-sensitive layer, and a step for forming a fine pattern by developing the heat-treated photo-sensitive layer to selectively remove the exposed portion or un-exposed portion of the photo-sensitive layer.

Abstract: Disclosed is a polymer compound for photoresist characterized in that the polymer compound is formed of a polymer compound having at least one skeleton represented by the following general formula (1), general formula (2A), general formula (2B) or general formula (2C): 1

Abstract: A photosensitive composition comprising: an acid-decomposable compound having at least one substituent which is decomposed by an acid, forming a product which reacts with alkali solution and forms —COO— or —SO3—; and a compound which generates an acid when exposed to a chemical radiation. If necessary, the composition further comprises an alkali-soluble polymer. The acid-decomposable compound is one which is represented by the following formula (1), and the alkali-soluble polymer has a softening point of 150° C. or more and an average molecular weight of 3000 to 8000. When used as photoresist, the composition can form a fine resist pattern.

Abstract: A photosensitive composition comprising: an acid-decomposable compound having at least one substituent which is decomposed by an acid, forming a product which reacts with alkali solution and forms —COO− or —SO3−; and a compound which generates an acid when exposed to a chemical radiation. If necessary, the composition further comprises an alkali-soluble polymer. The acid-decomposable compound is one which is represented by the following formula (1), and the alkali-soluble polymer has a softening point of 150° C. or more and an average molecular weight of 3000 to 8000. When used as photoresist, the composition can form a fine resist pattern.

Abstract: A photosensitive composition comprising a polymer having a repeating segment represented by the following general formula (1A) and a compound which is capable of generating an acid by irradiation of an actinic radiation. wherein R11 is a hydrogen atom, an aliphatic hydrocarbon group, an alcoxy group, a halogen atom or a cyano group, R12 is an aliphatic hydrocarbon group or a cyclic olefin, R13 is either one of (a) a straight-chain olefin having 2 to 12 carbon atoms, a cyclic olefin or a heterocyclic group and (b) a hydrocarbon group represented by — (CH2)m—(m is an integer of 3 to 9), and R14 is a hydrophilic group.

Abstract: Disclosed is a method of forming a pattern on a substrate, comprising a step of forming a light-sensitive layer containing an aromatic compound on a substrate, a step of patternwise exposing the light-sensitive layer with a light having a wavelength range shorter than the maximum wavelength in the third absorption band from the long-wave side in the absorption spectrum of the aromatic compound and longer than the maximum wavelength in the fourth absorption band from the same, thereby to cause a photochemical reaction in the light-sensitive layer, and a step of developing the exposed light-sensitive layer, optionally after heat-treating the layer, so as to selectively remove the exposed area of the layer or leave the area as it is. The method gives a pattern having a high resolving power and an excellent dry-etching resistance.

Abstract: A photosensitive material which is very low in absorption of a light source of short wavelength and excellent in dry etch resistance. This photosensitive material comprises a compound having a terpenoid skeleton. Preferably, the compound having a terpenoid skeleton is a compound having a monovalent menthyl group or menthyl derivative group which can be represented by the general formula (1). ##STR1## wherein R is a hydrogen atom or a monovalent hydrocarbon group, R.sup.1 may be the same with or different from each other and individually represents a hydrogen atom, a halogen atom, a hydrocarbon group, a hydroxyl group, an alkoxyl group, an amino group, an alkoxy group, an amino group, an imide group, an amide group, or a sulfonyl group, a carboxyl group, a carbonyl group, or a sulfonamide group, and a pair of neighboring R.sup.1 may be connected together to form a closed ring.

Abstract: Disclosed is a method of forming a pattern on a substrate, comprising a step of forming a light-sensitive layer containing an aromatic compound on a substrate, a step of patternwise exposing the light-sensitive layer with a light having a wavelength range shorter than the maximum wavelength; in the third absorption band from the long-wave side in the absorption spectrum of the aromatic compound and longer than the maximum wavelength in the fourth absorption band from the same, thereby to cause a photochemical reaction in the light-sensitive layer, and a step of developing the exposed light-sensitive layer, optionally after heat-treating the layer, so as to selectively remove the exposed area of the layer or leave the area as it is. The method gives a pattern having a high resolving power and an excellent dry-etching resistance.

Abstract: There is disclosed a color developing resin composition comprising a base polymer, a dialdehyde represented by the general formula OHC--R.sup.1' --CHO, a diamine represented by the general formula H.sub.2 N--R.sup.2' --NH.sub.2 (at least one of R.sup.1' and R.sup.2' is an aromatic group), a compound which produces an acid by light irradiating and a resin which is crosslinked with the acid.

Abstract: Disclosed are a safe slurry photosensitive composition superior in image formation capabilities such as resolution and sensitivity and containing no harmful compound, and a safe water-soluble photosensitive composition capable of being dissolved in water without using any organic solvent while maintaining a sufficient sensitivity as a resist and containing no harmful substance. The slurry photosensitive composition contains a compound which generates an acid when irradiated with light or ionizing radiation, at least one type of a resin with acid-crosslinkability or acid-decomposability, and a powder. Various devices can be manufactured by forming a layer of this photosensitive composition on a substrate, exposing the layer to light in accordance with a desired pattern, and heating the layer. The water-soluble photosensitive composition contains a compound which generates an acid when irradiated with light or ionizing radiation, and an acetal resin.

Abstract: On a substrate a protective layer is formed which can suppress the diffusion of a contaminant from the substrate. On the protective layer, thus formed, a resin layer is formed. The resin layer comprises a photosensitive composition containing a compound which has a substituent group capable of being decomposed or cross-linked in the presence of an acid, and a compound which can generate an acid when exposed to light. The resin layer is pattern-exposed to light and then baked at a predetermined temperature. The resin layer is developed, whereby the exposed portions of the resin layer are removed or left, thus forming a pattern comprising lines and spaces each having a predetermined width. Each of the lines of the pattern has a cross-section having neither sloped profile nor undercut profile, and the pattern therefore has an improved resolution.

Abstract: A photosensitive composition comprises an alkali-soluble resin, a compound which has a substituent group decomposable by an acid and generates an alkali-soluble group upon decomposition of the substituent group, or a compound which has a substituent group capable of crosslinking the alkali-soluble resin in the presence of an acid, and a compound which generates an acid upon exposure, which is represented by formula (1) given below: ##STR1## wherein R.sub.11 represents a monovalent organic group or a monovalent organic group into which at least one selected from the group consisting of a halogen atom, a nitro group, and a cyano group is introduced, each of R.sub.12, R.sub.13, and R.sub.14 independently represents hydrogen, a halogen atom, a nitro group, a cyano group, a monovalent organic group, or a monovalent organic group into which at least one selected from the group consisting of a halogen atom, a nitro group, and a cyano group is introduced.

Abstract: A photosensitive composition comprising: an acid-decomposable compound having at least one substituent which is decomposed by an acid, forming a product which reacts with alkali solution and forms --COO.sup.- or --SO.sub.3.sup.- ; and a compound which generates an acid when exposed to a chemical radiation. If necessary, the composition further comprises an alkali-soluble polymer. The acid-decomposable compound is one which is represented by the following formula (1), and the alkali-soluble polymer has a softening point of 150.degree. C. or more and an average molecular weight of 3000 to 8000. When used as photoresist, the composition can form a fine resist pattern. ##STR1## where R.sub.1 and R.sub.2 are either the same or different, each of which represents at least one selected from the group consisting of hydrogen, halogen atom, cyano group, nitro group, silyl group, and monovalent organic group; X represents >C.dbd.O or --SO.sub.2 --; Y represents a divalent organic group; R.sub.1 and R.sub.

Abstract: Disclosed are a safe slurry photosensitive composition superior in image formation capabilities such as resolution and sensitivity and containing no harmful compound, and a safe water-soluble photosensitive composition capable of being dissolved in water without using any organic solvent while maintaining a sufficient sensitivity as a resist and containing no harmful substance. The slurry photosensitive composition contains a compound which generates an acid when irradiated with light or ionizing radiation, at least one type of a resin with acid-crosslinkability or acid-decomposability, and a powder. Various devices can be manufactured by forming a layer of this photosensitive composition on a substrate, exposing the layer to light in accordance with a desired pattern, and heating the layer. The water-soluble photosensitive composition contains a compound which generates an acid when irradiated with light or ionizing radiation, and an acetal resin.