Abstract: A method of manufacture of novolac-type phenol resin, wherein phenols and aldehydes are allowed to react with each other, a water-soluble organic phosphonic acid is used as a reaction catalyst, and a tertiary phosphine compound is used as a reaction promoter. It is preferable that the aforementioned organic phosphonic acid have the structure shown in the following general formula (1): R—PO(OH)2??(1) (R is a group which contains a carbon atom, and which contains —COON and/or —PO(OH)2).

Abstract: A method of manufacture of novolac-type phenol resin, wherein phenols and aldehydes are allowed to react with each other, a water-soluble organic phosphonic acid is used as a reaction catalyst, and a tertiary phosphine compound is used as a reaction promoter. It is preferable that the aforementioned organic phosphonic acid have the structure shown in the following general formula (1): R—PO(OH)2 ??(1) (R is a group which contains a carbon atom, and which contains —COON and/or —PO(OH)2).

Abstract: The present invention provides a film adhesive comprising, as the main constituent, a polyimide resin having a glass transition temperature of 350.degree. C. or lower and soluble in organic solvents, which polyimide resin is obtained by reacting at least one of the following acid components (A) and (B)(A) 4,4'-oxydiphthalic acid dianhydride(B) 3,3',4,4'-biphenyltetracarboxylic acid dianhydride and/or 3,3',4,4'-benzophenonetetracarboxylic acid dianhydridewith at least one of the following amine components (C) and (D)(C) a siloxane compound represented by the following general formula (1) and/or 2,2-bis(4-(4-amino-phenoxy)phenyl)propane ##STR1## wherein R.sub.1 and R.sub.2 are each a bivalent aliphatic (C.sub.1-4) or aromatic group; R.sub.3, R.sub.4, R.sub.5 and R.sub.6 are each a mono-valent aliphatic or aromatic group; and k is an integer of 1-20,(D) bis(aminophenoxy)benzene and/or dimethylphenylene-diamineto give rise to ring closure of imide, as well as a process for producing said film adhesive.

Abstract: There are provided a process for producing a two-layered tape for TAB, which comprises forming desired holes in a semi-cured polyamic acid film formed on a release film or in a semi-cured polyamic acid film subjected to stretching of 10% or more, then pressure-bonding the resulting film or film laminate to a conductor foil or a conductor foil on which a semi-cured light-transmittable polyamic acid film is formed, so that the polyamic acid film and the conductor foil contact with each other or the two polyamic acid films contact with each other, conducting imidization, and thereafter forming a desired pattern in the conductor foil; a process for producing a stretched polyamic acid film by subjecting a polyamic acid film to stretching of 10% or more; and a process for producing a flexible base board for printed circuit or a flexible printed circuit board with a cover layer, both using said stretched polyamic acid film.