Patents by Inventor Takuyuki MURAMOTO

Takuyuki MURAMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device having through-substrate via with insulating portion
    Patent number: 9054081
    Abstract: A semiconductor device includes an isolation portion penetrating a semiconductor substrate from a first surface to a second surface positioned opposite the first surface. The isolation portion includes a first insulating film and a second insulating film. The first insulating film has a slit portion at a side of the first surface and the slit portion is buried with the second insulating film. The semiconductor device further includes an electrode penetrating the semiconductor substrate that is surrounded by the isolation portion.
    Type: Grant
    Filed: July 27, 2012
    Date of Patent: June 9, 2015
    Assignee: PS4 LUXCO S.A.R.L.
    Inventors: Nobuyuki Nakamura, Takuyuki Muramoto, Takeo Tsukamoto
  • SEMICONDUCTOR DEVICE
    Publication number: 20130026599
    Abstract: A semiconductor device includes an isolation portion penetrating a semiconductor substrate from a first surface to a second surface positioned opposite the first surface. The isolation portion includes a first insulating film and a second insulating film. The first insulating film has a slit portion at a side of the first surface and the slit portion is buried with the second insulating film. The semiconductor device further includes an electrode penetrating the semiconductor substrate that is surrounded by the isolation portion.
    Type: Application
    Filed: July 27, 2012
    Publication date: January 31, 2013
    Applicant: Elpida Memory, Inc.
    Inventors: Nobuyuki NAKAMURA, Takuyuki MURAMOTO, Takeo TSUKAMOTO