Abstract: A modularized air-impingement cooling apparatus is provided for removing heat from integrated circuit components mounted to a circuit board configured for insertion into a computer backplane. In general, pin-fin designed heat sinks are attached to the electronic components requiring heat removal. First and second baffle members are attached in spaced relation to the circuit board and to one another for defining adjacent inlet and exhaust plenums, with multi-jet nozzle arrays admitting air between the two. Walls surround the components to thermally isolate one component from another and to define pockets in flow communication with the exhaust plenum. An air-moving device is utilized to draw air into the inlet plenum which air is then directed through the nozzles to the components to remove heat therefrom and from the pockets, which spent air is then exhausted through the exhaust plenum.