Abstract: The invention is to provide a transfer/inspection apparatus capable of inspecting any defect even during transferring and to provide a transfer/inspection apparatus capable of inspecting any defect in a non-contact state during transferring, even if the an object to be transferred is a transparent material. The transfer/inspection apparatus includes a transfer apparatus 2, and a defect inspector 3. The transfer apparatus 2 transfers a thin member 5 in a non-contacted state under control of voltage to be applied to an electrode face, and the defect inspector inspects any defect of the thin member during transferring the thin member. The transfer apparatus 2 is preferably provided with a light beam-transmitting portion (omitted portion 15) at a part of the electrode face for allowing the light beam therethrough.

Abstract: The present invention is characterized in that a powdery or granular resin composition stirred and melted in an agitating pot having a heater by rotating an agitating rod projecting from a tip of an agitating plunger, the agitated and melted resin composition is taken out and formed in the form of a package under pressure, and the formed resin composition is fitted to a compression plunger inside a cavity of a lower molding unit, a semiconductor package is molded by encapsulating under pressurizing with the compression plunger. Even when the wires are thinned and arranged at a higher density, the above producing method can provide such method and apparatus for producing the resin-encapsulated type semiconductor packages that produce less flowing of the wires.

Abstract: The invention is to provide a transfer/inspection apparatus capable of inspecting any defect even during transferring and to provide a transfer/inspection apparatus capable of inspecting any defect in a non-contact state during transferring, even if the an object to be transferred is a transparent material. The transfer/inspection apparatus includes a transfer apparatus 2, and a defect inspector 3. The transfer apparatus 2 transfers a thin member 5 in a non-contacted state under control of voltage to be applied to an electrode face, and the defect inspector inspects any defect of the thin member during transferring the thin member. The transfer apparatus 2 is preferably provided with a light beam-transmitting portion (omitted portion 15) at a part of the electrode face for allowing the light beam therethrough.

Abstract: The present invention is characterized in that a powdery or granular resin composition stirred and melted in an agitating pot having a heater, the agitated and melted resin composition is taken out and formed in the form of a package under pressure, and the formed resin composition is fitted to a compression plunger inside a cavity of a lower molding unit, a semiconductor package is molded by sealing under pressurizing with the compression plunger. Even when the wires are thinned and arranged at a higher density, the above producing method can provide such method and apparatus for producing the resin-sealed type semiconductor packages that produce less flowing of the wires.

Abstract: A read-aloud device including a reading device (50) for reading a sentence information recorded on a recording medium (MY) and a voice information of a human voice that read-aloud this sentence, a display screen (31) for displaying the sentence of the sentence information read by the reading device (50), a voice reproduction circuit (55) for reproducing the voice information read by the reading device and providing a read-aloud sound corresponding to the sentence displayed on said display screen (31), a speaker (SP), and a read-aloud speed control means for controlling a read-aloud speed of the read-aloud sound outputted by the speaker (SP).