Abstract: In an IC card according to the present invention, a base sheet formed of thermoplastic material is sandwiched between a substrate sheet and a dummy sheet both formed of nonplastic material lower in thermoplasticity than the base sheet. The substrate sheet is fitted with at least one IC chip and input/output terminals electrically connected to the IC chip. First and second cover sheets formed of thermoplastic material are put individually on the outer surfaces of the substrate sheet and the dummy sheet. The cover sheet on the substrate sheet is formed with apertures through which the input/output terminals are exposed to the outside.

Abstract: A circuit board is prepared such that at least two resin substrates are laminated and bonded by thermocompression, a circuit pattern made of a resin composition containing a conductor material is formed on at least one of opposing surfaces of the substrates, a region of the substrate which corresponds to a specific portion of the circuit pattern is recessed, the specific portion of the circuit projects into the recess in accordance with plastic deformation of the substrates and the circuit pattern which is caused by thermocompression bonding, and the specific portion of the circuit pattern constitutes an exposed portion. Multilayer or three-dimensional wiring can be easily achieved in the circuit board.

Abstract: In an optical sensor, a heating element is formed on a substrate, and an amorphous semiconductor film is formed on an insulating layer covering the heating element, and is electrically insulated from the heating element. A common electrode and a plurality of electrodes are also formed on the substrate and are extended along the amorphous semiconductor film, to form cells for converting light into electrical signals, in the amorphous semiconductor film. An electric current is supplied to the heating element, to heat the amorphous semiconductor film after the film has been illuminated and photoelectric current has been picked up from the electrodes.

Abstract: A photoelectric conversion element comprises a substrate, a plurality of separate electrodes arranged in a row on the substrate, signal lead-out parts extending from the separate electrodes alternately to the left and the right in a direction perpendicular to the arranging direction of the separate electrodes, a photoelectric conversion layer covering the row of the separate electrodes, a transparent electrode formed on the photoelectric conversion layer, and a light shielding conductive layer formed on the transparent electrode. The light shielding conductive layer is shaped to shield the light beam projected toward the overlapping portion between at least those portions of the signal lead-out parts which abut against the separate electrodes and the photoelectric converison layer.

Abstract: A contact type color image sensor reads out a document image at its actual size while moving along the length of the document. The photosensitive cell arrays, each having pixel electrodes which prescribe n photosensitive cells (where n is a positive integer), are aligned on the substrate. Filter films are positioned over the cell arrays. The radiated image light is converted into the three primary color components of red, green and blue, and R, G, B color signals necessary for color reproduction of the document image are obtained from the respective cell arrays. The n photosensitive cells are arranged at a predetermined pitch p along the main scanning direction X in each array, and the cell arrays are arranged at a sub-scanning direction pitch q which is larger than the pitch p by a factor of K (where k is larger than 1 and k.times.n is a natural number).

Abstract: A contact-type color image sensor in which pixel electrodes are linearly provided in a main scanning direction and three (or four) rows thereof are arrayed in a subscanning direction, color filters for color-separating are provided to oppose the pixel electrodes, an amorphous semiconductor film is formed on the pixel electrodes, and a common transparent electrode is formed on the amorphous semiconductor film. This color image sensor allows color-separation in the subscanning direction to maximize the areas of pixel electrodes.

Abstract: A circuit board comprises a substrate made of a semi-insulating or insulating material, an insulating layer formed on the substrate and having a lower dielectric constant than the dielectric constant of the substrate, and a plurality of wiring conductors formed at predetermined intervals on the insulating layer. The insulating layer has a thickness determined according to the distance between adjacent wiring conductors and equal to 0.5 to 2.5 times the distance noted above, for the purpose of reducing cross-talk noise.

Abstract: The credit card includes an IC module having a data processing function, an insulation body for holding the IC module, and a plurality of terminals which are formed on the insulation body. The plurality of terminals are first and second contact pads to which a drive power and a data signal are supplied. The IC module is formed between the first and second contact pads.

Abstract: An image sensing device including an array of photovoltaic conversion elements on a substrate to convert incident light from an image plane to be read into electrical signals. The electrical signals are transferred to a plurality of signal reading circuits, which are constructed by a plurality of integrated circuits, via a plurality of conductive strips defining wiring patterns of non-uniform lengths formed on the substrate. The sums of the areas of the conductive strips with the areas of the electrodes to which the conductive strips are connected are made substantially equal in each of the electrode-conductive strip pairs to make the sums of the stray capacitances of the conductive strips and the interelectrode capacitances of the photovoltaic conversion elements substantially equal.

Abstract: A method for manufacturing a multilayer circuit substrate includes the step of providing an insulating substrate formed of an inorganic oxide and supporting a laminate formed by alternately laminating wiring layers of copper and insulating layers of an inorganic oxide. The uppermost layer of the laminate is constituted by a copper wiring layer. A layer of electrically conductive material capable of being subjected to wire bonding is formed by a low temperature deposition on the surface of the laminate. Subsequently, the conductive material layer is selectively removed by photoetching to allow the portion connected to part of the uppermost copper wiring layer to remain. In this manner, the pattern layer capable of wire bonding can be formed.

Abstract: A method for manufacturing a multilayer circuit substrate includes the step of providing an insulating substrate formed of an inorganic oxide and supporting a laminate formed by alternately laminating wiring layers of copper and insulating layers of an inorganic oxide. The uppermost layer of the laminate is constituted by a copper wiring layer. A layer of electrically conductive material capable of being subjected to wire bonding is formed by a low temperature deposition on the surface of the laminate. Subsequently, the conductive material layer is selectively removed by photoetching to allow the portion connected to part of the uppermost copper wiring layer to remain. In this manner, the pattern layer capable of wire bonding can be formed.

Abstract: A thermal recording device has a thermal head section and a drive section. The thermal head section is comprised of a common electrode provided on an insulation member, an insulation layer with an opening provided on the common electrode, a plurality of recording resistive elements formed on a part of the insulation layer and the insulation member, and a connection conductor layer provided on the common electrode, which is connected to the common electrode through the opening, and to one end of each of the resistive elements. The drive section selectively feeds current to the resistive elements selected according to the data to be recorded.

Abstract: In a thermal head, a resistive member forming a two-dimensional pattern to be printed on a thermosensitive recording paper is fixed on plural pairs of first and second electrodes. The first electrodes extend on a surface and are commonly connected at one end to be impressed with a first voltage. The second electrodes extend on the same surface that the first electrodes lie and are commonly connected at one end to be impressed with a second voltage lower than the first voltage. The first and second electrodes are arranged in an interdigitate fashion.

Abstract: This disclosure concerns printed wiring boards for recording or displaying information. The printed wiring board comprises an insulated substrate, a plurality of functional elements placed on the insulated substrate, a plurality of strip wires formed on the insulated substrate, each of the strip wires connected to a respective functional element, and at least two of the strip wires having different lengths such that one is longer than the other, each of the strip wires comprising a first portion having a first resistivity and a second portion having a second resistivity which is higher than the first resistivity, wherein the resistance of the second portion of the shorter strip wire is higher than the resistance of the second portion of the longer strip wire.

Abstract: Disclosed is a thermal recording apparatus comprising: a plurality of aligned thermal resistive elements; a plurality of drive elements, each serially connected to the thermal resistive elements, for driving the thermal resistive elements; a DC power source connected in parallel with the thermal resistive elements and the drive elements and having a smaller current capacity than the necessary current to simultaneously drive all the thermal resistive elements; a capacitor having a large capacitance connected, in parallel, to the DC power source; a detecting means for detecting the voltage across the capacitor and comparing it with a predetermined voltage; and, a limiting means for limiting the number of the thermal resistive elements simultaneously driven when the detected voltage falls below the predetermined voltage.