Abstract: A method for increasing the tactile feel of a glass-ceramic article includes (a) performing a first etching of a surface of the glass-ceramic article with a first etchant to create a plurality of features on the surface, wherein the first etchant comprises hydrofluoric acid and an inorganic fluoride salt, and the plurality of features comprises protrusions and recesses and (b) performing a second etching of the surface with a second etchant different from the first etchant to enlarge a distance between adjacent features of a same type, wherein the second etching occurs after the first etching, after the second etching an average distance between adjacent features of a same type is in a range from 0.5 ?m to 20 ?m and a density of features of the same type is in a range from 9,000 to 25,000 features/mm2, and a tactile feel of the surface after the second etching is greater than the tactile feel of the surface before the first etching.

Abstract: A wafer including a glass substrate is provided. The glass substrate includes a first surface defining a plane and including a surface roughness Ra of approximately 0.3 nm in an outer via region and a second surface. The glass substrate defines a plurality of vias extending from the first surface. The plurality of vias each include an entrance defined by the first surface.

Abstract: Various embodiments are related to substrates having one or more well structures with a trapezoidal cylinder shaped through hole via extending from the bottom of the well structure though the substrate.

Abstract: Disclosed herein are glass compositions with high silica content that present several advantages over glasses and other materials currently used for redistribution layers for RF, interposers, and similar applications. The glasses disclosed herein are low cost, flat glasses that have high throughput for the laser damage and etching process used to create through glass vias (TGVs). TGVs generated using the silicate glasses and processes described herein have large waist diameters, which is a desirable feature with respect to producing glass articles such as interposers.

Abstract: Various embodiments are related to substrates having one or more well structures with a trapezoidal cylinder shaped through hole via extending from the bottom of the well structure though the substrate.

Abstract: A method for increasing the tactile feel of a glass-ceramic article includes (a) performing a first etching of a surface of the glass-ceramic article with a first etchant to create a plurality of features on the surface, wherein the first etchant comprises hydrofluoric acid and an inorganic fluoride salt, and the plurality of features comprises protrusions and recesses and (b) performing a second etching of the surface with a second etchant different from the first etchant to enlarge a distance between adjacent features of a same type, wherein the second etching occurs after the first etching, after the second etching an average distance between adjacent features of a same type is in a range from 0.5 ?m to 20 ?m and a density of features of the same type is in a range from 9,000 to 25,000 features/mm2, and a tactile feel of the surface after the second etching is greater than the tactile feel of the surface before the first etching.

Abstract: A method for increasing the tactile feel of a glass-ceramic article includes (a) performing a first etching of a surface of the glass-ceramic article with a first etchant to create a plurality of features on the surface, wherein the first etchant comprises hydrofluoric acid and an inorganic fluoride salt, and the plurality of features comprises protrusions and recesses and (b) performing a second etching of the surface with a second etchant different from the first etchant to enlarge a distance between adjacent features of a same type, wherein the second etching occurs after the first etching, after the second etching an average distance between adjacent features of a same type is in a range from 0.5 ?m to 20 ?m and a density of features of the same type is in a range from 9,000 to 25,000 features/mm2, and a tactile feel of the surface after the second etching is greater than the tactile feel of the surface before the first etching.

Abstract: A method of forming a glass substrate includes providing a glass substrate having alumina, translating a pulsed laser beam on the glass substrate to form one or more pilot holes, contacting the glass substrate with an etching solution, and providing agitation. The etching solution has a pH from about 0 to about 2.0, and an etch rate is less than about 3 ?m/min. A glass substrate is disclosed having a first surface and a second surface opposite the first surface in a thickness direction, and at least one hole penetrating the first surface, wherein the at least one hole has been etched by an etching solution. A greatest distance d1 between (1) a first plane that contacts the first surface in regions that do not have the at least one hole or a deviation in a thickness of the substrate surrounding the at least one hole and (2) a surface of the deviation recessed from the first plane is less than or equal to about 0.2 ?m.

Abstract: A method etching a glass material comprises providing an etchant comprising 10-30% HF, 5-15% HNO3,and at least 10% H3PO4 by volume constituted such that the ratio HF:HNO3 by volume is in the range of 1.7:1 to 2.3:1, providing a glass material to be etched, and contacting the glass material with the etchant. The etchant desirably has no other acid components. The method may be performed with the etchant temperature within the range of 20-30° C. The glass material may be an aluminosilicate glass. Ultrasound energy may be applied to the etchant, to the glass material, or both.

Abstract: Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.

Abstract: A method of forming a glass substrate includes providing a glass substrate having alumina, translating a pulsed laser beam on the glass substrate to form one or more pilot holes, contacting the glass substrate with an etching solution, and providing agitation. The etching solution has a pH from about 0 to about 2.0, and an etch rate is less than about 3 ?m/min. A glass substrate is disclosed having a first surface and a second surface opposite the first surface in a thickness direction, and at least one hole penetrating the first surface, wherein the at least one hole has been etched by an etching solution. A greatest distance d1 between (1) a first plane that contacts the first surface in regions that do not have the at least one hole or a deviation in a thickness of the substrate surrounding the at least one hole and (2) a surface of the deviation recessed from the first plane is less than or equal to about 0.2 ?m.

Abstract: A method for increasing the tactile feel of a glass-ceramic article includes (a) performing a first etching of a surface of the glass-ceramic article with a first etchant to create a plurality of features on the surface, wherein the first etchant comprises hydrofluoric acid and an inorganic fluoride salt, and the plurality of features comprises protrusions and recesses and (b) performing a second etching of the surface with a second etchant different from the first etchant to enlarge a distance between adjacent features of a same type, wherein the second etching occurs after the first etching, after the second etching an average distance between adjacent features of a same type is in a range from 0.5 ?m to 20 ?m and a density of features of the same type is in a range from 9,000 to 25,000 features/mm2, and a tactile feel of the surface after the second etching is greater than the tactile feel of the surface before the first etching.

Abstract: A method etching a glass material comprises providing an etchant comprising 10-30% HF, 5-15% HNO3, and at least 10% H3PO4 by volume constituted such that the ratio HF:HNO3 by volume is in the range of 1.7:1 to 2.3:1, providing a glass material to be etched, and contacting the glass material with the etchant. The etchant desirably has no other acid components. The method may be performed with the etchant temperature within the range of 20-30° C. The glass material may be an aluminosilicate glass. Ultrasound energy may be applied to the etchant, to the glass material, or both.

Abstract: Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.

Abstract: Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.