Abstract: An optical semiconductor module includes a submount body having a groove buried with an insulator, an optical semiconductor device mounted on the submount body, a cap, arranged across the groove on the submount body and bonded and fixed to the submount body by a bonding member, for hermetically sealing the optical semiconductor device, and an electrical wiring layer arranged to extend from the outside of the cap on the submount body to the inside of the cap through the groove buried with the insulator. The electrical wiring layer is electrically connected to the optical semiconductor device.

Abstract: Disclosed herein is an optical interconnection device having a light source, a plurality of optical interconnecting elements, and a light-receiving element. The optical interconnecting elements are located on an output side of the light source. Each of the elements has first and second major surfaces and comprises an integral unit made of an optical semiconductor element and a grating lens having concentric annular grooves and concentric annular projections, and two electrodes formed on the first and second major surfaces, respectively. The optical semiconductor element and grating lens of each optical interconnecting element are formed on the first major surface, for emitting or receiving light. The light-receiving element is located on an output side of the optical interconnecting elements. The optical interconnecting elements are arranged at substantially regular intervals, each positioned such that the semiconductor element and the grating lens face to the same direction.

Abstract: An optical semiconductor module includes a submount body having a groove buried with an insulator, an optical semiconductor device mounted on the submount body, a cap, arranged across the groove on the submount body and bonded and fixed to the submount body by a bonding member, for hermetically sealing the optical semiconductor device, and an electrical wiring layer arranged to extend from the outside of the cap on the submount body to the inside of the cap through the groove buried with the insulator. The electrical wiring layer is electrically connected to the optical semiconductor device.