Patents by Inventor Tan Hien Boon

Tan Hien Boon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaged device with thermal enhancement and method of packaging
    Patent number: 6921974
    Abstract: A plastic ball grid array package has a heat slug which is placed onto the substrate, which has the semiconductor device attached, prior to encapsulation. The heat transfer member is initially located by guide pins and fixed in place by the encapsulation.
    Type: Grant
    Filed: March 28, 2003
    Date of Patent: July 26, 2005
    Assignee: United Test & Assembly Center Ltd.
    Inventors: Tan Hien Boon, Liu Hao, Park Soo Gil
  • Method of packaging circuit device and packaged device
    Publication number: 20040195697
    Abstract: A method of packaging circuit devices in which a heat slug is inserted into an aperture in the substrate. A heat slug is therefore incorporated into the package without adding to the total size or weight of the package.
    Type: Application
    Filed: April 1, 2003
    Publication date: October 7, 2004
    Applicant: United Test & Assembly Center Ltd.
    Inventors: Tan Hien Boon, Liu Hao, Park Soo Gill
  • Packaged device and method of packaging
    Publication number: 20040188864
    Abstract: A plastic ball grid array package has a heat slug which is placed onto the substrate, which has the semiconductor device attached, prior to encapsulation. The heat transfer member is initially located by guide pins and fixed in place by the encapsulation.
    Type: Application
    Filed: March 28, 2003
    Publication date: September 30, 2004
    Applicant: United Test & Assembly Center Ltd.
    Inventors: Tan Hien Boon, Liu Hao, Park Soo Gil
  • Die paddle enhancement for exposed pad in semiconductor packaging
    Patent number: 6380048
    Abstract: A new design is provided for the die-paddle that is used as part of a package for packaging semiconductor devices. The new design of the invention creates a space between the ground ring of the die-paddle and the surface over which the ground paddle is mounted. The new design further comprises an S-shaped segment between the ground ring and the center of the die-paddle, the S-shaped segment provides stress relieve between the ground ring and the center of the die-paddle.
    Type: Grant
    Filed: August 2, 2001
    Date of Patent: April 30, 2002
    Assignee: St Assembly Test Services Pte Ltd
    Inventors: Tan Hien Boon, Zheng Zheng, Arnel Trasporto