Abstract: A die-casting mold, includes a die insert including a mold surface with a refractory metal alloy layer and a method of manufacturing a die-casting mold, including machining a mold surface of a die insert such that the mold surface is a near net shape with respect to a workpiece and applying a refractory metal alloy layer onto the die insert.

Abstract: A shot sleeve plunger for a die-casting system includes a ceramic tip bonded to the piston rod shank via a bond layer. A die-casting system can include a shot sleeve plunger slidably received within a shot sleeve, the shot sleeve plunger having a ceramic tip bonded to a piston rod shank. A method of manufacturing a shot sleeve plunger can include bonding a ceramic tip to a piston rod shank.

Abstract: A circuit package is formed using a leadframe. The leadframe is formed or etched to align a plurality of bond pad structures above a reference plane while supporting leadframe fingers are positioned below the reference plane. Jumper wires are wirebonded between terminals on the die and the bond pads to form a package subassembly. The subassembly is encapsulated and then background to remove the leadframe fingers and surrounding frame. The bond pads which remain embedded in the encapsulation material are exposed on the lower surface of the package for connection to further conductors.

Abstract: A circuit package is formed using a leadframe. The leadframe is formed or etched to align a plurality of bond pad structures above a reference plane while supporting leadframe fingers are positioned below the reference plane. Jumper wires are wirebonded between terminals on the die and the bond pads to form a package subassembly. The subassembly is encapsulated and then background to remove the leadframe fingers and surrounding frame. The bond pads which remain embedded in the encapsulation material are exposed on the lower surface of the package for connection to further conductors.

Abstract: A substrate such as a fabric may be provided with a fragrance during washing or rinsing process by the addition to the wash water of a free-flowing solid fragrance-providing composition that comprises a fragrance deposited on a particulate carrier along with a water soluble salt of an alkali metal or an alkaline earth metal.

Abstract: A substrate cassette having a conventional form, an open container having an upper entrance and a narrow lower opening formed by two side panels and two end panels. A preferred embodiment includes a train of substrate alignment channels on the inner surfaces of the two side panels, each channel is U shaped and having planar surface with a left surface, a right surface, and a bottom surface. An arcuate curbing member disposed on a left surface in each of the substrate alignment channels. The arcuate curbing member includes a top end with a thinner sloped profile facing the upper open entrance of the cassette allowing a substrate to slide through and under a stepped lower end.

Abstract: A circuit package is formed using a leadframe. The leadframe is formed or etched to align a plurality of bond pad structures above a reference plane while supporting leadframe fingers are positioned below the reference plane. Jumper wires are wirebonded between terminals on the die and the bond pads to form a package subassembly. The subassembly is encapsulated and then background to remove the leadframe fingers and surrounding frame. The bond pads which remain embedded in the encapsulation material are exposed on the lower surface of the package for connection to further conductors.