Abstract: The present disclosure provides methods for forming conductive features in a dielectric layer without using adhesion layers or barrier layers and devices formed thereby. In some embodiments, a structure comprising a dielectric layer over a substrate, and a conductive feature disposed through the dielectric layer. The dielectric layer has a lower surface near the substrate and a top surface distal from the substrate. The conductive feature is in direct contact with the dielectric layer, and the dielectric layer comprises an implant species. A concentration of the implant species in the dielectric layer has a peak concentration proximate the top surface of the dielectric layer, and the concentration of the implant species decreases from the peak concentration in a direction towards the lower surface of the dielectric layer.

Abstract: A wafer edge trimming tool includes an abrasive tape and a holding module configured to hold the abrasive tape against portions of an edge of a rotating wafer during a wafer edge trimming process.

Abstract: Methods for processing a substrate having a structure formed thereon and a system for processing a substrate are provided. A substrate is received from first processing equipment, where the first processing equipment has formed the structure on the substrate. A lithography process is performed on the received substrate. The lithography process includes exposing the substrate under an optical condition. The lithography process further includes polishing a backside of the substrate prior to the exposing of the substrate, where the polishing is configured to remove a topographical feature of the backside of the substrate or to remove a contaminant from the backside of the substrate. The substrate does not undergo a cleaning procedure during a period of time between i) the forming of the structure on the substrate, and ii) the exposing of the substrate.

Abstract: An embodiment wafer polishing tool includes an abrasive tape, a polish head holding the abrasive tape, and a rotation module. The rotation module is configured to rotate a wafer during a wafer polishing process, and the polish head is configured to apply pressure to the abrasive tape toward a first surface of the wafer during the wafer polishing process.

Abstract: Methods for processing a substrate having a structure formed thereon and a system for processing a substrate are provided. A substrate is received from first processing equipment, where the first processing equipment has formed the structure on the substrate. A lithography process is performed on the received substrate. The lithography process includes exposing the substrate under an optical condition. The lithography process further includes polishing a backside of the substrate prior to the exposing of the substrate, where the polishing is configured to remove a topographical feature of the backside of the substrate or to remove a contaminant from the backside of the substrate. The substrate does not undergo a cleaning procedure during a period of time between i) the forming of the structure on the substrate, and ii) the exposing of the substrate.

Abstract: A heat dissipation device which is pre-built with an air vent structure uses primarily a plurality of cooling fins, which are formed into different lengths, to assemble into the heat dissipation devices of different shapes, for shunning away from other elements inside a computer host. In addition, diversion baffles of a different angle can be arranged and assembled, so as to form air ducts following an angle of wind direction, allowing an air flow to be smoothly guided in by a fan, and to quickly flow into a heat transmission zone in a gap between the cooling fins, such that a heat source can be dissipated more quickly.

Abstract: A sleeve-tightening heat dissipating module includes a pillar, a sleeve, a stand, and heat sinks, wherein the pillar is a cylinder with a wider lower part, and the sleeve can be enclosed at a circumference of the pillar and is provided with a chimb at its bottom rim for allowing the stand and heat sinks to be sheathed on it. As an inner diameter of wider part of the sleeve is smaller than an outer diameter of wider part at lower end of the pillar, the sleeve will be locked on a top end of wider part of the pillar upon assembling. If the sleeve is pressed downward, the sleeve can be expanded outward to tighten the heat sinks, so as to be assembled and fixed with the heat sinks, without a need to paste with a glue, to weld, and to anodize.

Abstract: A sleeve-tightening heat dissipating module includes a pillar, a sleeve, a stand, and heat sinks, wherein the pillar is a cylinder with a wider lower part, and the sleeve can be enclosed at a circumference of the pillar and is provided with a chimb at its bottom rim for allowing the stand and heat sinks to be sheathed on it. As an inner diameter of wider part of the sleeve is smaller than an outer diameter of wider part at lower end of the pillar, the sleeve will be locked on a top end of wider part of the pillar upon assembling. If the sleeve is pressed downward, the sleeve can be expanded outward to tighten the heat sinks, so as to be assembled and fixed with the heat sinks, without a need to paste with a glue, to weld, and to anodize.