Abstract: An enhanced integrated circuit interconnect package, method and multiple-layer integrated circuit laminate structure enable increased routing density per layer and maintains signal integrity performance. A differential signal via pair of vertical interconnect vias provide differential signaling. The vias of the differential signal via pair are positioned closely spaced together with each via offset from a center axis of an associated LGA contact, minimizing space between the differential signal vias and maintaining signal integrity performance, and providing increased available wiring signal channel.

Abstract: A child resistant drug package. The package includes a blister layer having at least one blister and a plurality of backing layers covering the blister layer. The backing layers include tabs that require sequential removal in order to gain access to the contents of the blister.