Patents by Inventor Tanmay P. Gurjar

Tanmay P. Gurjar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plasma block with integrated cooling
    Patent number: 11710630
    Abstract: Exemplary semiconductor processing systems may include a remote plasma source. The remote plasma source may include a first plasma block segment defining an inlet to an internal channel of the first plasma block segment. The first plasma block segment may also define a cooling channel between the internal channel of the first plasma block segment and a first exterior surface of the first plasma block segment. The remote plasma source may include a second plasma block segment defining an outlet from an internal channel of the second plasma block segment. The second plasma block segment may also define a cooling channel between the internal channel of the second plasma block segment and a first exterior surface of the second plasma block segment. The systems may include a semiconductor processing chamber defining an inlet fluidly coupled with the outlet from the remote plasma source.
    Type: Grant
    Filed: April 23, 2020
    Date of Patent: July 25, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Tanmay P. Gurjar, Sumit S. Patankar, Sudhir R. Gondhalekar
  • PLASMA BLOCK WITH INTEGRATED COOLING
    Publication number: 20210335603
    Abstract: Exemplary semiconductor processing systems may include a remote plasma source. The remote plasma source may include a first plasma block segment defining an inlet to an internal channel of the first plasma block segment. The first plasma block segment may also define a cooling channel between the internal channel of the first plasma block segment and a first exterior surface of the first plasma block segment. The remote plasma source may include a second plasma block segment defining an outlet from an internal channel of the second plasma block segment. The second plasma block segment may also define a cooling channel between the internal channel of the second plasma block segment and a first exterior surface of the second plasma block segment. The systems may include a semiconductor processing chamber defining an inlet fluidly coupled with the outlet from the remote plasma source.
    Type: Application
    Filed: April 23, 2020
    Publication date: October 28, 2021
    Applicant: Applied Materials, Inc.
    Inventors: Tanmay P. Gurjar, Sumit S. Patankar, Sudhir R. Gondhalekar