Patents by Inventor Tao Qin

Tao Qin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240163192
    Abstract: This application provides a fault detection method, an apparatus, and a system. The method includes: A transmit end apparatus includes, when sending a border gateway protocol BGP message used for advertising a route, a bidirectional forwarding detection discriminator BFD discriminator configured by the transmit end apparatus, to trigger a receive end apparatus to automatically create an SBFD session used for detecting reachability of a target object associated with the transmit end apparatus, where the target object may be a locator address or a next-hop address of the route.
    Type: Application
    Filed: January 12, 2024
    Publication date: May 16, 2024
    Inventors: Tao Qin, Yang Huang
  • Publication number: 20240158880
    Abstract: A micro-molybdenum-type weathering bridge steel plate disclosed by the present invention is characterized in that the steel plate is smelted from the following components by weight: C: 0.05-0.08%, Si: 0.30-0.50%, Mn: 1.25-1.35%, P: 0.010-0.014%, S?0.003%, Nb: 0.020-0.030%, Ti: 0.010-0.020%, V: 0.040-0.050%, Cu: 0.25-0.40%, Ni: 0.25-0.35%, Cr: 0.45-0.55%, Mo: 0.03-0.08%, Alt: 0.020-0.040%, and the balance from Fe and impurities. Less content of molybdenum reduces the production cost of the steel plate, the yield strength of the steel plate is 500-600 MPa, the yield strength ratio is ?0.85, and the maximum thickness of the steel plate can reach 80 mm.
    Type: Application
    Filed: November 17, 2021
    Publication date: May 16, 2024
    Applicant: NANJING IRON & STEEL CO., LTD.
    Inventors: Yixin HUANG, Mingliang QIAO, Baijie ZHAO, Chunxia TANG, Jun WANG, Qiang CUI, Linheng CHEN, Yuqun YIN, Tao LIU, Yurong QIN, Lingming MENG
  • Patent number: 11985845
    Abstract: The present disclosure discloses an encapsulation structure, an encapsulation method and a display apparatus. The encapsulation structure includes at least two encapsulation structure layers that cover an outer side of a device to be encapsulated, at least one of the at least two encapsulation structure layers includes an inorganic layer and an organic layer that are superimposed. The inorganic layer comprises a first sub-inorganic layer and a second sub-inorganic layer that are superimposed, a first opening is in the first sub-inorganic layer, a second opening is in the second sub-inorganic layer, and an elastic structure is disposed in each of the first opening and the second opening.
    Type: Grant
    Filed: August 16, 2019
    Date of Patent: May 14, 2024
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Chengjie Qin, Tao Wang, Song Zhang
  • Publication number: 20240150194
    Abstract: A low-carbon, high-purity tantalum pentoxide powder has a carbon content of no greater than 15 ppm. A preparation method for the powder includes: (1) adding a fluotantalic acid (H2TaF7) solution into a reaction kettle, controlling the temperature of the reaction kettle at 30-60° C., adding a precipitator until the pH of the reaction solution is 8-10, then stopping introducing ammonia, and aging to obtain a tantalum hydroxide slurry; (2) filtering and washing the slurry obtained in step (1), and then carrying out solid-liquid separation to obtain a tantalum hydroxide filter cake; (3) drying the filter cake obtained in step (2) to obtain white tantalum hydroxide powder; (4) calcining the tantalum hydroxide powder obtained in step (3), crushing and screening the calcined sample to obtain tantalum pentoxide powder; and (5) subjecting the tantalum pentoxide powder obtained in step (4) to heat treatment at a temperature of 1000-1500° C. to obtain the powder.
    Type: Application
    Filed: August 24, 2022
    Publication date: May 9, 2024
    Applicant: NINGXIA ORIENT TANTALUM INDUSTRY CO., LTD.
    Inventors: Shun Guo, Jinfeng Zheng, Tao Guo, Hongyuan Liang, Yuewei Cheng, Jingyi Zuo, Li Zhang, Ying Wang, Tong Liu, Hongjie Qin
  • Patent number: 11979977
    Abstract: A method for manufacturing a circuit board including: providing at least one wiring base board, the wiring base board comprising a first conductor layer, an insulation layer, and an alloy layer which are stacked in order, wherein a solder paste layer is formed on a side of the alloy layer, a part of the alloy layer is exposed out of the solder paste layer to form a thermal conductive surface; providing a core layer; and pressing two wiring base boards on two opposite sides of the core layer to form a sealed heat dissipating chamber between the thermal conductive surfaces of the two wiring base boards. The present disclosure further provides a circuit board having a heat dissipation structure.
    Type: Grant
    Filed: August 31, 2019
    Date of Patent: May 7, 2024
    Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited.
    Inventors: Hsiao-Ting Hsu, Tao-Ming Liao, Ming-Jaan Ho, Xian-Qin Hu, Fu-Yun Shen
  • Publication number: 20240142136
    Abstract: An air guide component includes an air guide assembly including an air guide plate assembly and a connector. The air guide plate assembly includes an outer air guide plate including an anti-disengagement structure and an inner air guide plate including a mounting structure having an avoidance port. The connector is disposed at the inner air guide plate and configured to be connected to an air guide drive mechanism. A part of the connector passes through the avoidance port. The connector, when at a first position, is connected to the air guide drive mechanism and is mounted and positioned through the mounting structure, and, when at a second position, is separated from the air guide drive mechanism and is limited by the mounting structure and the anti-disengagement structure.
    Type: Application
    Filed: May 24, 2021
    Publication date: May 2, 2024
    Inventors: Penglei DING, Liangrui CHEN, Tao ZHANG, Qiang QIN, Tiesheng KANG, Xianyou MAO, Hejie ZHOU
  • Publication number: 20240112984
    Abstract: A semiconductor device includes power rails formed in a backside of a wafer. A gate of a first transistor on the wafer is connected to a power rail through a via-to-backside power rail (VBPR) gate contact. A source/drain (S/D) region of a second transistor on the wafer is connected to a power rail through a VBPR S/D contact. The VBPR gate contact partially vertically overlaps a gate cut region between the first transistor and the second transistor.
    Type: Application
    Filed: September 29, 2022
    Publication date: April 4, 2024
    Inventors: Tao Li, Liqiao Qin, Ruilong Xie, Kisik Choi
  • Publication number: 20240105554
    Abstract: A semiconductor structure includes a source/drain region; a frontside source/drain contact disposed on the source/drain region, a via-to-backside power rail disposed on the frontside source/drain contact and on a portion of the source/drain region, and a backside power rail connected to the via-to-backside power rail.
    Type: Application
    Filed: September 22, 2022
    Publication date: March 28, 2024
    Inventors: Tao Li, Liqiao Qin, Devika Sarkar Grant, Nikhil Jain, Prabudhya Roy Chowdhury, Sagarika Mukesh, Kisik Choi, Ruilong Xie
  • Publication number: 20240106740
    Abstract: Disclosed is a method and an apparatus for packet forwarding, which relate to the network technology field and are applied to a network node. The method comprises: obtaining an SRV6 packet; if a function field in a target SID contains a security authentication instruction, obtaining a target argument based on an operation indicated by the security authentication instruction, and performing security authentication processing on the SRv6 packet based on the target argument; wherein, the target SID is an SID, corresponding to the network node, in a segment list carried by a header of the SRv6 packet, and the target argument is: an argument for the security authentication instruction recorded in the header; and forwarding the processed SRv6 packet to a next-hop device. By applying the solution for packet forwarding according to examples of the present disclosure, the security in forwarding the SRv6 packet along the SRv6 forwarding path can be improved.
    Type: Application
    Filed: June 29, 2021
    Publication date: March 28, 2024
    Applicant: New H3C Technologies Co., Ltd.
    Inventors: Xiangqing CHANG, Zhaoyan LEI, Tao LIN, Juan QIN
  • Publication number: 20240097599
    Abstract: A method for protecting a motor from overloading includes: acquiring a present effective value of a phase current of a motor; performing time integration on the present effective value of the phase current, to obtain a first integral value; obtaining a first threshold; performing overload detection according to the first threshold and the first integral value; determining a target limiting current for operation of the motor if an overload occurs; and controlling the operation of the motor based on the target limiting current.
    Type: Application
    Filed: November 30, 2023
    Publication date: March 21, 2024
    Inventors: Chunsheng WANG, Boliang XU, Wei XIONG, Tao QIN, An CAO
  • Publication number: 20240096951
    Abstract: A semiconductor structure is provided that includes a first FET device region including a plurality of first FETs, each first FET of the plurality of first FETs includes a first source/drain region located on each side of a functional gate structure. A second FET device region is stacked above the first FET device region and includes a plurality of second FETs, each second FET of the plurality of second FETs includes a second source/drain region located on each side of a functional gate structure. The structure further includes at least one first front side contact placeholder structure located adjacent to one of the first source/drain regions of at least one the first FETs, and at least one second front side contact placeholder structure located adjacent to at least one of the second source/drain regions of at one of the second FETs.
    Type: Application
    Filed: September 16, 2022
    Publication date: March 21, 2024
    Inventors: Sagarika Mukesh, Tao Li, Prabudhya Roy Chowdhury, Liqiao Qin, Nikhil Jain, Ruilong Xie
  • Publication number: 20240093142
    Abstract: The present invention relates to the fields of microorgan-isms, feed, food and ecological restoration, in particular to a strain for degrading deoxynivalenol (DON) and the use thereof. The strain has the deposit number CCTCC No. M 2020565. The strain can grow by means of taking the toxic compound DON as a sole carbon source, and convert the DON into chemical components for itself. The reaction process is irreversible, the reaction conditions are moderate, and secondary pollu-tion cannot be caused. The strain provided in the present invention can be used for preparing a biological detoxification preparation for DON. The strain provided in the present invention can be used for degrading DON in feed and food raw materials, primary processing products, deep processing products and related processing byproducts. The strain provided in the present invention can be applied to various ecosystems such as soil or bodies of water polluted by DON to achieve the purposes of DON degradation and ecological restoration.
    Type: Application
    Filed: November 11, 2021
    Publication date: March 21, 2024
    Inventors: Huiying LUO, Honghai ZHANG, Bin YAO, Huoqing HUANG, Yaru WANG, Yingguo BAI, Xiaoyun SU, Yuan WANG, Tao TU, Jie ZHANG, Huimin YU, Xing QIN, Xiaolu WANG
  • Publication number: 20240096752
    Abstract: A semiconductor device includes a backside power rail; a transistor source/drain structure that has a backside facing the backside power rail and has a frontside facing away from the backside power rail; and a via disposed between and electrically connecting the backside power rail and the source/drain structure. The via includes a buried portion that is disposed between the backside power rail and the backside of the transistor source/drain structure. A part of the buried portion overlaps and contacts at least a part of the backside of the source/drain structure. The via also includes a side portion that is electrically connected with the buried portion and extends along a vertical side of the source/drain structure between the frontside and the backside; and a top portion that is electrically connected with the side portion and covers at least a part of the frontside of the source/drain structure.
    Type: Application
    Filed: September 16, 2022
    Publication date: March 21, 2024
    Inventors: Tao Li, Sagarika Mukesh, Liqiao Qin, Prabudhya Roy Chowdhury, Kisik Choi, Ruilong Xie
  • Patent number: 11923875
    Abstract: Provided is a dynamic Huffman encoding method based on a sorting network. Compared with traditional dynamic Huffman coding solutions, the method implements sorting on the basis of the sorting network, therefore the sorting process is not only stable, but also may ensure a stable sorting result; and moreover, sorting steps and related operations are simpler, thereby greatly simplifying the sorting and iteration processes, and thus the sorting efficiency is higher. In addition, the sorting process better facilitates program implementation and transplantation, and implementation of hardware and software may achieve good effects. In addition, the present disclosure further provides a dynamic Huffman coding apparatus and device based on a sorting network, and a readable storage medium, and the technical effects thereof correspond to the technical effects of the above method.
    Type: Grant
    Filed: December 30, 2021
    Date of Patent: March 5, 2024
    Assignee: INSPUR SUZHOU INTELLIGENT TECHNOLOGY CO., LTD.
    Inventors: Zhen Qin, Tao Yuan, Zhen Wang, Jinfu Wang
  • Publication number: 20240071925
    Abstract: Semiconductor devices and methods of forming the same include a semiconductor base having a first width. A semiconductor device over the semiconductor base has a second width that is greater than the first width. A power rail is beneath the semiconductor base. A conductive contact extends from a top of the semiconductor device to the power rail.
    Type: Application
    Filed: August 30, 2022
    Publication date: February 29, 2024
    Inventors: Liqiao Qin, Tao Li, Ruilong Xie, Chen Zhang, Kisik Choi
  • Publication number: 20240072146
    Abstract: A semiconductor device includes a first transistor including a first source/drain region, and a second transistor stacked on the first transistor. The second transistor includes a second source/drain region. The semiconductor device further includes a via structure disposed between a power element and the second source/drain region. The via structure includes a first via disposed on the power element, and a second via disposed on the first via, wherein the second via is angled with respect to the first via.
    Type: Application
    Filed: August 26, 2022
    Publication date: February 29, 2024
    Inventors: Liqiao Qin, Nikhil Jain, Prabudhya Roy Chowdhury, Sagarika Mukesh, Tao Li, Kisik Choi, Ruilong Xie
  • Patent number: 11890195
    Abstract: A leaflet capture device and system, and an assembling method. The leaflet capture device comprises: a wire body configured to be spiral and comprising a distal coil, an intermediate coil, and a proximal coil which are arranged in sequence; and a proximal joint comprising a proximal joint main body portion, a proximal clamping jaw, and a proximal clamping portion.
    Type: Grant
    Filed: November 18, 2021
    Date of Patent: February 6, 2024
    Assignee: SHANGHAI NEWMED MEDICAL CO., LTD.
    Inventors: Haishan Wang, Qifeng Yu, Tao Qin
  • Publication number: 20240033086
    Abstract: A leaflet capture device and system, and an assembling method. The leaflet capture device comprises: a wire body (1) configured to be spiral and comprising a distal coil (10), an intermediate coil (20), and a proximal coil (30) which are arranged in sequence; and a proximal joint (12) comprising a proximal joint main body portion (120), a proximal clamping jaw (121), and a proximal clamping portion (122).
    Type: Application
    Filed: November 18, 2021
    Publication date: February 1, 2024
    Inventors: Haishan WANG, Qifeng YU, Tao QIN
  • Publication number: 20230418433
    Abstract: A computing system for pixel-based automated testing of a navigable simulated environment includes one or more processors configured to execute, in a run-time inference phase, an application testing program. The application testing program includes a machine learning model trained to detect errors in the application under test. A screen image of the simulated environment is processed by an object detection module to determine if a key object is present in the screen image. If a key object is present in the screen image, the application testing program executes an object investigation module to generate investigation inputs to investigate the key object. If a key object is not present in the screen image, the application testing program executes an environment exploration module to generate an environment exploration action to be provided to the application under test as simulated user input.
    Type: Application
    Filed: July 17, 2023
    Publication date: December 28, 2023
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Guoqing LIU, Li ZHAO, Tao QIN, Adrian Lee BROWN, James Eugene BISCHOFF, JR., Tieyan LIU
  • Publication number: 20230346546
    Abstract: An interventional artificial heart valve (500) and a medical apparatus. The interventional artificial heart valve comprises a valve stent (1) and an anchor portion (2); the valve stent (1) comprises a body section (10) and a skirt section (120) at an inflow end; the body section (10) is internally provided with a valve leaflet portion (13); at least part of the outer surface of the skirt section (120) is covered by a flexible annular sealing member (15); the flexible annular sealing member (15) comprises a material capable of absorbing blood; at least two connecting elements (16, 17) are disposed on the side of an outflow end of the body section (10); the anchor portion (2) is provided around the periphery of the valve stent (1) and detachably connected to the connecting elements (16, 17).
    Type: Application
    Filed: November 18, 2021
    Publication date: November 2, 2023
    Inventors: QIFENG YU, TAO QIN