Abstract: Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.

Abstract: A device and method for hybrid feedback control of a switch-capacitor multi-unit voltage regulator are presented. A multi-unit switched-capacitor (SC) core includes a plurality of SC converter units, each unit with a capacitor and a plurality of switches controllable by a plurality of switching signals. Power switch drivers provide a switching signal to each SC converter unit. A secondary proactive loop circuit includes a feedback control circuit configured to control one or more of the plurality of switches. A comparator is configured to compare the regulator output voltage with a reference voltage and provide a comparator trigger signal. Ripple reduction logic is configured to receive the comparator trigger signal and provide an SC unit allocation signal. A multiplexer is configured to receive a first clock signal, a second clock signal, and the SC unit allocation signal and provide a signal to the power switch drivers.

Abstract: A light-emitting diode (LED) assembly includes an aluminum substrate, a silver layer, a distributed Bragg reflector (DBR) and an LED device. The aluminum substrate has a top surface whose length and width are each more than once centimeter. The silver layer is disposed over the entire top surface of the aluminum substrate. The DBR is disposed over the entire upper surface of the silver layer. The DBR includes an upper reflector layer and a lower reflector layer. The lower reflector layer contacts the upper surface of the silver layer. The Led device is attached to the upper reflector layer of the DBR, but the LED device is not disposed over the entire upper reflector layer. In one embodiment, the silver layer is deposited on the substrate using physical vapor deposition. In another embodiment, multiple pairs of lower reflector and higher reflector layers are included.

Abstract: Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.

Abstract: A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies.

Abstract: Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.

Abstract: Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.

Abstract: A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies.

Abstract: Solid state lamp or bulb structures are disclosed that can provide an essentially omnidirectional emission pattern from directional emitting light sources, such as forward emitting light sources. The present invention is also directed to lamp structures using active elements to assist in thermal management of the lamp structures and in some embodiments to reduce the convective thermal resistance around certain of the lamp elements to increase the natural heat convection away from the lamp. Some embodiments include integral fans or other active elements that move air over the surfaces of a heat sink, while other embodiments comprise internal fans or other active elements that can draw air internal to the lamp. The fan's movement of the air over these surfaces can agitate otherwise stagnant air to decrease the convective thermal resistance and increasing the ability of the lamp to dissipate heat generated during operation.

Abstract: An LED device with improved angular color performance has a silicone lens shaped as a portion of a sphere. The lens is molded over an array of LED dies disposed on the upper surface of a substrate. Phosphor particles are disbursed throughout the material used to mold the lens. The distance between farthest-apart edges of the LED dies is more than half of the length that the lens extends over the surface of the substrate. The distance from the top of the lens dome to the surface of the substrate is between 57% and 73% of the radius of the sphere. Shaping the lens as the top two thirds of a hemisphere reduces the non-uniformity in the emitted color such that neither of the CIE color coordinates x or y of the color changes more than 0.004 over all emission angles relative to the surface of the substrate.

Abstract: An example disclosed herein is a non-volatile storage medium including instructions relating to control of power that, when executed by a processor, cause the processor to monitor a supply of power to a regulator, decouple supply of power to the regulator when the monitored supply of power is below a predetermined level, couple a power pack to the regulator to supply power to the regulator when the monitored supply of power is below the predetermined level, and generate an Advanced Configuration and Power Interface (ACPI) G1 Sleeping state signal when the monitored supply of power is below the predetermined level.

Abstract: An LED lamp or bulb is disclosed that comprises a light source, a heat sink structure and a remote planar phosphor carrier having at least one conversion material. The phosphor carrier can be remote to the light sources and mounted to the heat sink so that heat from the phosphor carrier spreads into the heat sink. The phosphor carrier can comprise a thermally conductive transparent material and a phosphor layer, with an LED based light source mounted to the heat sink such that light from the light source passes through the phosphor carrier. At least some of the LED light is converted by the phosphor carrier, with some lamp embodiments emitting a white light combination of LED and phosphor light. The phosphor arranged according to the present invention can operate at lower temperature to thereby operate at greater phosphor conversion efficiency and with reduced heat related damage to the phosphor.

Abstract: Methods and apparatus are provided for LED packages with surface textures. In one novel aspect, microstructures are formed on surfaces of the LED package such that light extract efficiency is improved. In one embodiment, the LED package has a silicone-encapsulating layer scattered with phosphors. In another embodiment, the LED package has a leadframe substrate. The microstructure can be micro lens, micro dents, micro pillars, micro cones, or other shapes. The microstructures can be periodically arranged or randomly arranged. In one novel aspect, the compression molding process is used to form rough surfaces. The molding block or the release film is modified with microstructures. In another novel aspect, sandblasting process is used. In one embodiment, microstructures are formed on sidewalls using the sandblasting process. The hardness, the angle, and/or the size of the blasting media are selected to improve the efficiency of the LED package.

Abstract: Light emitting assemblies comprise a plurality of Light Emitting Diode (LED) dies arranged and attached to common substrate to form an LED array having a desired optimum packing density. The LED dies are wired to one another and are attached to landing pads on the substrate for receiving power from an external electrical source via an interconnect device. The assembly comprises a lens structure, wherein each LED die comprises an optical lens disposed thereover that is configured to promote optimal light transmission. Each optical lens has a diameter that is between about 1.5 to 3 times the size of a respective LED die, and is shaped in the form of a hemisphere. Fillet segments are integral with and interposed between the adjacent optical lenses, and provide sufficient space between adjacent optical lenses so that the diameters of adjacent optical lenses do not intersect with one another.

Abstract: Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.

Abstract: An LED device with improved angular color performance has a silicone lens shaped as a portion of a sphere. The lens is molded over an array of LED dies disposed on the upper surface of a substrate. Phosphor particles are disbursed throughout the material used to mold the lens. The distance between farthest-apart edges of the LED dies is more than half of the length that the lens extends over the surface of the substrate. The distance from the top of the lens dome to the surface of the substrate is between 57% and 73% of the radius of the sphere. Shaping the lens as the top two thirds of a hemisphere reduces the non-uniformity in the emitted color such that neither of the CIE color coordinates x or y of the color changes more than 0.004 over all emission angles relative to the surface of the substrate.

Abstract: A lighting device capable of generating warm or neutral white light using blue light-emitting diodes (“LEDs”), red LEDs, and/or luminescent material that responds to blue LED emission is disclosed. The lighting device includes multiple first solid-state light-emitting structures (“SLSs”), second SLSs, and balancing resistor element. The first SLS such as a string of blue LED dies connected in series is able to convert electrical energy to blue optical light, which is partially turned into longer wavelength emission by the luminescent material. The second SLS such as a red LED die is configured to convert electrical energy to red optical light, wherein the second SLSs are connected in series. While the first SLSs and second SLSs are coupled in parallel, the balancing resistor element provides load balance for current redistribution between the first and second SLSs in response to fluctuation of operating temperature.

Abstract: SSL lamps or luminaires are disclosed that combine blue, yellow (or green) and red photons or emissions to generate light with the desired characteristics. In different embodiments according to the present invention, the blue emission is not provided by an LED chip or package having a blue LED coated with a yellow phosphor, with blue light leaking through the yellow phosphor. Instead, the blue light component can be provided by other types of LED chips in the SSL luminaire such as one having a blue LED covered by a different colored conversion material, with blue light from the blue LED leaking through the different colored conversion material. In one embodiment, the blue component can be provided by an LED chip comprising a blue emitting LED covered by a conversion material that absorbs blue light and re-emits red light, with a portion of the blue light from the LED leaking through the red conversion material.

Abstract: An LED lamp or bulb is disclosed that comprises a light source, a heat sink structure and an optical cavity. The optical cavity comprises a phosphor carrier having a conversions material and arranged over an opening to the cavity. The phosphor carrier comprises a thermally conductive transparent material and is thermally coupled to the heat sink structure. An LED based light source is mounted in the optical cavity remote to the phosphor carrier with light from the light source passing through the phosphor carrier. A diffuser dome is included that is mounted over the optical cavity, with light from the optical cavity passing through the diffuser dome. The diffuser dome can disperse the light passing through it into the desired emission pattern, such as omnidirection. In one embodiment, the light source can be blue emitting LED and the phosphor carrier can include a yellow phosphor, with the LED lamp or bulb emitting a white light combination of LED and phosphor light.

Abstract: Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.