Patents by Inventor TAPOBRATA BANDYOPADHYAY

TAPOBRATA BANDYOPADHYAY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRONIC SUBSTRATE HAVING DIFFERENTIAL COAXIAL VIAS
    Publication number: 20230363083
    Abstract: An electronic substrate includes a dielectric core, a first conducting layer on a first side of the core and a second conducting layer on the second side of the core opposite the first side. At least one differential coaxial through-via includes a first inner signal through-via that is at least electrical conductor lined for a first signal path and at least a second inner signal through-via that is also at least electrical conductor lined positioned side-by-side and being dielectrically isolated from the first inner signal through-via for a second signal path. An annular-shaped outer ground shield enclosure is at least conductor lined that surrounds and is dielectrically isolated from both the first and second inner signal through-vias.
    Type: Application
    Filed: July 17, 2023
    Publication date: November 9, 2023
    Inventors: Snehamay Sinha, Tapobrata Bandyopadhyay, Markarand Ramkrishna Kulkarni
  • Electronic substrate having differential coaxial vias
    Patent number: 11800636
    Abstract: An electronic substrate includes a dielectric core, a first conducting layer on a first side of the core and a second conducting layer on the second side of the core opposite the first side. At least one differential coaxial through-via includes a first inner signal through-via that is at least electrical conductor lined for a first signal path and at least a second inner signal through-via that is also at least electrical conductor lined positioned side-by-side and being dielectrically isolated from the first inner signal through-via for a second signal path. An annular-shaped outer ground shield enclosure is at least conductor lined that surrounds and is dielectrically isolated from both the first and second inner signal through-vias.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: October 24, 2023
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Snehamay Sinha, Tapobrata Bandyopadhyay, Markarand Ramkrishna Kulkarni
  • ELECTRONIC SUBSTRATE HAVING DIFFERENTIAL COAXIAL VIAS
    Publication number: 20220015225
    Abstract: An electronic substrate includes a dielectric core, a first conducting layer on a first side of the core and a second conducting layer on the second side of the core opposite the first side. At least one differential coaxial through-via includes a first inner signal through-via that is at least electrical conductor lined for a first signal path and at least a second inner signal through-via that is also at least electrical conductor lined positioned side-by-side and being dielectrically isolated from the first inner signal through-via for a second signal path. An annular-shaped outer ground shield enclosure is at least conductor lined that surrounds and is dielectrically isolated from both the first and second inner signal through-vias.
    Type: Application
    Filed: September 23, 2021
    Publication date: January 13, 2022
    Inventors: Snehamay Sinha, Tapobrata Bandyopadhyay, Markarand Ramkrishna Kulkarni
  • Electronic substrate having differential coaxial vias
    Patent number: 11160163
    Abstract: An electronic substrate includes a dielectric core, a first conducting layer on a first side of the core and a second conducting layer on the second side of the core opposite the first side. At least one differential coaxial through-via includes a first inner signal through-via that is at least electrical conductor lined for a first signal path and at least a second inner signal through-via that is also at least electrical conductor lined positioned side-by-side and being dielectrically isolated from the first inner signal through-via for a second signal path. An annular-shaped outer ground shield enclosure is at least conductor lined that surrounds and is dielectrically isolated from both the first and second inner signal through-vias.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: October 26, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Snehamay Sinha, Tapobrata Bandyopadhyay, Makarand Ramkrishna Kulkarni
  • ELECTRONIC SUBSTRATE HAVING DIFFERENTIAL COAXIAL VIAS
    Publication number: 20190159333
    Abstract: An electronic substrate includes a dielectric core, a first conducting layer on a first side of the core and a second conducting layer on the second side of the core opposite the first side. At least one differential coaxial through-via includes a first inner signal through-via that is at least electrical conductor lined for a first signal path and at least a second inner signal through-via that is also at least electrical conductor lined positioned side-by-side and being dielectrically isolated from the first inner signal through-via for a second signal path. An annular-shaped outer ground shield enclosure is at least conductor lined that surrounds and is dielectrically isolated from both the first and second inner signal through-vias.
    Type: Application
    Filed: November 17, 2017
    Publication date: May 23, 2019
    Inventors: SNEHAMAY SINHA, TAPOBRATA BANDYOPADHYAY, MAKARAND RAMKRISHNA KULKARNI