Patents by Inventor Tarcisio Cagnin

Tarcisio Cagnin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for making metallized holes in a dielectric substrate by vacuum deposition of metals and the product obtained thereby
    Patent number: 5011761
    Abstract: A process for making metallized holes in a dielectric substrate which, after galvanic growth of the conductive paths delimited by photoresist on the substrate, includes a drilling step of the substrate and electrogalvanic creation of rivets protruding beyond the edges of the holes on the front of the substrate. The steps of completion of the conductive and resistive paths on the front, deposition of metals on the back, reinforcement of the rivets and galvanic growth of the back and of the metals deposited inside the hole then follow.
    Type: Grant
    Filed: February 27, 1989
    Date of Patent: April 30, 1991
    Assignee: Siemens Telecommunicazioni S.p.A.
    Inventors: Tarcisio Cagnin, Giampiero Ferraris