Abstract: A system includes an operational amplifier which includes a first amplifier input, a second amplifier input and an amplifier output. The system includes a first switch which includes a first terminal and includes a second terminal coupled to the first amplifier input. The system includes a second switch which includes a first terminal coupled to the first amplifier input and a second terminal coupled to the second amplifier input. The system includes a first bias current source coupled between the first amplifier input and a common potential and includes a second bias current source coupled between the first terminal of the first switch and the common potential. The system includes a feedback path between the amplifier output and the first amplifier input.

Abstract: Described examples include an apparatus including a package substrate having a die attach pad and a first semiconductor die on the die attach pad, the first semiconductor die including a transmitter. The apparatus also includes an assembly having a first plate coupled to the transmitter, a second plate separated from the first plate by a dielectric and a second semiconductor die on the die attach pad, the second semiconductor die including a receiver coupled to the second plate.

Abstract: Described examples include an apparatus including a package substrate having a die attach pad and a first semiconductor die on the die attach pad, the first semiconductor die including a transmitter. The apparatus also includes an assembly having a first plate coupled to the transmitter, a second plate separated from the first plate by a dielectric and a second semiconductor die on the die attach pad, the second semiconductor die including a receiver coupled to the second plate.

Abstract: An electronic device having a package structure with conductive leads, first and second dies in the package structure, as well as first and second conductive plates electrically coupled to the respective first and second dies and having respective first and second sides spaced apart from and directly facing one another with a portion of the package structure extending between the first side of the first conductive plate and the second side of the second conductive plate to form a capacitor. No other side of the first conductive plate directly faces a side of the second conductive plate, and no other side of the second conductive plate directly faces a side of the first conductive plate.

Abstract: A system includes a switching converter, an input voltage source coupled to an input of the switching converter, and a load coupled to an output of the switching converter. The system also includes a load sense circuit coupled to the load and configured to provide a load sense signal. The system also includes an oscillator coupled to the switching converter and configured to provide a spread spectrum modulated (SSM) clock signal to the switching converter, wherein a frequency of the SSM clock signal varies as a function of the load sense signal.

Abstract: In an example, a method of operating a repeater having an isolation barrier to isolate a host side of the repeater from a peripheral side of the repeater, the repeater operable to be coupled to a universal serial bus (USB), includes causing the host side to enter into a suspend mode. The method also includes, responsive to entering the suspend mode, disabling a host isolation transceiver at the host side. The method includes periodically enabling the host isolation transceiver to transmit a data signal from the host side to the peripheral side. The method includes exiting the suspend mode. The method also includes enabling the host isolation transceiver.

Abstract: An electronic device having a package structure with conductive leads, first and second dies in the package structure, as well as first and second conductive plates electrically coupled to the respective first and second dies and having respective first and second sides spaced apart from and directly facing one another with a portion of the package structure extending between the first side of the first conductive plate and the second side of the second conductive plate to form a capacitor. No other side of the first conductive plate directly faces a side of the second conductive plate, and no other side of the second conductive plate directly faces a side of the first conductive plate.

Abstract: DC-DC power converter architecture is disclosed. In an example, an integrated circuit includes an H-bridge switching circuit operatively coupled with a transformer. The switching circuit is compensated to account for parasitic differences between the high-side (power) and low-side (ground). For instance, PMOS transistors connected to the high-side are sized larger to substantially match on-resistance of NMOS transistors connected to the low-side (e.g., such that the on-resistances are all within a tolerance of one another, or within a tolerance of a target on-resistance value), and the NMOS transistors include additional gate-drain capacitance to substantially match gate-drain capacitance of the larger PMOS transistors (e.g., such that the gate-drain capacitances are all within a tolerance of one another, or within a tolerance of a target gate-drain capacitance value).

Abstract: An electronic device having a package structure with conductive leads, first and second dies in the package structure, as well as first and second conductive plates electrically coupled to the respective first and second dies and having respective first and second sides spaced apart from and directly facing one another with a portion of the package structure extending between the first side of the first conductive plate and the second side of the second conductive plate to form a capacitor. No other side of the first conductive plate directly faces a side of the second conductive plate, and no other side of the second conductive plate directly faces a side of the first conductive plate.

Abstract: An electronic device having a package structure with conductive leads, first and second dies in the package structure, as well as first and second conductive plates electrically coupled to the respective first and second dies and having respective first and second sides spaced apart from and directly facing one another with a portion of the package structure extending between the first side of the first conductive plate and the second side of the second conductive plate to form a capacitor. No other side of the first conductive plate directly faces a side of the second conductive plate, and no other side of the second conductive plate directly faces a side of the first conductive plate.

Abstract: A system includes a switching converter, an input voltage source coupled to an input of the switching converter, and a load coupled to an output of the switching converter. The system also includes a load sense circuit coupled to the load and configured to provide a load sense signal. The system also includes an oscillator coupled to the switching converter and configured to provide a spread spectrum modulated (SSM) clock signal to the switching converter, wherein a frequency of the SSM clock signal varies as a function of the load sense signal.

Abstract: Disclosed embodiments include a serial buffer device comprising first and second serial input/output (I/O) ports, first and second comparators, and a multiplexer having a first input coupled to the output of the first comparator and a second input coupled to the output of the second comparator. There is also a transistor, a third comparator having first and second inputs and an output, wherein the first input is coupled to the second serial I/O port, the second input is coupled to a third reference voltage source, and the output is coupled to the control terminal of the multiplexer. Additionally, the embodiment includes an impedance controlled driver circuit having an input and an output, wherein the input is coupled to the output of the third comparator and the output is coupled to the first serial I/O port.

Abstract: Described examples include an apparatus including a package substrate having a die attach pad and a first semiconductor die on the die attach pad, the first semiconductor die including a transmitter. The apparatus also includes an assembly having a first plate coupled to the transmitter, a second plate separated from the first plate by a dielectric and a second semiconductor die on the die attach pad, the second semiconductor die including a receiver coupled to the second plate.

Abstract: A digital isolator comprising a set of bipolar transistors and an inductor capacitor (LC) oscillator coupled to the set of bipolar transistors in series, wherein the LC oscillator is configured to be turned on and off based on the current applied to the set of bipolar transistors or the LC oscillator and generate a set of differential signals based on the current flowing through the set of bipolar transistors and mimicking the operational characteristics of an optocoupler.

Abstract: A digital isolator comprising a set of bipolar transistors and an inductor capacitor (LC) oscillator coupled to the set of bipolar transistors in series, wherein the LC oscillator is configured to be turned on and off based on the current applied to the set of bipolar transistors or the LC oscillator and generate a set of differential signals based on the current flowing through the set of bipolar transistors and mimicking the operational characteristics of an optocoupler.

Abstract: A device includes a transformer that further includes a primary and a secondary windings. A switch is coupled to the primary winding, and this switch is controlled by the received digital input signal. An oscillator is further formed on the secondary winding where the oscillator oscillates in response to variations of the received input signal. A detector coupled to the oscillator will then detect the oscillations in response to the variations of the received input signal. Thereafter, the detector generates a digital output based on the detected oscillations.

Abstract: A digital isolator comprising a set of bipolar transistors and an inductor capacitor (LC) oscillator coupled to the set of bipolar transistors in series, wherein the LC oscillator is configured to be turned on and off based on the current applied to the set of bipolar transistors or the LC oscillator and generate a set of differential signals based on the current flowing through the set of bipolar transistors and mimicking the operational characteristics of an optocoupler.

Abstract: A digital isolator comprising a set of bipolar transistors and an inductor capacitor (LC) oscillator coupled to the set of bipolar transistors in series, wherein the LC oscillator is configured to be turned on and off based on the current applied to the set of bipolar transistors or the LC oscillator and generate a set of differential signals based on the current flowing through the set of bipolar transistors and mimicking the operational characteristics of an optocoupler.

Abstract: A device [200, para. 16] includes a transformer [206, para. 16] that further includes a primary [208, para. 16] and a secondary [210, para. 16] windings. A switch [212, para. 20] is coupled to the primary winding, and this switch is controlled by the received digital input signal. An oscillator [216, para. 17] is further formed on the secondary winding where the oscillator oscillates in response to variations of the received input signal. [para. 19] A detector [218, para. 17] coupled to the oscillator will then detect the oscillations in response to the variations of the received input signal. Thereafter, the detector generates a digital output [108, para. 14] based on the detected oscillations. [para.