Abstract: The on-resistance of a semiconductor device is reduced. A package structure composing the semiconductor device includes a die pad, a plurality of leads, a first semiconductor chip having a power transistor and mounted on the die pad, and a second semiconductor chip including a control circuit for controlling the power transistor and mounted on the first semiconductor chip. Here, a source pad of the first semiconductor chip is electrically connected to a first lead and a seventh lead of the plurality of leads via a clip made of a material which is copper as a main component, and the width (and cross-sectional area) of the clip is larger than the width (and diameter) of a wire in plan view.

Abstract: According to one or more embodiments described herein, a method for cracking a hydrocarbon oil may include contacting the hydrocarbon oil with a fluidized cracking catalyst including an ultra-stable Y-type zeolite in a fluidized catalytic cracking unit to produce light olefins, gasoline fuel, and coke. At least 99 wt. % of the hydrocarbon oil may have a boiling point greater than 350° C. The ultra-stable Y-type zeolite may be a framework-substituted zeolite in which a part of aluminum atoms constituting a zeolite framework thereof is substituted with 0.1-5 mass % zirconium atoms and 0.1-5 mass % titanium ions on an oxide basis. The fluidized cracking catalyst may include from 3.5 wt. % to 10 wt. % of one or more Group 7 metal oxides.