Patents by Inventor Tatsuhiro Imai

Tatsuhiro Imai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5753362
    Abstract: The acrylic sheet of the invention is an acrylic sheet containing particles homogeneously dispersed in a resin matrix which does not substantially contain air bubbles and has an air bubble content of not more than 10% by volume; in which the resin matrix for constituting the acrylic sheet is a crosslinked (meth)acrylic copolymer obtained by forming a crosslinked structure among the molecules of a (meth)acrylic copolymer, which is a copolymer of 0.1-15% by weight of a polymerizable monomer having a functional group, 60-99.9% by weight of a (meth)acrylic acid alkyl ester and 0-39.9% by weight of other monomer and has a weight-average molecular weight of 150,000 to 1,200,000, by means of a polyfunctional compound having reactivity to the functional group of the polymerizable monomer for preparing the (meth)acrylic copolymer; and the particles dispersed in the resin matrix formed from the crosslinked (meth)acrylic copolymer have a mean particle diameter of 1 to 100 .mu.m and a true specific gravity of 0.2 to 3.0.
    Type: Grant
    Filed: August 11, 1995
    Date of Patent: May 19, 1998
    Assignee: Soken Chemical & Engineering Co., Ltd.
    Inventors: Susumu Kawase, Tatsuhiro Imai
  • Patent number: 5162087
    Abstract: An anisotropic conductive adhesive composition comprising an insulating adhesive component and particles dispersed in said insulating adhesive component, said anisotropic conductive adhesive composition being characterized in thatsaid insulating adhesive component comprises a copolymer of acrylic ester having an alkyl group of 1-4 carbon atoms and a maleimide derivative,5 to 60 parts by weight, based on 100 parts by weight of the copolymer, of a thermosetting resin, and0.05 to 5.0 parts by weight, based on 100 parts by weight of the copolymer, of a coupling agent, andsaid particles are metallic-layer containing particles comprising a core made of resin, a metallic layer covering said core and a resin layer formed from finely divided resin fixed by the dry blending method on the surface of said metallic layer.
    Type: Grant
    Filed: August 30, 1991
    Date of Patent: November 10, 1992
    Assignees: Soken Chemical & Engineering Co., Ltd., Chemitech Corporation
    Inventors: Hidemoto Fukuzawa, Tatsuhiro Imai, Yasuhiro Okada, Noriyuki Ousaka