Abstract: An electrical connection structure connects a piezoelectric element to a flexure with a conductive adhesive. An electrode surface is formed on the piezoelectric element, and a terminal surface is formed on the wiring member and is smoother than the electrode surface. A gold plate layer is formed on the terminal surface and is connected to the electrode surface with the conductive adhesive. At least one recess is formed by laser processing on the conductive terminal surface layer. The electrical connection structure substantially equalizes the surface roughness of the terminal surface with the gold plate layer to that of the electrode surface, improves a bonding strength on the terminal surface nearly to that on the electrode surface, enhances the reliability of electrical connection between the electrode surface and the terminal surface, maintains electrical characteristics of the terminal surface, and prevents contamination around the terminal surface.

Abstract: An element accommodation portion is formed in an electrically conductive plate member which constitutes a part of a suspension. A microactuator element comprising a piezoelectric element is located in the element accommodation portion. An electrically conductive resin member is disposed in a region covering junctions for electrically connecting the conductive plate member and the microactuator element. A pit is formed in the junction of the conductive plate member by partial-etching. A part of the conductive resin member is in the pit. A part of an outer peripheral edge of the conductive resin member is located inside an edge of the pit. The conductive resin member is covered by a cover layer.

Abstract: An electrical connection structure connects a piezoelectric element to a flexure with a conductive adhesive. An electrode surface is formed on the piezoelectric element, and a terminal surface is formed on the wiring member and is smoother than the electrode surface. A the gold plate layer is formed on the terminal surface and is connected to the electrode surface with the conductive adhesive. At least one recess is formed by laser processing on the conductive terminal surface layer. The electrical connection structure substantially equalizes the surface roughness of the terminal surface with the gold plate layer to that of the electrode surface, improves a bonding strength on the terminal surface nearly to that on the electrode surface, enhances the reliability of electrical connection between the electrode surface and the terminal surface, maintains electrical characteristics of the terminal surface, and prevents contamination around the terminal surface.

Abstract: An element accommodation portion is formed in an electrically conductive plate member which constitutes a part of a suspension. A microactuator element comprising a piezoelectric element is located in the element accommodation portion. An electrically conductive resin member is disposed in a region covering junctions for electrically connecting the conductive plate member and the microactuator element. A pit is formed in the junction of the conductive plate member by partial-etching. A part of the conductive resin member is in the pit. A part of an outer peripheral edge of the conductive resin member is located inside an edge of the pit. The conductive resin member is covered by a cover layer.