Patents by Inventor Tatsumasa Kobayashi

Tatsumasa Kobayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6875291
    Abstract: A tin layer and a zinc layer are stacked sequentially on a given substrate to form a multilayered film composed of the tin layer and the zinc layer. Then, the multilayered film is heated to a given temperature to form a tin-zinc alloy film through the diffusion of the tin elements of the tin layer into the zinc layer.
    Type: Grant
    Filed: May 16, 2002
    Date of Patent: April 5, 2005
    Assignee: Susuka National College of Technology
    Inventors: Hideyuki Kanematsu, Tatsumasa Kobayashi, Takeo Oki
  • Patent number: 6602354
    Abstract: A tin layer and a nickel layer are stacked sequentially on a given substrate to form a multilayered film composed of the tin layer and the nickel layer. Then, the multilayered film is heated to a given temperature to form a tin-nickel alloy film through the diffusion of the tin elements of the tin layer into the nickel layer.
    Type: Grant
    Filed: May 23, 2001
    Date of Patent: August 5, 2003
    Assignee: Suzuka National College of Technology
    Inventors: Hideyuki Kanematsu, Tatsumasa Kobayashi, Takeo Oki
  • Publication number: 20030024613
    Abstract: A tin layer and a zinc layer are stacked sequentially on a given substrate to form a multilayered film composed of the tin layer and the zinc layer. Then, the multilayered film is heated to a given temperature to form a tin-zinc alloy film through the diffusion of the tin elements of the tin layer into the zinc layer.
    Type: Application
    Filed: May 16, 2002
    Publication date: February 6, 2003
    Applicant: SUZUKA NATIONAL COLLEGE OF TECHNOLOGY
    Inventors: Hideyuki Kanematsu, Tatsumasa Kobayashi, Takeo Oki
  • Publication number: 20020046787
    Abstract: A tin layer and a nickel layer are stacked sequentially on a given substrate to form a multilayered film composed of the tin layer and the nickel layer. Then, the multilayered film is heated to a given temperature to form a tin-nickel alloy film through the diffusion of the tin elements of the tin layer into the nickel layer.
    Type: Application
    Filed: May 23, 2001
    Publication date: April 25, 2002
    Inventors: Hideyuki Kanematsu, Tatsumasa Kobayashi, Takeo Oki