Abstract: Provided is a resin composition that will suffer from little drop of lubricity and will offer good touch feeling even if it is used repeatedly. A resin composition superior in lubricity and touch feeling is produced by melt-mixing a water-soluble polyethylene oxide having a viscosity average molecular weight of 1,000,000 to 6,000,000, a modified polyalkylene oxide obtainable by reacting a polyalkylene oxide, a diol compound, and a diisocyanate compound together, and a thermoplastic resin together.

Abstract: The present invention provides a water-soluble polyalkylene oxide-modified product which is nonionic, has a high thickening effect and is also excellent in transparency, and an emulsion composition and a cosmetic material containing the same. More specifically, the present invention provides a water-soluble polyalkylene oxide-modified product obtained by reacting a monovalent hydrophobic alcohol, a linear diol compound, a polyalkylene oxide compound and a diisocyanate compound, and an emulsion composition and a cosmetic material containing the same.

Abstract: The present invention provides a sheet that has excellent lubricity and good touch feeling under wet conditions and suffers from little drop of the lubricity even if the sheet is used repeatedly. In the sheet of the present invention, a layer of modified polyalkylene oxide obtainable by reacting a polyalkylene oxide compound, a diol compound, and a diisocyanate compound together is directly formed on a surface of a substrate.

Abstract: The present invention provides a water-soluble polyalkylene oxide-modified product which is nonionic, has a high thickening effect and is also excellent in transparency, and an emulsion composition and a cosmetic material containing the same. More specifically, the present invention provides a water-soluble polyalkylene oxide-modified product obtained by reacting a monovalent hydrophobic alcohol, a linear diol compound, a polyalkylene oxide compound and a diisocyanate compound, and an emulsion composition and a cosmetic material containing the same.

Abstract: Provided is a resin composition which has excellent lubricity and a good touch feeling under wet conditions and suffers from little deterioration in the lubricity or the good touch feeling even if used repeatedly, and is excellent in flexibility. More specifically, the resin composition contains 100 parts by mass of a water-absorbing polymer and 60 to 500 parts by mass of a thermoplastic resin that has a type D durometer hardness (HDD) of 10 to 60.

Abstract: The present invention provides a sheet that has excellent lubricity and good touch feeling under wet conditions and suffers from little drop of the lubricity even if the sheet is used repeatedly. In the sheet of the present invention, a layer of modified polyalkylene oxide obtainable by reacting a polyalkylene oxide compound, a diol compound, and a diisocyanate compound together is directly formed on a surface of a substrate.

Abstract: Provided is a resin composition that will suffer from little drop of lubricity and will offer good touch feeling even if it is used repeatedly. A resin composition superior in lubricity and touch feeling is produced by melt-mixing a water-soluble polyethylene oxide having a viscosity average molecular weight of 1,000,000 to 6,000,000, a modified polyalkylene oxide obtainable by reacting a polyalkylene oxide, a diol compound, and a diisocyanate compound together, and a thermoplastic resin together.

Abstract: A method and apparatus for polishing chamfers made along the periphery of a semiconductor wafer designed such that when the wafer is once picked up by a rotatory suction cup of a transportation robot arm, the wafer is not released from the suction cup until the entire polishing operation is completed; in an embodiment, a circular turn table having six wafer suction cups is employed which is adapted to turn step-wise, each step consisting of a turn through an angle of 60° to transfer the wafers.

Abstract: An apparatus for polishing the notch of a wafer in an effective and efficient way, which comprises: a flexible tape carrying abrasive grains in the working face thereof; an infeed reel for feeding the tape stored thereon: a take-up reel for taking up the tape fed from the infeed reel; a motor for driving to rotate the take-up reel; a means for blowing a fluid to the backside surface to the edge portion of the notch to be in direct contact along the full periphery of the notch; and a means for oscillating the tape sideways.

Abstract: A method and an apparatus, which enable mirror-polishing a peripheral chamfered portion of a semiconductor wafer effectively, are disclosed. Mirror-polishing a peripheral side surface of the chamfered portion of the wafer, beveled surfaces thereof, and rounded edges formed between the peripheral side surface and each of the beveled surfaces, are individually carried out.

Abstract: A method and apparatus for polishing chamfers made along the periphery; of a semiconductor wafer designed such that when the wafer is once picked up by a rotatory suction cup of a transportation robot, arm, the wafer is not released from the suction cup until the entire polishing operation is completed; in an embodiment, a circular turn table having six wafer suction cups is employed which is adapted to turn step-wise, each step consisting of a turn through an angle of 60.degree. to transfer the wafers.

Abstract: An apparatus for bevelling the edge of a wafer, comprising a framework, a table rotatably mounted to the framework and capable of holding down the wafer, a buff rotatably mounted to the framework opposite the table and having a formed groove for bevelling the wafer edge, an air cylinder assembly mounted to the framework and pressing the buff by different forces on the orientation flat, the circular edge and the round joints of the wafer held down by the table, a sensor sensing the orientation flat, the circular edge and the round joints of the wafer held down by the table and producing corresponding signals, and a control controlling the air cylinder assembly to select between the forces in response to the signals. The apparatus may comprise a grooving cutter assembly removably held by the table, a lock locking the rotation of the table when the apparatus produces the formed groove in the buff, and a stopper stopping the air cylinder assembly and positioning the cutter assembly relative to the buff.

Abstract: An apparatus for polishing the periphery portion of a wafer, by which improvement on the polishing velocity may be effected and besides a more efficient spatial usage of the working layer of an abrasive tape is capable, comprising a tape holding fixed abrasive grains thereon; a feed reel for feeding the tape stored by winding itself; a take-up reel for taking up the tape by winding itself; a rotary drum inside of which both of the reels are equipped in such a manner that they are mountable or demountable, where a portion of the tape in the way from the feed reel to the take-up reel is adaptive to wind the rotary drum around the outer cylindrical surface thereof in close contact in the shape of a helicoid and one of the main faces of the wafer is positioned to be in a plane intersecting the central axis of the rotary drum at an angle.

Abstract: A polishing apparatus which can effectively polish a bottom wall of a wafer in the notch portion is disclosed. The polishing apparatus includes: a table for supporting the wafer thereon; a rotary buff having a thickness so that the periphery thereof can enter the notch portion of the wafer, and is rotated around an axis which is parallel with a plane of the surface of the wafer supported on the table; a first rotating member such as a motor for rotating the rotary buff; a movable linkage for supporting the rotary buff; an adjusting member such as a cylinder device for adjusting the pressure applied to the bottom wall of the wafer in the notch portion from the rotary buff; and a second rotating member such as a pulse motor for turning the rotary buff around a predetermined axis so that the applied pressure from the rotary buff acts on the bottom wall of the wafer in the notch portion in a direction approximately perpendicular to the surface of the bottom wall.

Abstract: An polishing apparatus which can effectively polish a bottom wall of a wafer in a notch portion is disclosed. The apparatus includes: a table for supporting the wafer thereon; a rotary buff having a thickness so that the periphery thereof can enter the notch portion of the wafer, and is rotated around an axis which is parallel with a plane of the surface of the wafer supported on the table; a first rotating member such as a motor for rotating the rotary buff; a linkage for supporting the rotary buff; an adjusting member such as a cylinder device for adjusting the pressure applied to the bottom wall of the wafer in the notch portion from the rotary buff; and a second rotating member for turning the table around a predetermined axis which is approximately parallel with the rotary axis of the rotary buff so that the applied pressure from the rotary buff acts on the bottom wall of the wafer in the notch portion in a direction approximately perpendicular to the surface of the bottom wall.

Abstract: A wafer chamfer polishing apparatus with a rotary circular dividing table, wherein the vacuum pump for pneumatically activating the wafer suction cups is mounted on an integral part of the rotary circular dividing table and the drive motors for dynamically activating the wafer suction cups are installed on an independent stationary body.

Abstract: An apparatus for polishing edge chamfers of a semiconductor wafer to mirror gloss, having a rotatory cylindrical buff formed with annular groove(s) in its side and a wafer vacuum holder capable of holding and turning the wafer circumferentially, wherein the cylindrical buff is adapted to shift axially, and the annular groove has a width substantially greater than the thickness of the wafer, and a drive mechanism for axially biasing the cylindrical buff is provided.

Abstract: A method for polishing peripheral chamfers of a semiconductor wafer comprising steps of: (a) turning a cylindrical cup-like rotatory buff having an internal polish groove formed in the inner wall surface thereof, the groove having a profile complementary to the profile of the chamfered wafer edge to be polished; (b) disposing the wafer inside the turning buff; (c) turning the wafer at a relatively low rate; and (d) pressing the wafer edge into the running internal polish groove with an appropriate pressure; furthermore there is proposed an apparatus for this novel method including the cylindrical cup-like rotatory buff as described above.