Patents by Inventor Tatsuo Okuji

Tatsuo Okuji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flow soldering process and apparatus
    Patent number: 6805282
    Abstract: There is provided a flow soldering process for mounting an electronic component onto a board by a solder material, which process is appropriate for using a lead-free solder material as the solder material. In the flow soldering process, thermal efficiency of flow soldering is improved in preheating step and/or solder material supplying step thereof. In one aspect of the present invention, a heating cover is located above a preheater, and the flow soldering is conducted while the board passes between the heating cover and the preheater. In another aspect of the present invention, a gap between a preheater and a solder bath is 20 to 60 mm. In yet another aspect of the present invention, a distance between a primary wave and a secondary wave is not larger than 60 mm.
    Type: Grant
    Filed: May 24, 2002
    Date of Patent: October 19, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yasuji Kawashima, Kenichiro Suetsugu, Shunji Hibino, Hiroaki Takano, Tatsuo Okuji, Shoshi Kabashima, Yukio Maeda, Mikiya Nakata
  • Flux applying method, flow soldering method and devices therefor and electronic circuit board
    Publication number: 20020179690
    Abstract: It is realized that a solder material is sufficiently supplied to a through hole formed through a board by a spraying mode flux applying method in a flow soldering process for mounting an electronic component onto the board by means of a solder material.
    Type: Application
    Filed: May 24, 2002
    Publication date: December 5, 2002
    Inventors: Yasuji Kawashima, Kenichiro Suetsugu, Shunji Hibino, Hiroaki Takano, Tatsuo Okuji, Shoshi Kabashima, Yukio Maeda, Mikiya Nakata
  • Method and device for flow soldering
    Publication number: 20020179693
    Abstract: There is provided a flow soldering process for mounting an electronic component onto a board by a solder material, which process is appropriate for using a lead-free solder material as the solder material.
    Type: Application
    Filed: May 24, 2002
    Publication date: December 5, 2002
    Inventors: Yasuji Kawashima, Kenichiro Suetsugu, Shunji Hibino, Hiroaki Takano, Tatsuo Okuji, Shoshi Kabashima, Yukio Maeda, Mikiya Nakata