Patents by Inventor Tatsuo Tsumiyama
Tatsuo Tsumiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20090005488Abstract: A heat resistant resin bonded grindstone is prepared by heating under pressure a molded composition comprising 20 to 50 vol. % of a polyimide resin powder, 50 to 70 vol. % of a metal powder, and 10 to 30 vol. % of a diamond powder, so that the diamond powder can be dispersed in and supported by a binder phase comprising the polyimide resin powder and the metal powder, in which the polyimide resin powder has been produced from a diamine compound comprising p-phenylenediamine and a mixture of 85 to 97 mol. % of 3,3?,4,4?-biphenyltetracarboxylic acid or its dianhydride and 15 to 3 mol. % of 2,3,3?,4?-biphenyltetracarboxylic acid or its dianhydride.Type: ApplicationFiled: October 12, 2007Publication date: January 1, 2009Applicants: Shin-Nissan Diamond Tools Mfg. Co., Ltd., Ube Industries, Ltd.Inventors: Yoshiyuki Satow, Tatsuo Tsumiyama
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Publication number: 20040229969Abstract: A foamed polyimide shaped article having heat resistance and molded to any shape obtained by molding and then calcining a mixture of pulverized pieces of a pre-foamed polyimide resin mass and a heat resistant binder and a process for production of the same comprising pulverizing a pre-foamed polyimide resin mass, mixing the pulverized pieces with a heat resistant binder, molding the mixture to a predetermined shape, then calcining it at a temperature of at least 350° C. to cure the binder and strongly bond the polyimide foam mass.Type: ApplicationFiled: April 21, 2004Publication date: November 18, 2004Applicant: Ube Industries, Ltd., a Japanese CorporationInventors: Ryoichi Sato, Tatsuo Tsumiyama, Yoshinobu Sakai, Hideki Ozawa, Fumio Aoki
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Patent number: 6797392Abstract: A polyimide/metal composite sheet is composed of a metal film and a polyimide film polyimide which is prepared by reaction of asymmetric biphenyltetracarboxylic acid dianhydride and 1,3-bis(4-aminophenoxy)benzene. The polyimide film is firmly bonded to and hardly peelable from the metal film. The polyimide film can contain a solid filler.Type: GrantFiled: June 3, 2003Date of Patent: September 28, 2004Assignee: Ube Industries, Ltd.Inventors: Akinori Shiotani, Hiroaki Yamaguchi, Fumio Aoki, Katsutoshi Washio, Tatsuo Tsumiyama
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Patent number: 6706346Abstract: A process for production of polyimide molded bodies which comprises a step in which a polyimide resin powder obtained by polymerization and imidation of p-phenylenediamine with 3,3,4,4′-biphenyltetracarboxylic acid, its ester or its dianhydride and 2,3,3′,4′-biphenyltetracarboxylic acid, its ester or its dianhydride is molded at a pressure of approximately 800-5,000 kgf/cm2, a step in which the pressurized body is subjected to calcination at about 450-550° C. under low pressure, a step in which the calcined molded body is vacuum encapsulated into a metal capsule, and a step in which the encapsulated molded body is isotropically subjected to hot compression at approximately 460-550° C. in an inert gas atmosphere such as argon. The polyimide molded bodies obtained thereby have a density in the range of 1.44-1.38 g/cm3.Type: GrantFiled: July 23, 2001Date of Patent: March 16, 2004Assignee: Ube Industries, Ltd.Inventor: Tatsuo Tsumiyama
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Publication number: 20040044123Abstract: A heat resistant resin bonded grindstone is prepared by heating under pressure a molded composition comprising 20 to 50 vol. % of a polyimide resin powder, 50 to 70 vol. % of a metal powder, and 10 to 30 vol. % of a diamond powder, so that the diamond powder can be dispersed in and supported by a binder phase comprising the polyimide resin powder and the metal powder, in which the polyimide resin powder has been produced from a diamine compound comprising p-phenylenediamine and a mixture of 85 to 97 mol. % of 3,3′,4,4′-biphenyltetracarboxylic acid or its dianhydride and 15 to 3 mol. % of 2,3,3′,4′-biphenyltetracarboxylic acid or its dianhydride.Type: ApplicationFiled: August 29, 2003Publication date: March 4, 2004Applicants: Ube Industries, Ltd., Shin-Nissan Diamond Tools Mfg. Co., Ltd.Inventors: Yoshiyuki Satow, Tatsuo Tsumiyama
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Publication number: 20030211345Abstract: A polyimide/metal composite sheet is composed of a metal film and a polyimide film polyimide which is prepared by reaction of asymmetric biphenyltetracarboxylic acid dianhydride and 1,3-bis(4-aminophenoxy)benzene. The polyimide film is firmly bonded to and hardly peelable from the metal film. The polyimide film can contain a solid filler.Type: ApplicationFiled: June 3, 2003Publication date: November 13, 2003Inventors: Akinori Shiotani, Hiroaki Yamaguchi, Fumio Aoki, Katsutoshi Washio, Tatsuo Tsumiyama
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Patent number: 6555647Abstract: A process for production of polyimide molded bodies which comprises a step in which a polyimide resin powder obtained by polymerization and imidation of p-phenylenediamine with 3,3′,4,4′-biphenyltetracarboxylic acid, its ester or its dianhydride and 2,3,3′,4′-biphenyltetracarboxylic acid, its ester or its dianhydride is molded at a pressure of approximately 3,000-5,000 kgf/cm2, and a step in which it is calcined at about 460-550° C. under low pressure. The polyimide molded bodies obtained thereby have a density in the range of 1.28-1.34 g/cm3.Type: GrantFiled: July 19, 2001Date of Patent: April 29, 2003Assignee: Ube Industries, Ltd.Inventor: Tatsuo Tsumiyama
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Publication number: 20020037995Abstract: A process for production of polyimide molded bodies which comprises a step in which a polyimide resin powder obtained by polymerization and imidation of p-phenylenediamine with 3,3,4,4′-biphenyltetracarboxylic acid, its ester or its dianhydride and 2,3,3′,4′-biphenyltetracarboxylic acid, its ester or its dianhydride is molded at a pressure of approximately 3,000-5,000 kgf/cm2, and a step in which it is calcined at about 460-550° C. under low pressure. The polyimide molded bodies obtained thereby have a density in the range of 1.28-1.34 g/cm3.Type: ApplicationFiled: July 19, 2001Publication date: March 28, 2002Applicant: Ube Industries, Ltd.Inventor: Tatsuo Tsumiyama
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Publication number: 20020030299Abstract: A process for production of polyimide molded bodies which comprises a step in which a polyimide resin powder obtained by polymerization and imidation of p-phenylenediamine with 3,3,4,4′-biphenyltetracarboxylic acid, its ester or its dianhydride and 2,3,3′, 4′-biphenyltetracarboxylic acid, its ester or its dianhydride is molded at a pressure of approximately 800-5,000 kgf/cm2, a step in which the pressurized body is subjected to calcination at about 450-550° C. under low pressure, a step in which the calcined molded body is vacuum encapsulated into a metal capsule, and a step in which the encapsulated molded body is isotropically subjected to hot compression at approximately 460-550° C. in an inert gas atmosphere such as argon. The polyimide molded bodies obtained thereby have a density in the range of 1.44-1.38 g/cm3.Type: ApplicationFiled: July 23, 2001Publication date: March 14, 2002Applicant: Ube Industries, Ltd.Inventor: Tatsuo Tsumiyama
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Patent number: 6040418Abstract: Fluorinated polymides comprising units of 2,2',5,5',6,6'-hexafluorobiphenyl-3,3',4,4'-tetracarboxylic dianhydride and aromatic diamines.Type: GrantFiled: August 4, 1998Date of Patent: March 21, 2000Assignee: Ube Industries, Ltd.Inventors: Tomohiko Yamamoto, Tatsuo Tsumiyama, Kouji Sugimoto
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Patent number: 5852165Abstract: A crystalline terpolymer polyamide produced from: (a) an equimolar salt of hexamethylenediamine with adipic acid, (b) an equimolar salt of hexamethylenediamine with terephthalic acid, and (c) 12-aminododecanoic acid or .omega.-laurolactam; a polyamide resin composition comprising (A) the terpolymer polyamide and (B) a modified polyolefin; a polyamide resin composition comprising (A) the terpolymer polyamide, (B) the modified polyolefin, and (C) polyamide 12; a polyamide resin composition comprising (A) the terpolymer polyamide and (D) an inorganic filler and/or a flame retardant; and an automotive part comprising a molding one of these terpolymer polyamide and polyamide resin compositions.Type: GrantFiled: May 30, 1995Date of Patent: December 22, 1998Assignee: UBE Industries, Ltd.Inventors: Tatsuo Tsumiyama, Tadahisa Kanayama
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Patent number: 5786423Abstract: A polyamide resin composition comprising: (A) from 50 to 92 parts by weight of a crystalline terpolymer polyamide produced from: (a) an equimolar salt of hexamethylenediamine with adipic acid, (b) an equimolar salt of hexamethylenediamine with terephthalic acid, and (c) 12-aminododecanoic acid or .omega.-laurolactam; (B) from 5 to 35 parts by weight of a modified polyolefin grafted with an .alpha.,.beta.-unsaturated carboxylic acid or an anhydride or derivative thereof; and (C) from 3 to 15 parts by weight of polyamide 12, with the total amount of the composition being 100 parts by weight.Type: GrantFiled: October 7, 1997Date of Patent: July 28, 1998Assignee: UBE Industries, Ltd.Inventors: Tatsuo Tsumiyama, Satoru Nakamoto
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Patent number: 5362448Abstract: A continuous polymerization method for laurolactam which has three stages. A prepolymerization process include steps of preliminarily heating laurolactam with 1 to 10% weight of water added, thereafter continuously feeding and passing the laurolactam from the upper part of the lower part of the longitudinal-type polymerization reaction zone, arranging a temperature decreasing gradient of 10.degree. C. or more than the upper part to the lower part directions at a polymerization temperature of 250.degree. and 300.degree. C. in the polymerization zone, and polymerizing the laurolactam under vapor pressure up to a conversion rate of 99.5% or more. A intermediate process has a step of releasing pressure from the prepolymerization product from the prepolymerization process for conversion into an intermediate product at atmospheric pressure.Type: GrantFiled: October 12, 1993Date of Patent: November 8, 1994Assignee: Ube Industries, Ltd.Inventors: Atsuo Kawakami, Toshiro Shimada, Tatsuo Tsumiyama, Hisaya Yamaguchi
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Patent number: 5336540Abstract: A connector comprising a housing comprising a resin composition comprising:(A) from 50 to 95 parts by weight of a semi-aromatic polyamide comprising (A1) an adipate of hexamethylenediamine and (A2) a terephthalate of hexamethylenediamine, where the weight ratio of the adipate of hexamethylenediamine (A1) to the terephthalate of hexamethylenediamine (A2) is from 80/20 to 50/50; and(B) from 5 to 50 parts by weight of a modified polyolefin comprising (B1) a polyolefin copolymer comprising (B11) propylene and (B12) ethylene where the molar ratio of propylene (B11) to ethylene (B12) is from 90/10 to 99/1, the polyolefin copolymer (B1) being graft-modified with (B2) from 0.05 to 5 parts by weight of an .alpha.,.beta.-unsaturated carboxylic acid, an anhydride thereof, or a derivative thereof per 100 parts by weight of the polyolefin copolymer (B1).Type: GrantFiled: December 28, 1992Date of Patent: August 9, 1994Assignees: Yazaki Corporation, UBE Industries, Ltd.Inventors: Tetsuo Kato, Masahiro Kanda, Tatsuo Tsumiyama, Satoru Nakamoto
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Patent number: 5283315Abstract: A continuous polymerization method for laurolactam which has three stages. A prepolymerization process include steps of preliminarily heating laurolactam with 1 to 10% weight of water added, thereafter continuously feeding and passing the laurolactam from the upper part of the lower part of the longitudinal-type polymerization reaction zone, arranging a temperature decreasing gradient of 10.degree. C. or more than the upper part to the lower part directions at a polymerization temperature of 250.degree. and 300.degree. C. in the polymerization zone, and polymerizing the laurolactam under vapor pressure up to a conversion rate of 99.5% or more. A intermediate process has a step of releasing pressure from the prepolymerization product from the prepolymerization process for conversion into an intermediate product at atmospheric pressure.Type: GrantFiled: August 14, 1992Date of Patent: February 1, 1994Assignee: UBE Industries, Ltd.Inventors: Atsuo Kawakami, Toshiro Shimada, Tatsuo Tsumiyama, Hisaya Yamaguchi
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Patent number: 4879341Abstract: A resin composition comprising;100 parts by weight of a mixture comprising (a) from 5 to 95% by weight of polyamide and (b) from 95 to 5% by weight of a thermoplastic polyester; and(c) from 0.5 part to 40 parts by weight of a grafted polyolefin modified product formed by graft polymerization of an addition polymer having a peroxy bond in its molecular chain to a modified polyolefin having a functional group in its molecular chain; and a molded product thereof.Type: GrantFiled: May 26, 1988Date of Patent: November 7, 1989Assignee: Ube Industries, Ltd.Inventors: Tatsuo Tsumiyama, Toshiro Shimada, Yoshifumi Akagawa, Satoru Nakamoto, Teruo Takada