Patents by Inventor Tatsuro Miura
Tatsuro Miura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11923325Abstract: A memory chip unit includes a pad electrode including first and second portions, and a memory cell array. A prober includes a probe card and a movement mechanism. The probe card includes a probe electrode to be in contact with the pad electrode, and a memory controller electrically coupled to the probe electrode and executes reading and writing on the memory cell array. The movement mechanism executes a first operation that brings the probe electrode into contact with the first portion and does not bring the probe electrode into contact with the second portion, and a second operation that does not bring the probe electrode into contact with the first portion and brings the probe electrode into contact with the second portion.Type: GrantFiled: March 15, 2022Date of Patent: March 5, 2024Assignee: Kioxia CorporationInventors: Yasuhito Yoshimizu, Takashi Fukushima, Tatsuro Hitomi, Arata Inoue, Masayuki Miura, Shinichi Kanno, Toshio Fujisawa, Keisuke Nakatsuka, Tomoya Sanuki
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Patent number: 11246239Abstract: The present disclosure provides a heatsink that can improve heat radiation efficiency of a heat radiating fin and equalize a heat input in a heat receiving portion while securing sufficient volumes of the heat receiving portion, a heat insulating portion, and a heat radiating portion even in an environment in which an installation space for the heatsink, more specifically, an installation space in a width direction of the heatsink is limited.Type: GrantFiled: September 21, 2020Date of Patent: February 8, 2022Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke Watanabe, Kenya Kawabata, Yoshikatsu Inagaki, Tatsuro Miura, Kazuaki Aotani, Toshiaki Nakamura
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Patent number: 11112186Abstract: A heatsink including: a heat transport member having a heat receiving portion thermally connected to a heating element; and a heat radiating fin group which is connected to a heat radiating portion of the heat transport member and in which a plurality of heat radiating fins is arranged, wherein the heat transport member has an integral internal space that communicates from the heat receiving portion to the heat radiating portion and that is filled with a working fluid, a heat receiving portion inner surface area increasing portion and a supporting member are provided in an internal space of the heat receiving portion, and the supporting member is in surface contact with the heat receiving portion inner surface area increasing portion.Type: GrantFiled: September 2, 2020Date of Patent: September 7, 2021Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke Watanabe, Kenya Kawabata, Yoshikatsu Inagaki, Tatsuro Miura, Kazuaki Aotani, Toshiaki Nakamura
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Patent number: 11085703Abstract: The present disclosure is to provide a heatsink that can improve heat radiation performance of a heat radiating fin while preventing dry-out of a heat receiving portion and that can equalize a heat input in the heat receiving portion in an environment in which an installation space of the heatsink is limited even when a forbidden region exists in the installation space.Type: GrantFiled: September 2, 2020Date of Patent: August 10, 2021Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke Watanabe, Kenya Kawabata, Yoshikatsu Inagaki, Tatsuro Miura, Kazuaki Aotani, Toshiaki Nakamura
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Patent number: 10996001Abstract: The present disclosure provides a heatsink that can increase a fin area of a heat radiating fin while securing sufficient volumes of a heat receiving portion, heat insulating portion, and heat radiating portion even in an environment in which an installation space for the heatsink, more specifically, an installation space in a height direction of the heatsink is limited.Type: GrantFiled: September 1, 2020Date of Patent: May 4, 2021Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke Watanabe, Kenya Kawabata, Yoshikatsu Inagaki, Tatsuro Miura, Kazuaki Aotani, Toshiaki Nakamura
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Publication number: 20210018272Abstract: The present disclosure is related to providing a heat sink that can exhibit an excellent cooling property for even a heating element generating a high amount of heat and being mounted to a narrowed space. The heat sink includes a plurality of heat pipes to be thermally connected to a heating element, and a heat dissipation section thermally connected to the plurality of heat pipes, in which in the plurality of heat pipes, at least evaporation sections to be thermally connected to the heating element have flattened portions whose cross sectional shape in a direction orthogonal to a heat transfer direction of the plurality of heat pipes is flattened, and surfaces in the flattened portions in a thickness direction are arranged facing the heating element.Type: ApplicationFiled: September 30, 2020Publication date: January 21, 2021Applicant: Furukawa Electric Co., Ltd.Inventors: Yoshikatsu INAGAKI, Yasuhiro UCHIMURA, Shuta HIKICHI, Tatsuro MIURA, Hiroshi SAKAI
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Publication number: 20210007246Abstract: The present disclosure provides a heatsink that can improve heat radiation efficiency of a heat radiating fin and equalize a heat input in a heat receiving portion while securing sufficient volumes of the heat receiving portion, a heat insulating portion, and a heat radiating portion even in an environment in which an installation space for the heatsink, more specifically, an installation space in a width direction of the heatsink is limited.Type: ApplicationFiled: September 21, 2020Publication date: January 7, 2021Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke WATANABE, Kenya KAWABATA, Yoshikatsu INAGAKI, Tatsuro MIURA, Kazuaki AOTANI, Toshiaki NAKAMURA
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Publication number: 20200400379Abstract: The present disclosure is to provide a heatsink that can improve heat radiation performance of a heat radiating fin while preventing dry-out of a heat receiving portion and that can equalize a heat input in the heat receiving portion in an environment in which an installation space of the heatsink is limited even when a forbidden region exists in the installation space.Type: ApplicationFiled: September 2, 2020Publication date: December 24, 2020Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke WATANABE, Kenya KAWABATA, Yoshikatsu INAGAKI, Tatsuro MIURA, Kazuaki AOTANI, Toshiaki NAKAMURA
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Publication number: 20200400381Abstract: The present disclosure provides a heatsink that includes a lightweight heat transport member having good pressure resistance against atmospheric pressure without impairing flowability of a gas-phase working fluid, and that can equalize a heat input in a heat receiving portion of the heat transport member.Type: ApplicationFiled: September 2, 2020Publication date: December 24, 2020Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke WATANABE, Kenya KAWABATA, Yoshikatsu INAGAKI, Tatsuro MIURA, Kazuaki AOTANI, Toshiaki NAKAMURA
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Publication number: 20200393201Abstract: The present disclosure provides a heatsink that can increase a fin area of a heat radiating fin while securing sufficient volumes of a heat receiving portion, heat insulating portion, and heat radiating portion even in an environment in which an installation space for the heatsink, more specifically, an installation space in a height direction of the heatsink is limited.Type: ApplicationFiled: September 1, 2020Publication date: December 17, 2020Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke WATANABE, Kenya KAWABATA, Yoshikatsu INAGAKI, Tatsuro MIURA, Kazuaki AOTANI, Toshiaki NAKAMURA
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Patent number: 10760855Abstract: The present disclosure is to provide a heat sink capable of improving cooling efficiency of a heat radiation fin and exhibiting excellent cooling performance with respect to a cooling target regardless of an installation posture of the heat sink, and capable of being installed even in a narrow space.Type: GrantFiled: January 31, 2020Date of Patent: September 1, 2020Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke Watanabe, Tatsuro Miura, Toshiaki Nakamura, Kenya Kawabata, Yoshikatsu Inagaki
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Patent number: 10718572Abstract: The present disclosure is to provide a heat sink capable of improving cooling efficiency of a heat radiation fin and exhibiting excellent cooling performance with respect to a cooling target regardless of an installation posture of the heat sink, and capable of being installed even in a narrow space.Type: GrantFiled: January 31, 2020Date of Patent: July 21, 2020Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke Watanabe, Tatsuro Miura, Toshiaki Nakamura, Kenya Kawabata, Yoshikatsu Inagaki
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Patent number: 10677534Abstract: The present disclosure is to provide a heat sink capable of improving cooling efficiency of a heat radiation fin and exhibiting excellent cooling performance with respect to a cooling target regardless of an installation posture of the heat sink, and capable of being installed even in a narrow space.Type: GrantFiled: January 31, 2020Date of Patent: June 9, 2020Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke Watanabe, Tatsuro Miura, Toshiaki Nakamura, Kenya Kawabata, Yoshikatsu Inagaki
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Publication number: 20200173730Abstract: The present disclosure is to provide a heat sink capable of improving cooling efficiency of a heat radiation fin and exhibiting excellent cooling performance with respect to a cooling target regardless of an installation posture of the heat sink, and capable of being installed even in a narrow space.Type: ApplicationFiled: January 31, 2020Publication date: June 4, 2020Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke WATANABE, Tatsuro MIURA, Toshiaki NAKAMURA, Kenya KAWABATA, Yoshikatsu INAGAKI
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Patent number: 10458720Abstract: A heat transfer device includes a heat pipe in which working fluid is enclosed, a heat receiving plate provided on one end side of the heat pipe and a heat radiating fin provided on the other end side of the heat pipe, a first wick and a second wick that transfer working fluid provided on an inner wall surface of the heat pipe, a bent section bent between the one end side and the other end side, and a boundary section between the first wick and the second wick disposed in a lower part in the gravity direction of the bent section of the heat pipe or the heat transfer device. The heat transfer device can improve heat transfer characteristics with a simple configuration.Type: GrantFiled: July 22, 2015Date of Patent: October 29, 2019Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Tatsuro Miura, Yoshikatsu Inagaki, Hiroshi Okada
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Patent number: 10408547Abstract: The invention provides a flattened heat pipe whose vapor flowing passage is not clogged and which has an excellent capillary force. The flattened heat pipe has a closed container formed by flattening a tubular container, a plurality of wick structures arrayed within the container in a longitudinal direction so as to form an acute-angled portion where a capillary force is large at least partially within the container, a hollow portion formed of an outer peripheral surface of the wick structure and an inner wall surface of the container and a working fluid sealed into the container.Type: GrantFiled: October 9, 2015Date of Patent: September 10, 2019Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Hideaki Kameoka, Masanobu Sugimura, Tatsuro Miura, Yasumi Sasaki, Hiroshi Okada, Shinichi Furumoto, Masaaki Yamamoto
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Patent number: 10184729Abstract: A heat pipe includes a container in which a corrugated portion is formed, the container having a hollow portion formed therein that is sealed, a wick structure provided on an inner peripheral surface of the hollow portion and a working fluid enclosed in the hollow portion. The wick structure has a vapor channel penetrating therethrough in a longitudinal direction of the hollow portion, the wick structure producing a capillary force. The wick structure is a sintered body of a powder metal material and projected into a crest portion of the corrugated portion. The wick structure is provided at a region in the crest portion of the corrugated portion and at a position of a trough portion of the corrugated portion.Type: GrantFiled: May 4, 2017Date of Patent: January 22, 2019Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Yoshikatsu Inagaki, Kenya Kawabata, Tatsuro Miura, Tomoki Yanagida
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Patent number: 10119770Abstract: A planar heat pipe includes a container having a hollow portion provided at a central portion thereof with two opposing plate-shaped bodies, and a working fluid enclosed in the hollow portion. The hollow portion is provided with a wick structure. At least one of the plate-shaped bodies is a composite member of two or more types of metal members that are laminated and integrated. A metal member of the composite member forming a layer that contacts the hollow portion has a thermal conductivity of greater than or equal to 200 W/m·K and a metal member of the composite member forming a layer that contacts an exterior has a thermal conductivity of less than or equal to 100 W/m·K, a peripheral portion of the hollow portion being sealed.Type: GrantFiled: August 17, 2015Date of Patent: November 6, 2018Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Hirofumi Aoki, Hiroshi Sakai, Tatsuro Miura, Yoshikatsu Inagaki
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Publication number: 20180172360Abstract: A heat transfer device includes a heat pipe in which working fluid is enclosed, a heat receiving plate provided on one end side of the heat pipe and a heat radiating fin provided on the other end side of the heat pipe, a first wick and a second wick that transfer working fluid provided on an inner wall surface of the heat pipe, a bent section bent between the one end side and the other end side, and a boundary section between the first wick and the second wick disposed in a lower part in the gravity direction of the bent section of the heat pipe or the heat transfer device. The heat transfer device can improve heat transfer characteristics with a simple configuration.Type: ApplicationFiled: July 22, 2015Publication date: June 21, 2018Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Tatsuro MIURA, Yoshikatsu INAGAKI, Hiroshi OKADA
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Publication number: 20170248378Abstract: A planar heat pipe includes a container having a hollow portion provided at a central portion thereof with two opposing plate-shaped bodies, and a working fluid enclosed in the hollow portion. The hollow portion is provided with a wick structure. At least one of the plate-shaped bodies is a composite member of two or more types of metal members that are laminated and integrated. A metal member of the composite member forming a layer that contacts the hollow portion has a thermal conductivity of greater than or equal to 200 W/m·K and a metal member of the composite member forming a layer that contacts an exterior has a thermal conductivity of less than or equal to 100 W/m·K, a peripheral portion of the hollow portion being sealed.Type: ApplicationFiled: August 17, 2015Publication date: August 31, 2017Inventors: Hirofumi Aoki, Hiroshi Sakai, Tatsuro Miura, Yoshikatsu Inagaki