Patents by Inventor Tatsushi Isojima

Tatsushi Isojima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230172223
    Abstract: The object of the present invention is to provide an emulsion composition that maintains emulsion stability even after high temperature process such as sterilization (heat resistance), shows a small change in particle size distribution between before and after heating, and maintains emulsion stability even under conditions where transformation of an oil phase component (for example, solidification or crystallization of the oil phase component due to temperature drop, or melting of the oil phase component due to temperature rise) occurs (temperature drop resistance), wherein the composition is easily handled during the production process. The object is solved by an oil-in-water emulsion composition containing solid particles, a predefined surfactant, an oil phase component, and an aqueous phase component, wherein the oil phase component includes a predefined oil component and the solid particles are distributed along the interface between the oil phase component and the aqueous phase component.
    Type: Application
    Filed: January 9, 2023
    Publication date: June 8, 2023
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Minako Hanasaki, Tsutashi Matsuura, Tetsuo Kasai, Tatsushi Isojima
  • Patent number: 11582981
    Abstract: The object of the present invention is to provide an emulsion composition that maintains emulsion stability even after high temperature process such as sterilization (heat resistance), shows a small change in particle size distribution between before and after heating, and maintains emulsion stability even under conditions where transformation of an oil phase component (for example, solidification or crystallization of the oil phase component due to temperature drop, or melting of the oil phase component due to temperature rise) occurs (temperature drop resistance), wherein the composition is easily handled during the production process. The object is solved by an oil-in-water emulsion composition containing solid particles, a predefined surfactant, an oil phase component, and an aqueous phase component, wherein the oil phase component includes a predefined oil component and the solid particles are distributed along the interface between the oil phase component and the aqueous phase component.
    Type: Grant
    Filed: June 7, 2019
    Date of Patent: February 21, 2023
    Assignee: MITSUBISHI CHEMICAL CORPORATION
    Inventors: Minako Hanasaki, Tsutashi Matsuura, Tetsuo Kasai, Tatsushi Isojima
  • Publication number: 20230051904
    Abstract: The present invention relates to a composition comprising: (a) at least one particle comprising at least one cationic polymer and at least one anionic polymer, at least one cationic polymer and at least one amphoteric polymer, at least one anionic polymer and at least one amphoteric polymer, or at least one amphoteric polymer, and at least one non-polymeric acid having two or more pKa values or salt(s) thereof or at least one non-polymeric base having two or more pKb values or salt(s) thereof; and (b) water, wherein the anionic polymer is selected from hyaluronic acid and derivatives thereof, and the amphoteric polymer is selected from cationized hyaluronic acid and salts thereof. The composition according to the present invention is stable, and can have a variety of cosmetic functions. The stickiness of the composition according to the present invention can be reduced.
    Type: Application
    Filed: December 4, 2020
    Publication date: February 16, 2023
    Applicant: L'Oreal
    Inventors: Toshifumi SHIROYA, Tatsushi ISOJIMA, Mariko YAMAMOTO, Takehiko KASAI, Kazuhiko MARUYAMA, Shinobu MITSUDA
  • Publication number: 20230048170
    Abstract: The present invention relates to a composition comprising: (a) at least one cationic polysaccharide; (b) at least one antioxidant; and (c) water, wherein the (b) antioxidant has at least one negatively chargeable and/or negatively charged moiety selected from the group consisting of a sulfuric group, a sulfate group, a sulfonic group, a sulfonate group, a phosphoric group, a phosphate group, a phosphonic group, a phosphonate group, a phenolic hydroxyl group, a carboxylic group, and a carboxylate group. The composition according to the present invention can include a relatively larger amount of antioxidant.
    Type: Application
    Filed: December 4, 2020
    Publication date: February 16, 2023
    Applicant: L'Oreal
    Inventors: Tatsushi ISOJIMA, Toshifumi SHIROYA, Cindy CHHUON, Kazuhiko MARUYAMA
  • Publication number: 20220362128
    Abstract: The present invention relates to a composition comprising, in at least one physiologically acceptable volatile medium: (a) at least one cationic polysaccharide; (b) at least one crosslinker having three or more acid groups or a salt thereof; (c) at least one powder; and (d) at least one polyol, wherein the (c) powder is insoluble in the physiologically acceptable volatile medium. The composition can form a film including a DIC-gel and a powder wherein the distribution of the powder in the film can be more even or more uniform.
    Type: Application
    Filed: June 2, 2020
    Publication date: November 17, 2022
    Applicant: L'OREAL
    Inventors: Tomomi Hamazaki, Toru Koike, Nozomi Takahashi, Takehiko Kasai, Tatsushi Isojima, Toshifumi Shiroya, Hidehiko Asanuma
  • Publication number: 20210092987
    Abstract: The present invention provides an oil-in-water Pickering emulsion including a solid particle, a nonionic amphiphilic substance, an oil phase component, and an aqueous phase component, the solid particle being an organic substance.
    Type: Application
    Filed: December 11, 2020
    Publication date: April 1, 2021
    Applicant: MITSUBISHI-CHEMICAL FOODS CORPORATION
    Inventors: Minako HANASAKI, Tsutashi MATSUURA, Tatsushi ISOJIMA
  • Publication number: 20190281852
    Abstract: The object of the present invention is to provide an emulsion composition that maintains emulsion stability even after high temperature process such as sterilization (heat resistance), shows a small change in particle size distribution between before and after heating, and maintains emulsion stability even under conditions where transformation of an oil phase component (for example, solidification or crystallization of the oil phase component due to temperature drop, or melting of the oil phase component due to temperature rise) occurs (temperature drop resistance), wherein the composition is easily handled during the production process. The object is solved by an oil-in-water emulsion composition containing solid particles, a predefined surfactant, an oil phase component, and an aqueous phase component, wherein the oil phase component includes a predefined oil component and the solid particles are distributed along the interface between the oil phase component and the aqueous phase component.
    Type: Application
    Filed: June 7, 2019
    Publication date: September 19, 2019
    Applicant: MITSUBISHI-CHEMICAL FOODS CORPORATION
    Inventors: Minako HANASAKI, Tsutashi Matsuura, Tetsuo Kasai, Tatsushi Isojima
  • Patent number: 10414653
    Abstract: The present invention addresses the problem of providing agglomeraterd boron nitride particles which are suitable to be used as a thermally conductive filler for a heat dissipation sheet of a power semiconductor device, and which exhibit excellent isotropy of thermal conductivity, excellent degradation resistance, and excellent kneadability with respect to resin. The agglomerated boron nitride particles are obtained by agglomerating boron nitride primary particles. The agglomerated BN articles are characterized in that: a peak area intensity ratio ((100)/(004)) of a (100) plane to a (004) plane of the BN primary particles is 0.25 or more, and the average crystallite size of the BN primary particles obtained from a (002) plane peak of the BN primary particles is 375 ? or more.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: September 17, 2019
    Assignee: MITSUBISHI CHEMICAL CORPORATION
    Inventors: Katsura Ikemiya, Masanori Yamazaki, Takuya Suzuki, Kazuki Takeda, Toshiyuki Sawamura, Sawa Hiramatsu, Tatsushi Isojima
  • Patent number: 10370251
    Abstract: The present invention addresses the problem of providing agglomeraterd boron nitride particles which are suitable to be used as a thermally conductive filler for a heat dissipation sheet of a power semiconductor device, and which exhibit excellent isotropy of thermal conductivity, excellent degradation resistance, and excellent kneadability with respect to resin. The agglomerated boron nitride particles are obtained by agglomerating boron nitride primary particles. The agglomerated BN articles are characterized in that: a peak area intensity ratio ((100)/(004)) of a (100) plane to a (004) plane of the BN primary particles is 0.25 or more, and the average crystallite size of the BN primary particles obtained from a (002) plane peak of the BN primary particles is 375 ? or more.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: August 6, 2019
    Assignee: MITSUBISHI CHEMICAL CORPORATION
    Inventors: Katsura Ikemiya, Masanori Yamazaki, Takuya Suzuki, Kazuki Takeda, Toshiyuki Sawamura, Sawa Hiramatsu, Tatsushi Isojima
  • Publication number: 20180354793
    Abstract: The present invention addresses the problem of providing agglomeraterd boron nitride particles which are suitable to be used as a thermally conductive filler for a heat dissipation sheet of a power semiconductor device, and which exhibit excellent isotropy of thermal conductivity, excellent degradation resistance, and excellent kneadability with respect to resin. The agglomerated boron nitride particles are obtained by agglomerating boron nitride primary particles. The agglomerated BN articles are characterized in that: a peak area intensity ratio ((100)/(004)) of a (100) plane to a (004) plane of the BN primary particles is 0.25 or more, and the average crystallite size of the BN primary particles obtained from a (002) plane peak of the BN primary particles is 375 ? or more.
    Type: Application
    Filed: August 21, 2018
    Publication date: December 13, 2018
    Applicant: MITSUBISHI CHEMICAL CORPORATION
    Inventors: Katsura IKEMIYA, Masanori YAMAZAKI, Takuya SUZUKI, Kazuki TAKEDA, Toshiyuki SAWAMURA, Sawa HIRAMATSU, Tatsushi ISOJIMA
  • Patent number: 10106413
    Abstract: The present invention addresses the problem of providing agglomerated boron nitride particles which are suitable to be used as a thermally conductive filler for a heat dissipation sheet of a power semiconductor device, and which exhibit excellent isotropy of thermal conductivity, excellent degradation resistance, and excellent kneadability with respect to resin. The agglomerated boron nitride particles are obtained by agglomerating boron nitride primary particles. The agglomerated BN articles are characterized in that: a peak area intensity ratio ((100)/(004)) of a (100) plane to a (004) plane of the BN primary particles is 0.25 or more, and the average crystallite size of the BN primary particles obtained from a (002) plane peak of the BN primary particles is 375 ? or more.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: October 23, 2018
    Assignee: MITSUBISHI CHEMICAL CORPORATION
    Inventors: Katsura Ikemiya, Masanori Yamazaki, Takuya Suzuki, Kazuki Takeda, Toshiyuki Sawamura, Sawa Hiramatsu, Tatsushi Isojima
  • Publication number: 20170130006
    Abstract: The present invention addressed the problem of providing a highly reliable thermosetting resin composition which is suitable for use in a sealing material for a semiconductor device and in which warpings and cracks do not occur even when used in a power device, in particular. The problem is solved by a thermosetting resin composition that includes a thermosetting resin and a curing catalyst, wherein the cured product of the thermosetting resin composition has a storage modulus at 25° C. of 1.0×106 Pa to 1.0×1010 Pa and an average linear expansion coefficient at 70 to 210° C. of 100 ppm/K or less.
    Type: Application
    Filed: January 24, 2017
    Publication date: May 11, 2017
    Applicant: MITSUBISHI CHEMICAL CORPORATION
    Inventors: Maki SAITO, Toshiyuki TANAKA, Akinori KIMURA, Phuong Thi Kim DAO, Tatsushi ISOJIMA
  • Publication number: 20160340191
    Abstract: The present invention addresses the problem of providing agglomerated boron nitride particles which are suitable to be used as a thermally conductive filler for a heat dissipation sheet of a power semiconductor device, and which exhibit excellent isotropy of thermal conductivity, excellent degradation resistance, and excellent kneadability with respect to resin. The agglomerated boron nitride particles are obtained by agglomerating boron nitride primary particles. The agglomerated BN articles are characterized in that: a peak area intensity ratio ((100)/(004)) of a (100) plane to a (004) plane of the BN primary particles is 0.25 or more, and the average crystallite size of the BN primary particles obtained from a (002) plane peak of the BN primary particles is 375 ? or more.
    Type: Application
    Filed: August 5, 2016
    Publication date: November 24, 2016
    Applicant: MITSUBISHI CHEMICAL CORPORATION
    Inventors: Katsura IKEMIYA, Masanori YAMAZAKI, Takuya SUZUKI, Kazuki TAKEDA, Toshiyuki SAWAMURA, Sawa HIRAMATSU, Tatsushi ISOJIMA
  • Patent number: 9297800
    Abstract: A biomaterial structure containing a larger amount of biomaterial than the conventional art with maintaining the reactivity of the biomaterial is provided by linking particulate lumps in which the biomaterial is bound with a compound capable of binding to the biomaterial, wherein the particle diameter of the particulate lumps is 10 ?m or smaller.
    Type: Grant
    Filed: September 22, 2011
    Date of Patent: March 29, 2016
    Assignees: Mitsubishi Chemical Corporation, LSI Medience Corporation
    Inventors: Tatsushi Isojima, Hiroyuki Tanaka, Toshifumi Shiroya, Hisao Takeuchi, Minako Hanasaki, Yasuo Ifuku
  • Patent number: 8183057
    Abstract: A biomaterial structure containing a larger amount of biomaterial than the conventional art with maintaining the reactivity of the biomaterial is provided by linking particulate lumps in which the biomaterial is bound with a compound capable of binding to the biomaterial, wherein the particle diameter of the particulate lumps is 10 ?m or smaller.
    Type: Grant
    Filed: September 14, 2005
    Date of Patent: May 22, 2012
    Assignees: Mitsubishi Chemical Corporation, Mitsubishi Chemical Medience Corporation
    Inventors: Tatsushi Isojima, Hiroyuki Tanaka, Toshifumi Shiroya, Hisao Takeuchi, Minako Hanasaki, Yasuo Ifuku
  • Publication number: 20120053078
    Abstract: A biomaterial structure containing a larger amount of biomaterial than the conventional art with maintaining the reactivity of the biomaterial is provided by linking particulate lumps in which the biomaterial is bound with a compound capable of binding to the biomaterial, wherein the particle diameter of the particulate lumps is 10 ?m or smaller.
    Type: Application
    Filed: September 22, 2011
    Publication date: March 1, 2012
    Applicant: MITSUBISHI CHEMICAL CORPORATION
    Inventors: Tatsushi ISOJIMA, Hiroyuki Tanaka, Toshifumi Shiroya, Hisao Takeuchi, Minako Hanasaki, Yasuo Ifuku
  • Publication number: 20110261443
    Abstract: Disclosed is a heat ray reflective film having a single layer structure, which has high heat ray reflectivity, can relatively control visible light absorption and visible light reflection and has excellent heat stability. Also disclosed is a heat ray reflective laminate which has high environmental durability and is suitable as a window material for buildings or automobiles. A heat ray reflective laminate which is a laminate comprising a transparent substrate and a heat ray reflective layer and which has a solar reflectance of at least 15% as measured from the side containing the heat ray reflective layer, wherein the heat ray reflective layer comprises a binder resin containing a hydrophilic group other than an N-pyrrolidonyl group, and a metal, and the heat ray reflective layer has a layer thickness of at most 100 nm.
    Type: Application
    Filed: October 23, 2009
    Publication date: October 27, 2011
    Applicant: MITSUBISHI CHEMICAL CORPORATION
    Inventors: Tatsushi Isojima, Tomoko Yamakawa, Naoto Maru, Hiroyuki Aikyou, Hisao Takeuchi, Katsuya Funayama, Hisashi Kusaka
  • Publication number: 20110177306
    Abstract: To provide a new structure-dispersed composite in which a substance poorly soluble in a medium is dispersed as micronized particles, a core-shell structure is dispersed in the medium, wherein said core-shell structure contains microparticles therein, and consists of a core comp rising a core compound that is poorly soluble in said medium and a liquid shell comprising a shell compound that is poorly soluble in said medium, and the mean diameter of said core-shell structure is 10 ?m or less.
    Type: Application
    Filed: December 16, 2005
    Publication date: July 21, 2011
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Tatsushi Isojima, Haruki Asatani, Hiroya Seki, Hisao Takeuchi
  • Publication number: 20090028950
    Abstract: The subject matter of the present invention is to provide a new particulate material dispersion composite in which a material poorly soluble in water is micronized and dispersed. For the above purpose, a particulate material dispersion composite is produced in the present invention, wherein a particulate material containing a specific material which is poorly soluble in water, a polymer and a lipid is dispersed in water, the mean diameter of said particulate material is 1 ?m or less, and the ratio of the combined weight of said polymer and said lipid to the weight of said specific material is 1.5 or larger.
    Type: Application
    Filed: March 17, 2006
    Publication date: January 29, 2009
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Tatsushi Isojima, Haruki Asatani, Hiroya Seki, Hisao Takeuchi
  • Publication number: 20080044925
    Abstract: A biomaterial structure containing a larger amount of biomaterial than the conventional art with maintaining the reactivity of the biomaterial is provided by linking particulate lumps in which the biomaterial is bound with a compound capable of binding to the biomaterial, wherein the particle diameter of the particulate lumps is 10 ?m or smaller.
    Type: Application
    Filed: September 14, 2005
    Publication date: February 21, 2008
    Inventors: Tatsushi Isojima, Hiroyuki Tanaka, Toshifumi Shiroya, Hisao Takeuchi, Minako Hanasaki, Yasuo Ifuku