Abstract: A magnetic head comprises a pole layer, a first coil, a second coil, and a shield. The shield incorporates: a first portion located backward of the pole layer along the direction of travel of a recording medium; a second portion located forward of the pole layer along the direction of travel of the recording medium; and two coupling portions. The first portion has an end face located in a medium facing surface. The two coupling portions couple the first and second portions to each other without touching the pole layer. Part of the first coil passes through a space surrounded by the pole layer and the first portion. Part of the second coil passes through a space surrounded by the pole layer and the second portion.

Abstract: A magnetic layer for writing incorporates: a pole layer having an end face located in a medium facing surface and a lower yoke layer. A first magnetic layer for flux concentration is connected to the lower yoke layer at a location away from the medium facing surface, and passes a magnetic flux corresponding to a magnetic field generated by a first coil. A second magnetic layer for flux concentration is connected to the pole layer at a location away from the medium facing surface, and passes a magnetic flux corresponding to a magnetic field generated by a second coil. A nonmagnetic layer is disposed between the pole layer and the lower yoke layer. The lower yoke layer is connected to the pole layer at a location closer to the medium facing surface than the nonmagnetic layer.

Abstract: A wafer for electronic component packages is used for manufacturing a plurality of electronic component packages, each of the plurality of electronic component packages including: a base incorporating a plurality of external connecting terminals; and at least one electronic component chip bonded to the base and electrically connected to the plurality of external connecting terminals. The wafer has a plurality of sets of external connecting terminals corresponding to the plurality of electronic component packages, a retainer for retaining the plurality of sets of external connecting terminals, and a coupling portion for coupling the plurality of sets of external connecting terminals to one another. The wafer includes a plurality of pre-base portions that will each be subjected to bonding of the at least one electronic component chip thereto and will be subjected to separation from one another later so that each of them will thereby become the base.

Abstract: In a sensing unit according to the present invention, a spring portion having a support portion and a movable portion is conductive. A signal of a sensor portion provided on the movable portion of the spring portion is transmitted via the spring portion. Hence, the sensing unit according to the present invention has a simple constitution with a small number of components, and a wire does not necessarily have to be provided for each sensor portion. As a result, a reduction in manufacturing cost, simplification of the manufacturing process, and so on are achieved.

Abstract: A magnetic layer for writing incorporates: a pole layer having an end face located in a medium facing surface and a lower yoke layer. A first magnetic layer for flux concentration is connected to the lower yoke layer at a location away from the medium facing surface, and passes a magnetic flux corresponding to a magnetic field generated by a first coil. A second magnetic layer for flux concentration is connected to the pole layer at a location away from the medium facing surface, and passes a magnetic flux corresponding to a magnetic field generated by a second coil. A nonmagnetic layer is disposed between the pole layer and the lower yoke layer. The lower yoke layer is connected to the pole layer at a location closer to the medium facing surface than the nonmagnetic layer.

Abstract: In a sensing unit according to the present invention, a spring portion having a support portion and a movable portion is conductive. A signal of a sensor portion provided on the movable portion of the spring portion is transmitted via the spring portion. Hence, the sensing unit according to the present invention has a simple constitution with a small number of components, and a wire does not necessarily have to be provided for each sensor portion. As a result, a reduction in manufacturing cost, simplification of the manufacturing process, and so on are achieved.

Abstract: A magnetic layer for writing incorporates: a pole layer having an end face located in a medium facing surface; and an upper yoke layer. A first magnetic layer for flux concentration is connected to the pole layer at a location away from the medium facing surface, and passes a magnetic flux corresponding to a magnetic field generated by a first coil. A second magnetic layer for flux concentration is connected to the upper yoke layer at a location away from the medium facing surface, and passes a magnetic flux corresponding to a magnetic field generated by a second coil. A nonmagnetic layer is disposed between the pole layer and the upper yoke layer. The upper yoke layer is connected to the pole layer at a location closer to the medium facing surface than the nonmagnetic layer.

Abstract: A thin-film magnetic head including a structure in which a main magnetic pole layer including a magnetic pole end part on a side of a medium-opposing surface opposing a recording medium, a write shield layer opposing the magnetic pole end part so as to form a recording gap layer on the medium-opposing surface side, and a thin-film coil wound about the write shield layer or main magnetic pole layer are laminated. The main magnetic pole layer is incorporated in a magnetic pole forming depression of a base insulating layer, the magnetic pole forming depression being sunken into a form corresponding to the main magnetic pole layer. The thin-film magnetic head has a remnant insulating film, formed on the outside of the magnetic pole forming depression so as to substantially surround the magnetic pole forming depression, covering the base insulating layer.

Abstract: A magnetic film sensor comprises a magnetic film for generating a magnetostriction, and a magnetostrictive structure for generating a magnetostriction in the magnetic film. The magnetostrictive structure is constructed so as to generate a magnetostriction by curving the magnetic film, for example. The magnetostrictive structure is obtained, for example, by providing a depressed insulating layer having a surface formed with a depression and forming the magnetic film across the depression. A deformable part that is formed using a softer material than the magnetic film may also be formed at least partly on a surface of the magnetostrictive structure, within the depression.

Abstract: A thin-film magnetic head including a main magnetic pole layer having a magnetic pole end part on a side of a medium-opposing surface opposing a recording medium; a write shield layer opposing the magnetic pole end part to form a recording gap layer on the medium-opposing surface side; a thin-film coil wound about the write shield layer or the main magnetic pole layer; and a base insulating layer formed with a magnetic pole forming depression, including a very narrow groove defining a form of the magnetic pole end part and a main depression integrally extending from an end part of the very narrow groove remote from the medium-opposing surface. A stepped part is formed at a boundary between a bottom face of the main depression and a bottom face of the very narrow groove. The main magnetic pole layer is the only magnetically functional layer in the depression.

Abstract: The present invention has a configuration which allows manufacturing a capacitor including a first electrode layer, conductive first convex sections layered on a surface of the first electrode layer, a first dielectric layer formed on a surface of the first convex sections and a surface of the first electrode layer, and a second electrode layer formed so as to be superimposed on the first convex sections and the first electrode layer via the first dielectric layer.

Abstract: A thin film magnetic head has a configuration in which a main magnetic pole film having a magnetic pole end portion on a medium opposing surface (ABS) side facing a magnetic disk, a write shield film facing the magnetic pole end portion so as to form a recording gap film on the medium opposing surface side, and a thin film coil wound around at least a part of the write shield film are laminated. Further, the thin film magnetic head has an upper yoke magnetic pole film whose size is larger than that of the main magnetic pole film at a part more distant from the ABS than the recording gap film, and this upper yoke magnetic pole film is bonded to the side of the main magnetic pole film close to the thin film coil. In the upper yoke magnetic pole film, an end portion on the ABS side is retracted in a direction apart from the ABS in accordance with an increase in film thickness which is measured from the surface of the main magnetic pole film.

Abstract: A magnetic layer for writing incorporates: a pole layer having an end face located in a medium facing surface; and an upper yoke layer. A first magnetic layer for flux concentration is connected to the pole layer at a location away from the medium facing surface, and passes a magnetic flux corresponding to a magnetic field generated by a first coil. A second magnetic layer for flux concentration is connected to the upper yoke layer at a location away from the medium facing surface, and passes a magnetic flux corresponding to a magnetic field generated by a second coil. A nonmagnetic layer is disposed between the pole layer and the upper yoke layer. The upper yoke layer is connected to the pole layer at a location closer to the medium facing surface than the nonmagnetic layer.

Abstract: A wafer for electronic component packages is used for manufacturing a plurality of electronic component packages, each of the plurality of electronic component packages including: a base incorporating a plurality of external connecting terminals; and at least one electronic component chip bonded to the base and electrically connected to the plurality of external connecting terminals. The wafer has a plurality of sets of external connecting terminals corresponding to the plurality of electronic component packages, a retainer for retaining the plurality of sets of external connecting terminals, and a coupling portion for coupling the plurality of sets of external connecting terminals to one another. The wafer includes a plurality of pre-base portions that will each be subjected to bonding of the at least one electronic component chip thereto and will be subjected to separation from one another later so that each of them will thereby become the base.

Abstract: A method of manufacturing a thin-film magnetic head structure comprises the steps of preparing an insulating layer 10; forming a first resist layer 51 provided with a first slit pattern 51a corresponding to a very narrow groove part and a second slit pattern 51b corresponding to a temporary groove part integrally extending from the very narrow groove part along outer edges of a main depression onto the insulating layer 10; etching the insulating layer 10 while using the first resist layer 51 as a mask; eliminating the first resist layer 51; forming a second resist layer having an opening pattern corresponding to the main depression onto the insulating layer 10; and etching the insulating layer 10 while using the second resist layer as a mask.

Abstract: A magnetic layer for writing incorporates: a pole layer having an end face located in a medium facing surface; and an upper yoke layer. A first magnetic layer for flux concentration is connected to the pole layer at a location away from the medium facing surface, and allows a magnetic flux corresponding to a magnetic field generated by a first coil to pass. A second magnetic layer for flux concentration is connected to the upper yoke layer at a location away from the medium facing surface, and allows a magnetic flux corresponding to a magnetic field generated by a second coil to pass. When seen in the direction orthogonal to the interface between the second magnetic layer and the upper yoke layer, this interface is disposed at a location that does not coincide with the interface between the first magnetic layer and the pole layer.

Abstract: In a method of manufacturing an electronic component package, first, there is fabricated a wafer incorporating a plurality of sets of external connecting terminals corresponding to a plurality of electronic component packages, and a retainer for retaining the plurality of sets of external connecting terminals, the wafer including a plurality of pre-base portions that will be separated from one another later to be bases of the electronic component packages. Next, at least one electronic component chip is bonded to each of the pre-base portions of the wafer. Next, electrodes of the electronic component chips are connected to the external connecting terminals. Next, the electronic component chips are sealed. Next, the wafer is cut so that the pre-base portions are separated from one another and the plurality of bases are thereby formed.

Abstract: An electronic component package includes: a base having a top surface and a side surface; and a plurality of layer portions stacked on the top surface of the base, each of the layer portions including at least one electronic component chip. The base includes a plurality of external connecting terminals, and a retainer for retaining the plurality of external connecting terminals. Each of the external connecting terminals has an end face located at the side surface of the base. At least one of a plurality of electronic component chips that the plurality of layer portions include is electrically connected to at least one of the external connecting terminals.

Abstract: A magnetic head including an encasing layer having a groove; a nonmagnetic metal layer that has a sidewall located directly above the edge of the groove and that is disposed on a region of the encasing layer away from the medium facing surface; two side shield layers that have sidewalls located directly above the edge of the groove and that are disposed adjacent to the nonmagnetic metal layer on regions of the encasing layer closer to the medium facing surface than the nonmagnetic metal layer; and a pole layer. The pole layer is placed in an encasing section formed of the groove of the encasing layer, the sidewall of the nonmagnetic metal layer, and the sidewalls of the two side shield layers.

Abstract: In a method of manufacturing an electronic component package, first, a plurality of sets of external connecting terminals corresponding to a plurality of electronic component packages are formed by plating on a top surface of a substrate to thereby fabricate a wafer. The wafer includes a plurality of pre-base portions that will be separated from one another later to become bases of the respective electronic component packages. Next, at least one electronic component chip is bonded to each of the pre-base portions of the wafer. Next, electrodes of the electronic component chip are connected to the external connecting terminals. Next, the electronic component chip is sealed. Next, the wafer is cut so that the pre-base portions are separated from one another and the plurality of bases are thereby formed.