Patents by Inventor Tatsuya Kiriyama
Tatsuya Kiriyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11964294Abstract: A mist-generating device includes: a droplet generating unit that generates, in a third liquid, a functional droplet including a first liquid that is spherical and a second liquid that covers an entirety of the first liquid and has a volatility lower than a volatility of the first liquid; and a mist-generating unit that generates a multilayer mist obtained by atomizing the third liquid containing the functional droplet.Type: GrantFiled: June 25, 2019Date of Patent: April 23, 2024Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Mitsuhiko Ueda, Tatsuya Kiriyama, Hiroaki Tachibana, Shogo Shibuya
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Publication number: 20210229120Abstract: A mist-generating device includes: a droplet generating unit that generates, in a third liquid, a functional droplet including a first liquid that is spherical and a second liquid that covers an entirety of the first liquid and has a volatility lower than a volatility of the first liquid; and a mist-generating unit that generates a multilayer mist obtained by atomizing the third liquid containing the functional droplet.Type: ApplicationFiled: June 25, 2019Publication date: July 29, 2021Applicant: Panasonic Intellectual Property Management Co., Ltd.Inventors: Mitsuhiko UEDA, Tatsuya KIRIYAMA, Hiroaki TACHIBANA, Shogo SHIBUYA
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Patent number: 8679954Abstract: A schottky diode includes a SiC substrate which has a first surface and a second surface facing away from the first surface, a semiconductor layer which is formed on the first surface of the SiC substrate, a schottky electrode which is in contact with the semiconductor layer, and an ohmic electrode which is in contact with the second surface of the SiC substrate. The first surface of the SiC substrate is a (000-1) C surface, upon which the semiconductor layer is formed.Type: GrantFiled: May 6, 2013Date of Patent: March 25, 2014Assignee: Rohm Co., Ltd.Inventors: Shingo Ohta, Tatsuya Kiriyama, Takashi Nakamura, Yuji Okamura
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Publication number: 20130244409Abstract: A schottky diode includes a SiC substrate which has a first surface and a second surface facing away from the first surface, a semiconductor layer which is formed on the first surface of the SiC substrate, a schottky electrode which is in contact with the semiconductor layer, and an ohmic electrode which is in contact with the second surface of the SiC substrate. The first surface of the SiC substrate is a (000-1) C surface, upon which the semiconductor layer is formed.Type: ApplicationFiled: May 6, 2013Publication date: September 19, 2013Applicant: ROHM CO., LTD.Inventors: Shingo OHTA, Tatsuya KIRIYAMA, Takashi NAKAMURA, Yuji OKAMURA
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Patent number: 8441017Abstract: A schottky diode includes a SiC substrate which has a first surface and a second surface facing away from the first surface, a semiconductor layer which is formed on the first surface of the SiC substrate, a schottky electrode which is in contact with the semiconductor layer, and an ohmic electrode which is in contact with the second surface of the SiC substrate. The first surface of the SiC substrate is a (000-1) C surface, upon which the semiconductor layer is formed.Type: GrantFiled: June 1, 2011Date of Patent: May 14, 2013Assignee: Rohm Co., Ltd.Inventors: Shingo Ohta, Tatsuya Kiriyama, Takashi Nakamura, Yuji Okamura
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Patent number: 8310028Abstract: A semiconductor device includes a semiconductor substrate that is made of either of silicon carbide (SiC) and gallium nitride (GaN), and has a defect region containing a crystal defect; a first insulating film that coats the defect region and is arranged on the semiconductor substrate; and a conductor film that electrically connects to a principal surface of the semiconductor substrate, the principal surface being exposed to a region that is not coated with the first insulating film.Type: GrantFiled: January 9, 2009Date of Patent: November 13, 2012Assignee: Rohm Co., Ltd.Inventors: Tatsuya Kiriyama, Noriaki Kawamoto
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Publication number: 20110250736Abstract: A schottky diode includes a SiC substrate which has a first surface and a second surface facing away from the first surface, a semiconductor layer which is formed on the first surface of the SiC substrate, a schottky electrode which is in contact with the semiconductor layer, and an ohmic electrode which is in contact with the second surface of the SiC substrate. The first surface of the SiC substrate is a (000-1) C surface, upon which the semiconductor layer is formed.Type: ApplicationFiled: June 1, 2011Publication date: October 13, 2011Applicant: ROHM CO., LTD.Inventors: Shingo OHTA, Tatsuya KIRIYAMA, Takashi NAKAMURA, Yuji OKAMURA
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Patent number: 7973318Abstract: A schottky diode includes a SiC substrate which has a first surface and a second surface facing away from the first surface, a semiconductor layer which is formed on the first surface of the SiC substrate, a schottky electrode which is in contact with the semiconductor layer, and an ohmic electrode which is in contact with the second surface of the SiC substrate. The first surface of the SiC substrate is a (000-1) C surface, upon which the semiconductor layer is formed.Type: GrantFiled: October 18, 2007Date of Patent: July 5, 2011Assignee: Rohm Co., Ltd.Inventors: Shingo Ohta, Tatsuya Kiriyama, Takashi Nakamura, Yuji Okamura
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Publication number: 20110030758Abstract: To manufacture a photovoltaic device through a first step of sequentially stacking a transparent electrode, a photovoltaic layer, and a rear surface electrode to thereby form a structure in which photovoltaic cells are serially connected, a second step of measuring characteristics of the photovoltaic cell; and a third step of removing, according to a result of measurement, the transparent electrode, the photovoltaic layer, and the rear surface electrode along the serial connection direction, to thereby divide the serially connected photovoltaic cells into a plurality of regions.Type: ApplicationFiled: August 5, 2010Publication date: February 10, 2011Applicant: SANYO ELECTRIC CO., LTD.Inventor: Tatsuya KIRIYAMA
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Publication number: 20100297806Abstract: While using the same laser device, a slit (S4) is formed by cutting an photoelectric conversion unit and a backside electrode formed over a transparent electrode to a surface of the transparent electrode and a slit (S5) is formed by cutting the photoelectric conversion unit and the backside electrode formed in a slit (S2) of the transparent electrode in a direction intersecting a direction of the slit S4.Type: ApplicationFiled: May 20, 2010Publication date: November 25, 2010Applicant: SANYO ELECTRIC CO., LTD.Inventor: Tatsuya Kiriyama
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Publication number: 20100283126Abstract: A semiconductor device includes a semiconductor substrate that is made of either of silicon carbide (SiC) and gallium nitride (GaN), and has a defect region containing a crystal defect; a first insulating film that coats the defect region and is arranged on the semiconductor substrate; and a conductor film that electrically connects to a principal surface of the semiconductor substrate, the principal surface being exposed to a region that is not coated with the first insulating film.Type: ApplicationFiled: January 9, 2009Publication date: November 11, 2010Applicant: ROHM CO., LTDInventors: Tatsuya Kiriyama, Noriaki Kawamoto
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Publication number: 20090001382Abstract: A schottky diode includes a SiC substrate which has a first surface and a second surface facing away from the first surface, a semiconductor layer which is formed on the first surface of the SiC substrate, a schottky electrode which is in contact with the semiconductor layer, and an ohmic electrode which is in contact with the second surface of the SiC substrate. The first surface of the SiC substrate is a (000-1) C surface, upon which the semiconductor layer is formed.Type: ApplicationFiled: October 18, 2007Publication date: January 1, 2009Applicant: ROHM CO., LTD.Inventors: Shingo Ohta, Tatsuya Kiriyama, Takashi Nakamura, Yuji Okamura
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Patent number: 6953989Abstract: A film carrier tape for mounting electronic devices thereon having a mounting unit in which a wiring pattern is formed by etching on a base material, wherein the mounting unit has a target mark to be a reference of an alignment for carrying out final defect marking in a target position on the mounting unit by marking means as a pattern formed on the base material by the etching, and a defect marking method using the same are provided.Type: GrantFiled: January 28, 2004Date of Patent: October 11, 2005Assignee: Mitsui Mining & Smelting Co., Ltd.Inventor: Tatsuya Kiriyama
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Publication number: 20040256701Abstract: A film carrier tape for mounting electronic devices thereon having a mounting unit in which a wiring pattern is formed by etching on a base material, wherein the mounting unit has a target mark to be a reference of an alignment for carrying.out final defect marking in a target position on the mounting unit by marking means as a pattern formed on the base material by the etching, and a defect marking method using the same are provided.Type: ApplicationFiled: January 28, 2004Publication date: December 23, 2004Applicant: MITSUI MINING & SMELTING CO., LTD.Inventor: Tatsuya Kiriyama