Abstract: A film contains a ?-1,3-glucan derivative obtained by introducing an acyl group into a ?-1,3-glucan and at least one resin selected from the group consisting of a rosin-based resin, a terpene-based resin, and a petroleum-based resin. The acyl group is represented by RCO—, and the R is a hydrocarbon group having 1 or more and 5 or less carbon atoms. Parts by weight of the resin with respect to 100 parts by weight of the ?-1,3-glucan derivative are 90 parts by weight or less. A pressure-sensitive adhesive tape includes the film and a pressure-sensitive adhesive layer.

Abstract: An adhesive composition contains a ?-1,3-glucan derivative having a degree of substitution of the acyl group of 2.6 or more and less than 3.0, and an isocyanate-based crosslinking agent. A pressure-sensitive adhesive tape includes a pressure-sensitive adhesive layer formed from the adhesive composition.

Abstract: An adhesive composition contains a ?-1,3-glucan derivative obtained by introducing an acyl group into ?-1,3-glucan; and a terpene-based resin. An adhesive tape includes an adhesive layer formed from the adhesive composition.

Abstract: An adhesive composition contains a ?-1,3-glucan derivative obtained by introducing an acyl group into ?-1,3-glucan; and a rosin-based resin. An adhesive tape (1) includes an adhesive layer (3) formed from the adhesive composition.

Abstract: An adhesive composition contains a ?-1,3-glucan derivative obtained by introducing an acyl group into ?-1,3-glucan; and a petroleum-based resin. An adhesive tape includes an adhesive layer formed from the adhesive composition.

Abstract: One aspect of the present invention relates to an adhesive composition used for connecting electronic members, the adhesive composition comprising: a first conductive particle that is a conductive particle having a projection capable of penetrating an oxide film formed on a surface of an electrode of the electronic member; and second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle having a nonconductive core body and a conductive layer provided on the core body.

Abstract: One aspect of the present invention relates to an adhesive composition used for connecting electronic members, the adhesive composition comprising: a first conductive particle that is a conductive particle having a projection capable of penetrating an oxide film formed on a surface of an electrode of the electronic member; and second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle having a nonconductive core body and a conductive layer provided on the core body.

Abstract: One aspect of the present invention is an adhesive film comprising: a first adhesive layer comprising a first adhesive component, a first conductive particle that is a dendritic conductive particle, and a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body; and a second adhesive layer comprising a second adhesive component, wherein a volume proportion of the second adhesive component in the second adhesive layer is larger than a volume proportion of the first adhesive component in the first adhesive layer.

Abstract: One aspect of the present invention is an adhesive film comprising a first adhesive layer comprising a first conductive particle that is a dendritic conductive particle; and a second adhesive layer containing a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body.

Abstract: One aspect of the present invention is an adhesive film comprising: a first adhesive layer comprising a first adhesive component, a first conductive particle that is a dendritic conductive particle, and a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body; and a second adhesive layer comprising a second adhesive component, wherein a volume proportion of the second adhesive component in the second adhesive layer is larger than a volume proportion of the first adhesive component in the first adhesive layer.

Abstract: One aspect of the present invention is an adhesive film comprising a first adhesive layer comprising a first conductive particle that is a dendritic conductive particle; and a second adhesive layer containing a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body.

Abstract: One aspect of the present invention relates to an adhesive composition used for connecting electronic members, the adhesive composition comprising: a first conductive particle that is a conductive particle having a projection capable of penetrating an oxide film formed on a surface of an electrode of the electronic member; and second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle having a nonconductive core body and a conductive layer provided on the core body.