Abstract: According to one embodiment, an isolator includes first and second electrodes, first and second insulating portions, and a first dielectric portion. The first insulating portion is provided on the first electrode. The second electrode is provided on the first insulating portion. The second insulating portion is provided around the second electrode along a first plane perpendicular to a first direction. The second insulating portion contacts the second electrode. The first dielectric portion is provided between the first and second insulating portions. At least a portion of the first dielectric portion contacts the second electrode and is positioned around the second electrode along the first plane. A distance between a lower end of the second electrode and a first interface between the first dielectric portion and the second insulating portion is less than a distance between the first interface and an upper end of the second electrode.

Abstract: According to one embodiment, an isolator includes first and second electrodes, first and second insulating portions, and a first dielectric portion. The first insulating portion is provided on the first electrode. The second electrode is provided on the first insulating portion. The second insulating portion is provided around the second electrode along a first plane perpendicular to a first direction. The second insulating portion contacts the second electrode. The first dielectric portion is provided between the first and second insulating portions. At least a portion of the first dielectric portion contacts the second electrode and is positioned around the second electrode along the first plane. A distance between a lower end of the second electrode and a first interface between the first dielectric portion and the second insulating portion is less than a distance between the first interface and an upper end of the second electrode.

Abstract: A semiconductor device includes a substrate, a first chip, a second chip, a first connector, and a second connector. The substrate has a second thickness. The first chip includes a first surface facing the substrate, a second surface positioned at a side opposite to the first surface, a first electrode located at the first surface and electrically connected to the substrate, and a second electrode located at the second surface. The second connector includes a first part positioned above the second chip. A difference between the second thickness and a first thickness of the first part is not more than 20% of the greater of the first thickness or the second thickness.

Abstract: According to one embodiment, an isolator includes first and second conductive members, and first second, and third insulating members. The first conductive member includes first, second, and third partial regions. The third partial region is between the first and second partial regions. The second conductive member is electrically connected to the first conductive member. The second conductive member includes fourth and fifth partial regions. The fourth partial region is between the third and fifth partial regions. The first insulating member includes first and second insulating regions. The fifth partial region is between the first and second insulating regions. The second insulating member includes third and fourth insulating regions. The fourth partial region is between the third and fourth insulating regions. The third insulating member includes first and second portions.

Abstract: An insulating device includes a first element, a second element, a first lead, a second lead, and a resin member. The second element is electrically connected to the first element. The first element is mounted on the first lead. The second lead includes a first surface and a second surface, the second surface being at a side opposite to the first surface. The second element is mounted to the first surface. the second lead is arranged to overlap the first element in a direction crossing the second surface of the second lead. The resin member seals the first element, the second element, the first lead, and the second lead.

Abstract: An insulating device includes: a first inductor including a first coil layer located in a first plane; a second inductor separated from the first inductor, the second inductor including a second coil layer located in the first plane, a central axis of the second coil layer being positioned inside the first coil layer; and an insulating layer located between the first inductor and the second inductor.

Abstract: An isolator includes a lower electrode, a first insulating layer, a second insulating layer, an upper electrode, and a low permittivity portion. The first insulating layer is provided on the lower electrode, and includes a protruding portion in an upper portion of the first insulating layer. The second insulating layer is provided on the protruding portion, extends sideways from a region directly above the protruding portion, and has a specific permittivity higher than a specific permittivity of the first insulating layer. The upper electrode is in contact with an upper surface of the second insulating layer. The low permittivity portion is in contact with a side surface of the protruding portion and a lower surface of the second insulating layer. The low permittivity portion has a specific permittivity lower than the specific permittivity of the first insulating layer.

Abstract: A semiconductor device includes: a first chip including first and second electrodes provided at a first surface, and a third electrode provided at a second surface positioned at a side opposite to the first surface; a second chip including fourth and fifth electrodes provided at a third surface, and a sixth electrode provided at a fourth surface positioned at a side opposite to the third surface, wherein the second chip is disposed to cause the third surface to face the first surface; a first connector disposed between the first electrode and the fourth electrode and connected to the first and fourth electrodes; and a second connector disposed between the second electrode and the fifth electrode and connected to the second and fifth electrodes.

Abstract: An isolator includes an insulating layer, a first electrode provided on a first side of the insulating layer, and a second electrode provided on a second side of the insulating layer opposite to the first side. The second electrode faces the first electrode across the insulating layer. The insulating layer includes therein a gap between the first electrode and the second electrode. The gap extends along a plane perpendicular to a thickness direction of the insulating layer.

Abstract: An insulating element includes a first coil; a second coil; and an inter-layer insulating film located between the first coil and the second coil. The inter-layer insulating film includes a first layer, a second layer, and a third layer located between the first layer and the second layer. The first layer is located between the first coil and the third layer. The second layer is located between the second coil and the third layer. A bandgap of the third layer is narrower than a bandgap of the first layer and a bandgap of the second layer.

Abstract: An insulating device includes a first electrode, a second electrode, and an insulating film. The insulating film is located between the first electrode and the second electrode. The insulating film includes a positive charged region. The positive charged region is located at a portion in a direction from the first electrode toward the second electrode.

Abstract: An isolator includes a lower electrode, a first insulating layer, a second insulating layer, an upper electrode, and a low permittivity portion. The first insulating layer is provided on the lower electrode, and includes a protruding portion in an upper portion of the first insulating layer. The second insulating layer is provided on the protruding portion, extends sideways from a region directly above the protruding portion, and has a specific permittivity higher than a specific permittivity of the first insulating layer. The upper electrode is in contact with an upper surface of the second insulating layer. The low permittivity portion is in contact with a side surface of the protruding portion and a lower surface of the second insulating layer. The low permittivity portion has a specific permittivity lower than the specific permittivity of the first insulating layer.

Abstract: According to one embodiment, a digital isolator includes a first metal portion, a first insulating portion, a second metal portion, a third metal portion, and a first layer. The first insulating portion is provided on the first metal portion. The second metal portion is provided on the first insulating portion. The third metal portion includes first, second, and third portions. The first portion is provided around the first metal portion in a direction perpendicular to a first direction. The second portion is provided on a portion of the first portion with a first conductive layer interposed. The third portion is provided on the second portion and provided around the second metal portion in the perpendicular direction. The first layer contacts the first conductive layer and an other portion of the first portion and is provided around a bottom portion of the second portion.

Abstract: A semiconductor device includes a semiconductor part, a terminal insulating film, a first protective film, a second electrode, a terminal electrode, a first insulating film, and a second protective film. The terminal insulating film is provided on the semiconductor part in the terminal region. The first protective film is provided on the terminal insulating film. The first and second protective films includes silicon and nitrogen. The second electrode is provided on the semiconductor part in the cell region and includes an end portion located on the first protective film. The terminal electrode is provided on the first protective film in the terminal region and is connected to the semiconductor part. The first insulating film is provided on the first protective film. The first insulating film includes hydrogen and contacts the second electrode and the terminal electrode. The second protective film covers the first insulating film.

Abstract: A semiconductor device includes a semiconductor part, a terminal insulating film, a first protective film, a second electrode, a terminal electrode, a first insulating film, and a second protective film. The terminal insulating film is provided on the semiconductor part in the terminal region. The first protective film is provided on the terminal insulating film. The first and second protective films includes silicon and nitrogen. The second electrode is provided on the semiconductor part in the cell region and includes an end portion located on the first protective film. The terminal electrode is provided on the first protective film in the terminal region and is connected to the semiconductor part. The first insulating film is provided on the first protective film. The first insulating film includes hydrogen and contacts the second electrode and the terminal electrode. The second protective film covers the first insulating film.

Abstract: A semiconductor device includes: a first chip including first and second electrodes provided at a first surface, and a third electrode provided at a second surface positioned at a side opposite to the first surface; a second chip including fourth and fifth electrodes provided at a third surface, and a sixth electrode provided at a fourth surface positioned at a side opposite to the third surface, wherein the second chip is disposed to cause the third surface to face the first surface; a first connector disposed between the first electrode and the fourth electrode and connected to the first and fourth electrodes; and a second connector disposed between the second electrode and the fifth electrode and connected to the second and fifth electrodes.

Abstract: An isolator includes an insulating layer, a first electrode provided on a first side of the insulating layer, and a second electrode provided on a second side of the insulating layer opposite to the first side. The second electrode faces the first electrode across the insulating layer. The insulating layer includes therein a gap between the first electrode and the second electrode. The gap extends along a plane perpendicular to a thickness direction of the insulating layer.

Abstract: According to one embodiment, an isolator includes first and second electrodes, first and second insulating portions, and a first dielectric portion. The first insulating portion is provided on the first electrode. The second electrode is provided on the first insulating portion. The second insulating portion is provided around the second electrode along a first plane perpendicular to a first direction. The second insulating portion contacts the second electrode. The first dielectric portion is provided between the first and second insulating portions. At least a portion of the first dielectric portion contacts the second electrode and is positioned around the second electrode along the first plane. A distance between a lower end of the second electrode and a first interface between the first dielectric portion and the second insulating portion is less than a distance between the first interface and an upper end of the second electrode.

Abstract: An isolator includes a substrate; a first planar coil provided above the substrate and along a surface of the substrate; a first insulating portion on the first planar coil; a second planar coil on the first insulating portion; and a metal layer above the first insulating portion. The first planar coil, the second planar coil, and the metal layer are arranged in a first direction perpendicular to the surface of the substrate. The first planar coil and the second planar coil each having a center and an outer perimeter in a second direction along the surface of the substrate. A distance in the second direction from the center of the first planar coil to the outer perimeter of the first planar coil is less than a distance in the second direction from the center of the second planar coil to the outer perimeter of the second planar coil.

Abstract: According to one embodiment, an isolator includes first and second conductive members, and first second, and third insulating members. The first conductive member includes first, second, and third partial regions. The third partial region is between the first and second partial regions. The second conductive member is electrically connected to the first conductive member. The second conductive member includes fourth and fifth partial regions. The fourth partial region is between the third and fifth partial regions. The first insulating member includes first and second insulating regions. The fifth partial region is between the first and second insulating regions. The second insulating member includes third and fourth insulating regions. The fourth partial region is between the third and fourth insulating regions. The third insulating member includes first and second portions.