Abstract: A foreign objection detection sensor has a lengthy sensor part having a sensor electrode having a first sensor electrode which detects a proximity of a foreign object and a second sensor electrode which detects a contact of the foreign object, a sensor terminal part provided at one end of the sensor part, a leading wire pulled out from the sensor terminal part, the leading wire being electrically connected to the sensor electrode at the sensor terminal part to provide a proximity detecting function for detecting the proximity of the foreign object to the sensor part and a contact detecting function for detecting the contact of the foreign object to the sensor part. The sensor terminal part has a support member which supports a detection circuit unit electrically connected to the sensor electrode to carry out the proximity detecting function and the contact detecting function together with the sensor electrode. The detection circuit unit is disposed in the support member.

Abstract: A foreign objection detection sensor has a lengthy sensor part having a sensor electrode having a first sensor electrode which detects a proximity of a foreign object and a second sensor electrode which detects a contact of the foreign object, a sensor terminal part provided at one end of the sensor part, a leading wire pulled out from the sensor terminal part, the leading wire being electrically connected to the sensor electrode at the sensor terminal part to provide a proximity detecting function for detecting the proximity of the foreign object to the sensor part and a contact detecting function for detecting the contact of the foreign object to the sensor part. The sensor terminal part has a support member which supports a detection circuit unit electrically connected to the sensor electrode to carry out the proximity detecting function and the contact detecting function together with the sensor electrode. The detection circuit unit is disposed in the support member.

Abstract: A cord switch 1 has wire electrodes 12A, 12B spirally arranged along an inner surface of a hollow part 10 of a hollowed insulator 11 in a longitudinal direction such that the wire electrodes do not electrically contact with each other, an outer electrode 13 provided around an outer periphery surface of the hollowed insulator 11 and jacketed with an insulating layer 14. An electrostatic capacitance is formed between the outer electrode 13 and a wire electrode for grounding, and a floating electrostatic capacitance is formed between the outer electrode 13 and the earth. The close approach of the human body to the cord switch 1 can be detected in a non-contact manner by measuring the alteration in the electrostatic capacitance.

Abstract: A torque sensor 1 is provided with two shafts 3, 4 (input shaft 3 and output shaft 4) which constitute a shaft member 2, which is a torque detection object, an elastic member 5 which connects the shafts 3 and 4 coaxially, and a torsion angle of the elastic member 5 is detected as a torque which affects on the shaft member 2. The torque sensor 1 is provided with a hard magnetic member 6 which generates a magnetic flux therearound, a pair of first soft magnetic members 7, 8 which constitute a first magnetic circuit H1 together with the hard magnetic member 6 to change a reluctance by torsion of the elastic member 5, a pair of second soft magnetic members 9, 10 which constitute a second magnetic circuit H2 together with the hard magnetic member 6 to keep the reluctance constant, and a flux detection means 12 which detects a flux density of the second magnetic circuit H2 that varies in accordance with a torsion angle of the elastic member 5.

Abstract: A recess for fully receiving an electronic component and a window opened from the bottom of the recess to the bottom surface of a metal substrate are formed in the metal substrate. A wiring board is bonded to the underside of the metal substrate, and the electronic component is fixed to the bottom of the recess. Input and output terminals of the electronic component are connected to electrode pads of the wiring board exposed within the window using wire bonding. A metal lid is bonded to the top surface of the metal substrate to close the opening of the recess. Electromagnetic waves generated by the electronic component are confined to the electronic device because the electronic device is surrounded by the metal substrate, the metal lid, and a ground electrode disposed on the wiring board. Heat dissipation performance is assured because the electronic component is connected to the metal substrate.

Abstract: A cord switch 1 has wire electrodes 12A, 12B spirally arranged along an inner surface of a hollow part 10 of a hollowed insulator 11 in a longitudinal direction such that the wire electrodes do not electrically contact with each other, an outer electrode 13 provided around an outer periphery surface of the hollowed insulator 11 and jacketed with an insulating layer 14. An electrostatic capacitance is formed between the outer electrode 13 and a wire electrode for grounding, and a floating electrostatic capacitance is formed between the outer electrode 13 and the earth. The close approach of the human body to the cord switch 1 can be detected in a non-contact manner by measuring the alteration in the electrostatic capacitance.

Abstract: A wiring board with microstrip structure has: a first conductor layer that is provided with conductor wirings to be connected to a semiconductor chip in its external terminal (bonding pad); a second conductor layer that is provided with a conductor pattern connected through a via to a ground wiring, for supplying a power supply of ground potential to the semiconductor chip; and a third conductor layer that is provided with a power supply terminal connected through a via to a power supply wiring for supplying an operation power supply of a potential other than the ground potential to the semiconductor chip, a signal terminal connected through a via to a signal wiring for transmitting an electric signal, and a ground terminal connected through a via to the conductor pattern in the second conductor layer.

Abstract: A torque sensor 1 is provided with two shafts 3, 4 (input shaft 3 and output shaft 4) which constitute a shaft member 2, which is a torque detection object, an elastic member 5 which connects the shafts 3 and 4 coaxially, and a torsion angle of the elastic member 5 is detected as a torque which affects on the shaft member 2. The torque sensor 1 is provided with a hard magnetic member 6 which generates a magnetic flux therearound, a pair of first soft magnetic members 7, 8 which constitute a first magnetic circuit H1 together with the hard magnetic member 6 to change a reluctance by torsion of the elastic member 5, a pair of second soft magnetic members 9, 10 which constitute a second magnetic circuit H2 together with the hard magnetic member 6 to keep the reluctance constant, and a flux detection means 12 which detects a flux density of the second magnetic circuit H2 that varies in accordance with a torsion angle of the elastic member 5.

Abstract: A wiring board with microstrip structure has: a first conductor layer that is provided with conductor wirings to be connected to a semiconductor chip in its external terminal (bonding pad); a second conductor layer that is provided with a conductor pattern connected through a via to a ground wiring, for supplying a power supply of ground potential to the semiconductor chip; and a third conductor layer that is provided with a power supply terminal connected through a via to a power supply wiring for supplying an operation power supply of a potential other than the ground potential to the semiconductor chip, a signal terminal connected through a via to a signal wiring for transmitting an electric signal, and a ground terminal connected through a via to the conductor pattern in the second conductor layer.

Abstract: A wiring board with microstrip structure has: a first conductor layer that is provided with conductor wirings to be connected to a semiconductor chip in its external terminal (bonding pad); a second conductor layer that is provided with a conductor pattern connected through a via to a ground wiring, for supplying a power supply of ground potential to the semiconductor chip; and a third conductor layer that is provided with a power supply terminal connected through a via to a power supply wiring for supplying an operation power supply of a potential other than the ground potential to the semiconductor chip, a signal terminal connected through a via to a signal wiring for transmitting an electric signal, and a ground terminal connected through a via to the conductor pattern in the second conductor layer.

Abstract: A recess for fully receiving an electronic component and a window opened from the bottom of the recess to the bottom surface of a metal substrate are formed in the metal substrate. A wiring board is bonded to the underside of the metal substrate, and the electronic component is fixed to the bottom of the recess. Input and output terminals of the electronic component are connected to electrode pads of the wiring board exposed within the window using wire bonding. A metal lid is bonded to the top surface of the metal substrate to close the opening of the recess. Electromagnetic waves generated by the electronic component are confined to the electronic device because the electronic device is surrounded by the metal substrate, the metal lid, and a ground electrode disposed on the wiring board. Heat dissipation performance is assured because the electronic component is connected to the metal substrate.

Abstract: A wiring board with microstrip structure has: a first conductor layer that is provided with conductor wirings to be connected to a semiconductor chip in its external terminal (bonding pad); a second conductor layer that is provided with a conductor pattern connected through a via to a ground wiring, for supplying a power supply of ground potential to the semiconductor chip; and a third conductor layer that is provided with a power supply terminal connected through a via to a power supply wiring for supplying an operation power supply of a potential other than the ground potential to the semiconductor chip, a signal terminal connected through a via to a signal wiring for transmitting an electric signal, and a ground terminal connected through a via to the conductor pattern in the second conductor layer.

Abstract: A TAB tape with a stiffener is prepared by bonding a one-metal TAB tape 20 having a structure wherein a circuit pattern 21 is formed on either surface of a first tape base material, a part thereof is covered with an insulating film 2, and a via hole 12 is defined on a connecting regional section 25 for via, to a tape 30 for second metal prepared by providing a metallic foil layer 14 on either surface of a second tape base material 15 through an adhesive layer 15; the connecting regional section 25 for via on the upper edge of a via hole is electrically connected with a part of the metallic foil layer 14 on the bottom of the hole by means of conducting means (4, 16, and 18), and at the same time, an exposed portion 32 of the metallic foil layer 14, which has not been covered with the one-metal TAB tape 20, is connected to an electrode 71 of a ground line in the semiconductor 7 by means of a bonding wire 83 to lead a ground potential.

Abstract: A TAB tape with a stiffener is prepared by bonding a one-metal TAB tape 20 having a structure wherein a circuit pattern 21 is formed on either surface of a first tape base material, a part thereof is covered with an insulating film 2, and a via hole 12 is defined on a connecting regional section 25 for via, to a tape 30 for second metal prepared by providing a metallic foil layer 14 on either surface of a second tape base material 15 through an adhesive layer 15; the connecting regional section 25 for via on the upper edge of a via hole is electrically connected with a part of the metallic foil layer 14 on the bottom of the hole by means of conducting means (4, 16, and 18), and at the same time, an exposed portion 32 of the metallic foil layer 14, which has not been covered with the one-metal TAB tape 20, is connected to an electrode 71 of a ground line in the semiconductor 7 by means of a bonding wire 83 to lead a ground potential.

Abstract: A semiconductor device has a semi-conductor chip 1 having bonding pads 2 thereon, conductive leads 4, each of which comprises an inner lead 41 and an outer lead 42, insulating adhesive tapes 3 by which each of the inner leads 41 of the leads 4 is stuck to the surface 1a of the semiconductor chip 1, bonding wires 6 by which each of the leads 4 is electrically connected to each corresponding bonding pad 2. The semiconductor chip 1, bonding pad 2, adhesive tapes 3, inner leads 41, and bonding wires 6 are molded by a molding resin 5. The boundary of the inner lead 41 and the cuter lead 42 of the lead 4 is bent in S-shape so that there is a step between inner lead 41 and the upper side portion 42a of the outer lead 42 in a certain depth. Then the outer lead 42 protrude out of the molding resin and extend in J-shape. The surface 4a of the upper side portion 42a of the outer lead 42 is higher than the top of the looped bonding wire 6.