Patents by Inventor Tatsuya Oishi

Tatsuya Oishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240110496
    Abstract: The present invention provides an ohmic heating-type exhaust gas purification catalyst system. The ohmic heating-type exhaust gas purification catalyst system is configured to perform, based on information of temperature of a catalyst bed input from a temperature detector of an ohmic heating-type exhaust gas purification device, electric current pass control including controls of (1) causing an electric current to pass through a pair of electrodes when the temperature of the catalyst bed is equal to or lower than a first threshold temperature T1 set in a range of 350±25° C., (2) not causing an electric current to pass through the pair of electrodes when the temperature of the catalyst bed exceeds the first threshold temperature T1 and is equal to or lower than a second threshold temperature T2 set in a range of 450±25° C.
    Type: Application
    Filed: February 1, 2022
    Publication date: April 4, 2024
    Inventors: Ryota Onoe, Junichi Hori, Ryosuke Takasu, Tatsuya Ohashi, Shunsuke Oishi
  • Patent number: 6231996
    Abstract: A part or jig of a metal for a gas carburizing furnace has an Al diffusion layer which has an Al content of 10 to 50 wt % in the surface portion of the part or jig, the Al diffusion layer being formed by carrying out the calorizing treatment.
    Type: Grant
    Filed: December 8, 1997
    Date of Patent: May 15, 2001
    Assignee: Shinto Kogyo Kabushiki Kaisha
    Inventors: Kenji Umeno, Tatsuya Oishi
  • Patent number: 5449107
    Abstract: A reusable weld backing capable of withstanding long use, which is held against the underside of a workpiece to provide weld-metal support in full penetration welding, the weld backing comprising a substrate made from copper or a copper alloy; and a copper-aluminum alloy layer containing 9 to 23% by weight of aluminum and formed at least on the surface of the substrate, the surface being on the side which faces a weld zone.
    Type: Grant
    Filed: August 3, 1994
    Date of Patent: September 12, 1995
    Assignee: Kabushiki Kaisha Komatsu Seisakusho
    Inventors: Kenji Umeno, Tatsuya Oishi, Yuichi Kimura, Akitoshi Masamura, Akio Iwasaki