Patents by Inventor Tatsuya Wagoh

Tatsuya Wagoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Soldering method, soldering device, bonding method, bonding device, and nozzle unit
    Patent number: 7591406
    Abstract: Provided is a nozzle unit for use in a bonding device in which bonding between a first member and a second member is effected by providing a bonding member that has been melted by heating at a bonding position where the first member and the second member are to be bonded to each other. The nozzle unit includes: a cylindrical nozzle assembly having an accommodating space accommodating the bonding member, and an opening which allows ejection of the bonding member accommodated in the accommodating space onto the bonding position, which has a diameter larger than the diameter of the bonding member, and which communicates with the accommodating space; and a holding/releasing member for releasably holding the bonding member within the accommodating space.
    Type: Grant
    Filed: March 29, 2006
    Date of Patent: September 22, 2009
    Assignee: TDK Corporation
    Inventors: Tatsuya Wagoh, Toru Mizuno, Osamu Shindo
  • SOLDERING METHOD, SOLDERING DEVICE, BONDING METHOD, BONDING DEVICE, AND NOZZLE UNIT
    Publication number: 20060219760
    Abstract: Provided is a nozzle unit for use in a bonding device in which bonding between a first member and a second member is effected by providing a bonding member that has been melted by heating at a bonding position where the first member and the second member are to be bonded to each other. The nozzle unit includes: a cylindrical nozzle assembly having an accommodating space accommodating the bonding member, and an opening which allows ejection of the bonding member accommodated in the accommodating space onto the bonding position, which has a diameter larger than the diameter of the bonding member, and which communicates with the accommodating space; and a holding/releasing member for releasably holding the bonding member within the accommodating space.
    Type: Application
    Filed: March 29, 2006
    Publication date: October 5, 2006
    Applicant: TDK CORPORATION
    Inventors: Tatsuya Wagoh, Toru Mizuno, Osamu Shindo