Patents by Inventor Tatsuya Yasunaga

Tatsuya Yasunaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7335596
    Abstract: Cu-based interconnections are fabricated in a semiconductor device by depositing a thin film of Cu or Cu alloy on a dielectric film by sputtering, the dielectric film having trenches and/or via holes at least one groove and being arranged on or above a substrate, and carrying out high temperature and high pressure treatment to thereby embed the Cu or Cu alloy into the trenches and/or via holes, in which the sputtering is carried out at a substrate temperature of ?20° C. to 0° C. using, as a sputtering gas, a gaseous mixture containing hydrogen gas and an inert gas in a ratio in percentage of 5:95 to 20:80.
    Type: Grant
    Filed: June 22, 2005
    Date of Patent: February 26, 2008
    Assignee: Kobe Steel, Ltd.
    Inventors: Takashi Onishi, Tatsuya Yasunaga, Hideo Fujii, Tetsuya Yoshikawa, Jun Munemasa
  • Publication number: 20070209348
    Abstract: This invention provides a filamentous material for rubber reinforcement having excellent corrosion resistance, comprising: a steel filament and a coating layer containing Cu and Zn on a surface of the steel filament, wherein: a sum total in a length of a peripheral direction of the steel filament in a peripheral direction area in which the coating layer has a thickness of not less than 0.1 micrometers is not less than 50% in a full length in the peripheral direction of the steel filament when a cross section perpendicular to a longitudinal direction of the filamentous material is observed, and in the above peripheral direction area, (1) an average Cu content is 50% to 95% by mass in a depth direction area extending from an outermost surface of the coating layer to a position having a depth of 0.01 micrometers, and (2) an average Zn content is not less than 60% by mass in a depth direction area extending from a position having a depth of 0.
    Type: Application
    Filed: March 30, 2005
    Publication date: September 13, 2007
    Inventors: Toshiyuki Yamauchi, Tatsuya Yasunaga
  • Publication number: 20060019496
    Abstract: Cu-based interconnections are fabricated in a semiconductor device by depositing a thin film of Cu or Cu alloy on a dielectric film by sputtering, the dielectric film having trenches and/or via holes at least one groove and being arranged on or above a substrate, and carrying out high temperature and high pressure treatment to thereby embed the Cu or Cu alloy into the trenches and/or via holes, in which the sputtering is carried out at a substrate temperature of ?20° C. to 0° C. using, as a sputtering gas, a gaseous mixture containing hydrogen gas and an inert gas in a ratio in percentage of 5:95 to 20:80.
    Type: Application
    Filed: June 22, 2005
    Publication date: January 26, 2006
    Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel,Ltd.)
    Inventors: Takashi Onishi, Tatsuya Yasunaga, Hideo Fujii, Tetsuya Yoshikawa, Jun Munemasa
  • Publication number: 20040173300
    Abstract: A rubber-bonded brass composite material prepared by bonding rubber to the surface of a brass-plated material obtained by plating the surface of a substrate with brass or to the surface of a brass material by vulcanization, wherein preheating is carried out before vulcanization to form needle-like Cu—S-based reaction products at the bonding interface between brass and rubber. Thereby, there is provided a rubber-bonded brass composite material having excellent long-term adhesion while excellent initial adhesion at the time of bonding by vulcanization is retained.
    Type: Application
    Filed: March 2, 2004
    Publication date: September 9, 2004
    Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel Ltd.)
    Inventors: Tatsuya Yasunaga, Hisashi Mitamura, Takenori Nakayama
  • Patent number: 6296928
    Abstract: The present invention provides a member coated with a hard coating and to attain excellent wear resistance. The hard coating includes: an adhesion reinforcing layer formed on a surface of the member; and a second layer formed on the adhesion reinforcing layer and having a composition represented by the following formula: (AlpTiqVr)(NuCv) where 0≦p≦0.75, 0.20≦q≦0.75, 0.10≦r≦0.75, p+q+r=1, 0.6≦u≦1, and u+v=1. In order to further enhance the adhesion of the hard coating to the member, an intermediate layer may be formed between the first and second layers.
    Type: Grant
    Filed: May 4, 1999
    Date of Patent: October 2, 2001
    Assignee: MMC Kobelco Tool Co., Ltd.
    Inventors: Yasuyuki Yamada, Taiitsu Aoki, Yusuke Tanaka, Seiichiro Kitaura, Yasutaka Okazaki, Natsuki Ichimiya, Genki Matsumoto, Koichi Maeda, Toshiki Sato, Tatsuya Yasunaga, Kenji Yamamoto
  • Patent number: 6106955
    Abstract: A metal material having a photocatalytic activity which comprises an anodized layer and a thin layer containing titanium oxide powder which are heat treated are sequentially laminated on the surface of a substrate comprising metal material including titanium. By anodically oxidizing the metal material including titanium, an anodized layer is formed on the surface thereof. A thin layer containing titanium oxide powder is further coated on this surface, and heat treatment is carried out before and/or after forming this thin layer containing titanium oxide powder.
    Type: Grant
    Filed: January 12, 1998
    Date of Patent: August 22, 2000
    Assignees: Takenaka Corporation, Kobe Steel Ltd.
    Inventors: Takatoshi Ogawa, Toshio Saito, Sadatoshi Ohno, Atsumichi Kushibe, Fumio Kamikubo, Tatsuya Yasunaga, Takashi Kato, Yoshimasa Ito, Akira Fujishima, Kazuhito Hashimoto
  • Patent number: 5496651
    Abstract: A machine part comprises: a base part formed of a titanium alloy or an aluminum alloy and having a roughened surface of Ra 0.5 .mu.m or above and PPI.sub.50 or above; and a Ni--P electrodeposit layer formed over the surface of the base part by an electroplating process using a Ni--P plating bath containing a stress relaxing agent, and having a stress of 20 kgf/mm.sup.2 or below. The machine part has a small specific gravity, excellent seizure resistance, wear resistance and fatigue strength.
    Type: Grant
    Filed: February 13, 1995
    Date of Patent: March 5, 1996
    Assignee: Kabushiki Kaisha Kobe Seiko Sho
    Inventors: Hidetoshi Nishimoto, Yasuaki Sugizaki, Kenji Umei, Hiroshi Satoh, Yoshinori Terada, Tatsuya Yasunaga, Takenori Nakayama, Yasunori Wada, Keiji Ueda
  • Patent number: 5437835
    Abstract: A corrosion resistant Ti based alloy comprising:Cr: 0.005-2.0 wt %, and further comprising one or more of elements selected from:Ni: 0.005-2.0 wt %, Pd: 0.005-2.0 wt %, Ru: 0.005-2.0 wt %, Pt: 0.005-2.0 wt %, Os: 0.005-2.0 wt %, Ir: 0.005-2.0 wt %, Rh: 0.005-2.0 wt %, andthe balance of Ti and inevitable impurities.Cr may be replaced with one or more of 0.005-1.5 wt % of Cu and 0.005-1.5 wt % of Si, or 0.005-2.0 wt % of Al. The corrosion resistant Ti based alloy has excellent corrosion resistance also in a non-oxidative atmosphere and also has an excellent crevice corrosion resistance.
    Type: Grant
    Filed: January 26, 1994
    Date of Patent: August 1, 1995
    Assignee: Kabushiki Kaisha Kobe Seiko Sho
    Inventors: Yasuaki Sugizaki, Keiji Ueda, Hiroshi Satoh, Hidetoshi Nishimoto, Tatsuya Yasunaga, Takashi Yashiki
  • Patent number: 5316722
    Abstract: A corrosion resistant Ti based alloy comprising:Cr: 0.005-2.0 wt %, and furthercomprising one or more of elements selected from:______________________________________ Ni: 0.005-2.0 wt %, Pd: 0.005-2.0 wt %, Ru: 0.005-2.0 wt %, Pt: 0.005-2.0 wt %, Os: 0.005-2.0 wt %, Ir: 0.005-2.0 wt %, Rh: 0.005-2.0 wt %, and ______________________________________the balance of Ti and inevitable impurities.Cr may be replaced with one or more of 0.005-1.5 wt % of Cu and 0.005-1.5 wt % of Si, or 0.005-2.0 wt % of Al. The corrosion resistant Ti based alloy has excellent corrosion resistance also in a non-oxidative atmosphere and also has an excellent crevice corrosion resistance.
    Type: Grant
    Filed: July 9, 1992
    Date of Patent: May 31, 1994
    Assignee: Kabushiki Kaisha Kobe Seiko Sho
    Inventors: Yasuaki Sugizaki, Keiji Ueda, Hiroshi Satoh, Hidetoshi Nishimoto, Tatsuya Yasunaga, Takashi Yashiki